Patent application number | Description | Published |
20080286903 | Semiconductor device packaged into chip size and manufacturing method thereof - A semiconductor device includes a semiconductor substrate having an integrated circuit and at least one connection pad, and at least one external connection electrode electrically connected with the connection pad. A first sealing material is provided on the semiconductor substrate around the external connection electrode, each impurity concentration of an Na ion, a K ion, a Ca ion and Cl ion contained in the first sealing material being not greater than 10 ppm. A second sealing material is provided on at least one of a lower surface and a peripheral side surface of the semiconductor substrate, a total impurity concentration of an Na ion, a K ion, a Ca ion and a Cl ion contained in the second sealing material being not smaller than 100 ppm. | 11-20-2008 |
20090065926 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a base plate made of a material including at least a thermosetting resin, and having an opening, a vertical conductor filled and provided in the opening of the base plate, at least one semiconductor construct having a semiconductor substrate and a plurality of external connection electrodes provided on one side of the semiconductor substrate, and an insulating layer secured to and provided on a periphery of the semiconductor construct. The insulating layer is secured to the base plate, and the external connection electrodes of the semiconductor construct are bonded to the vertical conductor. | 03-12-2009 |
20090079072 | Semiconductor device having low dielectric insulating film and manufacturing method of the same - A semiconductor device includes a semiconductor substrate having an integrated circuit. A low dielectric film wiring line laminated structure portion is provided on the semiconductor substrate except a peripheral portion thereof, and is constituted by low dielectric films and wiring lines. The low dielectric film has a relative dielectric constant of 3.0 or lower and a glass transition temperature of 400° C. or higher. An insulating film is formed on the laminated structure portion. A connection pad portion is arranged on the insulating film and connected to a connection pad portion of an uppermost wiring line of the laminated structure portion. A bump electrode is provided on the connection pad portion. A sealing film is provided on the insulating film which surrounds the pump electrode and on the peripheral portion of the semiconductor substrate. The side surfaces of the laminated structure portion are covered with the insulating film or the sealing film. | 03-26-2009 |
20090079073 | Semiconductor device having low dielectric insulating film and manufacturing method of the same - A semiconductor device includes a semiconductor substrate on which a structure portion is provided except a peripheral portion thereof, and has a laminated structure including low dielectric films and wiring lines, the low dielectric films having a relative dielectric constant of 3.0 or lower and a glass transition temperature of 400° C. or higher. An insulating film is formed on the structure portion. A connection pad portion is arranged on the insulating film and connected to an uppermost wiring line of the laminated structure portion. A bump electrode is provided on the connection pad portion. A sealing film made of an organic resin is provided on a part of the insulating film which surrounds the pump electrode. Side surfaces of the laminated structure portion are covered with the insulating film and/or the sealing film. | 03-26-2009 |
20090243097 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CONSTANT FILM AND MANUFACTURING METHOD THEREOF - A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks. | 10-01-2009 |
20100019383 | METHOD OF FORMING WIRING ON A PLURALITY OF SEMICONDUCTOR DEVICES FROM A SINGLE METAL PLATE, AND A SEMICONDUCTOR CONSTRUCTION ASSEMBLY FORMED BY THE METHOD - In this manufacturing method of a semiconductor device, a metal plate having a plurality of projection electrodes in each of a plurality of semiconductor device formation areas is prepared. Next, the projection electrodes of each of the semiconductor formation areas are aligned corresponding to external connection electrodes of each semiconductor construction, and each semiconductor construction is separately arranged on the projection electrodes in the semiconductor device formation areas. Next, an insulating layer formation sheet is arranged on the metal plate, and the metal plate and the insulating layer formation sheet are joined by heat pressing. Then, the metal plate is patterned and a plurality of upper layer wirings that connect to the projection electrodes is formed. | 01-28-2010 |
20110001238 | SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring. | 01-06-2011 |
20110291212 | IMAGING APPARATUS HAVING PHOTOSENSOR AND MANUFACTURING METHOD OF THE SAME - A photosensor comprises a photoelectric conversion device region and a connection pad on the lower surface of a semiconductor substrate, and also comprises a wiring line connected to the connection pad via insulating film under the semiconductor substrate, and a columnar electrode as an external connection electrode connected to the wiring line. As a result, as compared with the case where the photoelectric conversion device region and the connection pad connected to the photoelectric conversion device region are formed on the upper surface of the semiconductor substrate, a piercing electrode for connecting the connection pad and the wiring line does not have to be formed in the semiconductor substrate. Thus, the number of steps can be smaller, and a fabrication process can be less restricted. | 12-01-2011 |
20130320526 | SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring. | 12-05-2013 |
20140073090 | SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC INSULATING FILM AND MANUFACTURING METHOD OF THE SAME - A semiconductor device includes a semiconductor substrate on which a structure portion is provided except a peripheral portion thereof, and has a laminated structure including low dielectric films and wiring lines, the low dielectric films having a relative dielectric constant of 3.0 or lower and a glass transition temperature of 400° C. or higher. An insulating film is formed on the structure portion. A connection pad portion is arranged on the insulating film and connected to an uppermost wiring line of the laminated structure portion. A bump electrode is provided on the connection pad portion. A sealing film made of an organic resin is provided on a part of the insulating film which surrounds the bump electrode. Side surfaces of the laminated structure portion are covered with the insulating film and/or the sealing film. | 03-13-2014 |
20140239511 | SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring. | 08-28-2014 |
Patent application number | Description | Published |
20090270631 | Therapeutic agent for diabetes - The present invention provides an agent for the prophylaxis or treatment of diabetes, which is associated with a fewer side effects such as body weight gain, adipocyte accumulation, cardiac hypertrophy and the like, and which contains a compound represented by the formula: wherein each symbol is as defined in the specification, or a salt thereof or a prodrug thereof. | 10-29-2009 |
20100003057 | TONER CARTRIDGE AND DEVELOPING DEVICE AND IMAGE FORMING APPARATUS USING THE SAME - An image forming apparatus includes a photoreceptor drum, a charger, an exposure device, a developing device, a toner cartridge, a transfer device and a fusing device. The toner cartridge includes a toner container, a toner discharge port, a toner agitator, a toner discharger having a toner conveyor. The toner discharger includes a toner discharger rotary shaft for supporting toner conveyor portion, and the toner discharger rotary shaft is formed to be smaller in diameter as it goes farther in its axial direction from the toner discharge port. | 01-07-2010 |
20100041892 | Therapeutic agent for diabetes - The present invention provides an agent for the prophylaxis or treatment of diabetes, which is associated with a fewer side effects such as body weight gain, adipocyte accumulation, cardiac hypertrophy and the like, and which contains a compound represented by the formula: wherein each symbol is as defined in the specification, or a salt thereof or a prodrug thereof. | 02-18-2010 |
Patent application number | Description | Published |
20090067884 | TONER SUPPLIER, DEVELOPMENT UNIT, AND IMAGE FORMING APPARATUS - A toner supplier according to the present invention includes a toner stirrer. The toner stirrer includes a shaft, an auxiliary member, and a fixture. The melting point of the auxiliary member is higher than the melting points of the shaft and fixture. The shaft and fixture are welded to each other with the auxiliary member interposed between them. | 03-12-2009 |
20090129824 | TONER CARRYING DEVICE AND IMAGE FORMING APPARATUS - A toner carrying device includes a flexible sheet, and a sheet moving mechanism for allowing the flexible sheet to move back and forth by pulling the flexible sheet. In the flexible sheet, a toner passage hole for leaving a first opening section of a toner carrying pipe to open is provided. In a case where the toner passage hole is divided into first through three areas in such a manner that (i) the first area is provided on a side of one end of the flexible sheet in a direction orthogonal to a moving direction of the flexible sheet; (ii) the second area is provided on a side of the other end of the flexible sheet in the direction orthogonal to the moving direction; and (iii) the third area is provided between the first area and the second area, the third area extends broader in the moving direction than respective of the first and second areas. This allows the flexible sheet partially having the toner passage hole in its area to move smoothly. | 05-21-2009 |
20090162107 | TONER CARTRIDGE AND IMAGE FORMING APPARATUS - A toner cartridge has a toner storage chamber, a discharge outlet, a conveying screw, and a blocking wall. The discharge outlet serves to send out toner stored in the toner storage chamber, and the conveying screw serves to convey the toner stored in the toner storage chamber. Further, before the toner cartridge mounted into an image forming apparatus, the blocking wall is located in a space between a toner area, which is an area in the toner storage chamber where the toner exists, and the discharge outlet, thereby putting the space in a blocked state. The toner cartridge further includes a driving mechanism for, when the toner cartridge has been mounted into the image forming apparatus, driving the conveying screw by power transmitted from the image forming apparatus, so as to cancel the blocked state. | 06-25-2009 |
20090257785 | TONER CARTRIDGE AND DEVELOPING DEVICE AND IMAGE FORMING APPARATUS USING THE SAME - An image forming apparatus includes a photoreceptor drum, a charger, an exposure device, a developing device, a toner cartridge for supplying toner to the developing device, a transfer device and a fusing device. The toner cartridge includes a toner container, a toner discharge port, a toner agitator, a toner discharger having a toner conveyor, a toner discharger partition that separates the toner container into compartments on the toner agitator side and on the toner discharger side. The toner conveyor is constructed such that its screw pitch becomes greater as it becomes more distant from the toner discharge port along the axial direction of the rotational axis of the toner discharger. | 10-15-2009 |