Patent application number | Description | Published |
20090004465 | Metal Film Formation Method of Metal Film - The present invention provides a metal film formed by applying an electroless plating catalyst or its precursor to a polymer layer on a base plate having a surface roughness of 500 nm or less and then carrying out electroless plating, the polymer layer containing a polymer which has a functional group capable of interacting with the electroless plating catalyst or its precursor and is chemically bonded directly to the base plate, wherein the adhesion strength between the base plate and the metal film is 0.2 kN/m or more. | 01-01-2009 |
20090022885 | METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME - The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1×10 | 01-22-2009 |
20090214876 | METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE - A process for producing a metal film-coated material, the process including: (a1) forming, on a substrate, a polymer layer formed from a polymer which has a functional group capable of interacting with a plating catalyst or a precursor thereof, and is directly chemically bonded to the substrate; (a2) providing a plating catalyst or a precursor thereof to the polymer layer; and (a3) performing plating with respect to the plating catalyst or a precursor thereof. The polymer layer satisfies all of the following requirements (1) to (4): (1) the saturated water absorption coefficient of the polymer layer as measured in an environment of temperature of 25° C. and relative humidity of 50% is 0.01 to 10% by mass; (2) the saturated water absorption coefficient of the polymer layer as measured in an environment of temperature of 25° C. and relative humidity of 95% is 0.05 to 20% by mass; (3) the water absorption coefficient of the polymer layer as measured after 1 hour of immersion in boiling water at 100° C. is 0.1 to 30% by mass; and (4) the surface contact angle of the polymer layer as measured after dropping 5 μL of distilled water thereonto and leaving to stand for 15 seconds in an environment of temperature of 25° C. and relative humidity of 50% is 50 to 150 degrees. | 08-27-2009 |
20090266583 | PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE - The invention provides a photosensitive resin composition comprising: a polymer comprising a polymerizable group and a functional group that interacts with a plating catalyst or a precursor thereof so as to form a coordination bond; and at least one selected from the group consisting of a synthetic rubber, an epoxy acrylate monomer, and a polymerizable monomer having a benzyl alcohol group; a laminate; a method of producing a metal plated material; a metal plated material; a method of producing a metal pattern material; a metal pattern material; and a wiring substrate. | 10-29-2009 |
20090269561 | METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL - A method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, at least one of the polymer or the monomer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer. | 10-29-2009 |
20100080964 | COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL - A composition including a polymer, the polymer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, a radical polymerizable group, and an ionic polar group; a method of producing a metal pattern material using the same: and a metal pattern material produced by the method. | 04-01-2010 |
20100247880 | NOVEL COPOLYMER, NOVEL COPOLYMER-CONTAINING COMPOSITION, LAMINATE BODY, METHOD OF PRODUCING METAL FILM-COATED MATERIAL, METAL FILM-COATED MATERIAL, METHOD OF PRODUCING METALLIC PATTERN-BEARING MATERIAL AND METALLIC PATTERN-BEARING MATERIAL - There is provided a polymer containing a unit represented by the following Formula (1), and a unit represented by following Formula (2). In Formula (1) and Formula (2), R | 09-30-2010 |
20110088934 | METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME - The present invention provides a metal pattern formed on a substrate. The metal pattern is constructed in (I) forming on a substrate a polymer layer in which a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof is chemically bonded directly to the substrate in a pattern form, (II) adding the electroless plating catalyst or precursor thereof to the polymer layer, and (III) forming a metal layer in the pattern form by electroless plating. | 04-21-2011 |
20110104454 | COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL - The present invention provide a composition for forming a layer to be plated, including a solution in which from 1% by mass to 20% by mass of a polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group, and a water-insoluble photopolymerization initiator are dissolved in a mixed solvent comprising from 20% by mass to 99% by mass of a water-soluble flammable liquid and water; a method of producing a metal pattern material using the composition for forming a layer to be plated; and a metal pattern material produced by the method. | 05-05-2011 |
20110183078 | METHOD OF PRODUCING METAL PLATED MATERIAL - The invention provides a method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, and with a compound having a non-dissociative functional group and a reactive group, the non-dissociative functional group being capable of interacting with a plating catalyst or a precursor thereof, and at least one of the polymer or the monomer having a functional group that reacts with the reactive group in the compound; forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer. | 07-28-2011 |