Patent application number | Description | Published |
20080300020 | WIRELESS COMMUNICATION SYSTEM, SIM CARD, MOBILE COMMUNICATION TERMINAL, AND DATA GUARANTEEING METHOD - The loss of data stored in a secure memory card, such as a SIM card, due to the physical destruction thereof is prevented. A host unit performs card authentication of a memory card, and transmits update data for the memory card by security communication to update data when the result of the authentication is OK. Then, the host unit outputs a request for mirror-updating the card data to a base station server. When an access is permitted, the card data is transmitted to the base station server via the host unit to mirror-update the card data. When the mirror-updating of the card data is completed, the base station server returns a completion confirmation to the host unit, so that a data backup process is completed. By thus causing the base station server to mirror-update the data in the memory card, the loss of the stored data is prevented. | 12-04-2008 |
20100025480 | IC CARD AND IC CARD SOCKET - A technique for an IC capable of achieving the large expandability of the memory capacity, a memory capacity and cost burden in accordance with the requirements of users is provided. The IC card of the present invention is a flash memory card | 02-04-2010 |
20100072284 | SEMICONDUCTOR DEVICE AND ADAPTOR FOR THE SAME - Connector terminals are arranged at the center of a thin memory card | 03-25-2010 |
20110269268 | SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME - The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at. | 11-03-2011 |
Patent application number | Description | Published |
20080257967 | IC card module - To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another. | 10-23-2008 |
20080272197 | MEMORY CARD AND SEMICONDUCTOR DEVICE - An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface. | 11-06-2008 |
20080283619 | IC CARD - An IC card is prevented from falling off readily an electronic device while maintaining the mechanical strength of the IC card. A recess for preventing a memory card from falling off an electronic device is provided at the side of one side of a principal surface of a cap of the memory card which is configured by fitting a memory body in a recess formed on a parts mounting surface of the cap. The bottom of the recess is terminated in the middle of the thickness of the cap. This construction makes it possible to prevent the memory card from falling off readily an electronic device while maintaining the mechanical strength of the memory card. | 11-20-2008 |
20090283885 | Semiconductor Device and a Method of Manufacturing the Same - On an adapter mounting portion | 11-19-2009 |
20110227234 | MULTI-FUNCTION CARD DEVICE - A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes. The security process by a security controller independent interface can also be guaranteed. | 09-22-2011 |
Patent application number | Description | Published |
20130075911 | Semiconductor Device Having Electrode/Film Opening Edge Spacing Smaller Than Bonding Pad/Electrode Edge Spacing - A semiconductor device has a conductive member coupled to the surface of a bonding pad exposed from an opening formed in a passivation film. A second planar distance between a first end of an electrode layer and a first end of a bonding pad is greater than a first planar distance between the first end of the electrode layer and a first end of an opening. Since the second planar distance between the first end of the electrode layer and the first end of the bonding pad is long, even when a coupled position of wire is deviated to the first end side of the electrode layer, stress caused by coupling of the wire to a stepped portion of the electrode layer can be prevented from being transmitted to the first end portion of the bonding pad. | 03-28-2013 |
20140080260 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - To provide a semiconductor device having an improved quality. The semiconductor device of the invention has a tape substrate having a semiconductor chip thereon, a plurality of land pads placed around the semiconductor chip, a plurality of wires for electrically coupling the electrode pad of the semiconductor chip to the land pad, and a plurality of terminal portions provided on the lower surface of the tape substrate. An average distance between local peaks of the surface roughness of a first region between the land pad of the tape substrate and the semiconductor chip is smaller than an average distance of local peaks of the surface roughness of a second region between the land pad of the tape substrate and the first region. | 03-20-2014 |
20140353822 | SEMICONDUCTOR DEVICE - Reliability of a semiconductor device is improved. A semiconductor device has a base material comprised of insulating material having a through hole, a terminal formed on a lower surface of the base material, and a semiconductor chip mounted on an upper surface of the base material in a face-up manner. Further, the semiconductor device has a conductive member such as a wire, which electrically connects a pad of the semiconductor chip with an exposed surface of the terminal which is exposed from the through hole of the base material, and has a sealing body for sealing the conductive member, inside of the through hole of the base material, and the semiconductor chip. An anchor means is provided in a region of the exposed surface of the terminal which is exposed from the through hole of the base material except for a joint portion joined with the conductive member such as the wire. | 12-04-2014 |