Patent application number | Description | Published |
20110026510 | Method for Enabling Communication between a User Equipment and an IMS Gateway - A Femto base station ( | 02-03-2011 |
20110035442 | Adaption of Metadata Based on Network Conditions - In methods and arrangements for adapting metadata depending on conditions in a network or at user equipment ( | 02-10-2011 |
20110161478 | SOCIAL WEB OF OBJECTS - According to exemplary embodiments, networked object management software, devices, systems and methods are described which use social mapping principles to streamline interactions between users and their networked objects, as well as between the networked objects themselves. Friendship relationships are established, by a network management system, between a plurality of the networked objects, each of the plurality of networked objects being associated with a use. When the network management system receives a task request, it can then assign the requested task to one of the plurality of networked objects which has a capability to perform the requested task and which also has an established friendship relationship with the user. | 06-30-2011 |
20110188508 | Gateway Apparatus, Authentication Server, Control Method Thereof and Computer Program - One aspect of the present invention will provide a gateway apparatus being able to communicate with a user terminal and provide the user terminal with a GBA authentication between the gateway apparatus and an authentication server, comprising, a receiving unit operable to receive a HTTP request addressed to a network address of the gateway apparatus from the user terminal, a requesting unit operable to request an GBA authentication to the authentication server according to the reception of the HTTP request, and a transmission unit operable to transmit the HTTP request, after the GBA authentication, to the authentication server using a network address of the authentication server preliminarily received from the authentication server. | 08-04-2011 |
20110246624 | Service Node, Control Method Thereof, User Node, and Control Method Thereof - There is provided a service node that is capable of serving a first user node in a first network including a control node. The first network is capable of communicating with a second network including a second user node. The service node comprises: a request receiving unit that receives a first user identity that identifies the first user node and a second user identity that identifies the second user node; a determining unit that determines whether a received message includes the first user identity as a destination, or the message includes auxiliary information that corresponds to the first user identity; and a modifying unit that modifies the destination of the message to the second user identity and modifies the source of the message to the first user identity in accordance with the determination result by the determining unit. | 10-06-2011 |
20120117192 | Information Processing System and Method Providing a Remote Access - An information processing system for offering a remote access from a device to a virtual service provided in a local network is provided. The virtual service invokes native services provisioned by a service provider. The system comprising: a management unit managing service information specifying a shortcut component of the service: an obtaining unit obtaining a request for the virtual service from the device; a receiving unit receiving the service information from the management unit; a specification unit specifying a shortcut component for the requested virtual service based on the received service information; an invoking unit executing the specified shortcut component by invoking native services to the service provider, and transferring the other component of the requested virtual service to the local network; a combination unit combining results; and a response unit responding the combined result to the device. | 05-10-2012 |
20120289178 | FEMTO BASE STATION, ENERGY-SAVING COORDINATION NODE, WIRELESS COMMUNICATION SYSTEM AND COMPUTER PROGRAM - A Femto base station which is arranged to connect to a wireless communication network and to generate a first cell for providing a wireless communication service to at least one user equipment existing within a coverage area of the first cell, comprising a transceiver comprising a transmitter and a receiver for the wireless communication with the user equipment and a controller, wherein the controller determines whether the Femto base station has entered an energy-saving mode or not, the controller disables the operation of the transmitter when it is determined that the base station has entered the energy-saving mode, and when the receiver detects a data transmission from the user equipment to a macro base station after disabling the operation of the transmitter, the controller reconfigures the transmitter. The macro base station generates a second cell with a broader coverage than the first cell and including the first cell. | 11-15-2012 |
20130023257 | System and Method for Providing Configurations of Local Network - A system for providing a user terminal with configurations of a local network is provided. The system includes an obtaining unit configured to obtain the configurations of the local network and a telephone number corresponding to the local network, a storage unit configured to store the obtained configurations and the obtained telephone number such that the obtained configurations and the obtained telephone number are associated with each other, a receiving unit configured to receive a request for the configurations from the user terminal, the request comprising the telephone number corresponding to the local network, a retrieving unit configured to retrieve the configurations associated with the received telephone number from the storage unit, and a response unit configured to respond the retrieved configurations to the user terminal. | 01-24-2013 |
Patent application number | Description | Published |
20100004839 | DRIVING ASSISTING APPARATUS AND DRIVING ASSISTING METHOD - The present invention aims at providing a driving assisting apparatus and driving assisting method which can predict with a high accuracy a state of a traffic light when a vehicle enters an intersection. The driving assisting apparatus for predicting the state of the traffic light when the vehicle enters the intersection comprises vehicle speed change predicting means for predicting a vehicle speed change of the vehicle in front of the intersection, and traffic light state predicting means for predicting the state of the traffic light when the vehicle enters the intersection according to the vehicle speed change predicted by the vehicle speed change predicting means, while the vehicle speed change predicting means predicts the vehicle speed change according to information stored in storage means in association with a characteristic of a driver concerning the past vehicle speed change in front of the intersection with running environments or changes a predicting method depending on whether or not the vehicle is positioned in front of a predetermined area set in front of the intersection. | 01-07-2010 |
20110029195 | DRIVE ASSISTANCE DEVICE - Disclosed is a drive assistance device capable of performing proper drive assistance by reducing unnecessary drive assistance operations. The drive assistance device performs drive assistance relative to stopping of a vehicle at an intersection. When the vehicle approaches the intersection where an arrow lamp device is installed at a traffic signal, if the necessity of drive assistance for stimulating a driver to stop at the signal according to lighting of the arrow lamp device differs depending on a route of the vehicle, the start timing of the drive assistance operation is delayed and drive assistance is executed. Therefore, an unnecessary drive assistance operation can be suppressed. | 02-03-2011 |
20150073620 | DRIVING ASSISTANCE DEVICE - A driving assistance device including: a storage portion, configured to store a vehicle speed, an acceleration and deceleration tendency at the same place on a travel route respectively for a plurality of times during a time in which a driver performs acceleration and deceleration operations; a learning portion, configured to distinguish a plurality of object vehicle speeds from a plurality of vehicle speeds at the same place stored in the storage portion, and learn the vehicle speeds at the same place based on the plurality of vehicle speeds with small dispersion when the dispersion of the plurality of vehicle speeds identified as object is small; and a driving assistance portion, configured to perform driving assistance based on the vehicle speed learned by the learning portion, when the vehicle travels at a place where the vehicle speed is learned after learning of the learning portion. | 03-12-2015 |
20150094928 | DRIVING ASSISTANCE DEVICE - A driving assistance device that performs driving assistance based on a learning vehicle speed, including: a storage portion that stores vehicle speeds in relation to each place on a travel route for multiple times by using a vehicle speed acquired when a driver performs accelerating and decelerating operations to make a vehicle travel, a first learning portion that learns a first learning vehicle speed at a place where a dispersion of a plurality of vehicle speeds is less than a threshold value when the place exists, a second learning portion that learns a second learning vehicle speed at a place within a set range before the learned place, and a travel control portion that performs travel control according to a current place of the travelling vehicle, the first learning vehicle speed and the second learning vehicle speed. | 04-02-2015 |
20150106007 | DRIVING SUPPORT APPARATUS - A driving support apparatus | 04-16-2015 |
Patent application number | Description | Published |
20080269606 | Method of Displaying Elastic Image and Diagnostic Ultrasound System - To carry out objective or definitive diagnosis on the basis of an elastic image regardless of experience and proficiency, a method of displaying an elastic image includes the steps of measuring ultrasound cross-section data of a cross-section region of a subject by applying pressuring to the subject, determining a physical value correlating with the elasticity of tissue in the cross-section region on the basis of the ultrasound cross-section data, generating an elastic image of the cross-section region on the basis of the physical value and displaying the elastic image on a display device, determine compression state information relating to the compression state of the cross-section region on the basis of the pressure applied to the subject, and displaying the compression state information together with the elastic image on the display device. | 10-30-2008 |
20090149750 | Ultrasonic Diagnostic Apparatus - The present invention provides an ultrasonic diagnostic apparatus that is capable of displaying an elastic image, enabling an accurate and easy identification of tissue characteristics of a diagnostic part. Elasticity data regarding a test object is obtained based on a received signal of an ultrasonic probe, and an elastic image representing a distribution of the elasticity data of the test object is generated. A display mode setting means sets a display mode of the elastic image in such a manner that a different tissue can be identified based on a value of the elasticity data. In this case, the display mode is differentiated by the value of the elasticity data within one tissue. With this configuration, the tissue characteristics of the diagnostic part are identified by the elasticity data, and displayed in a different display mode, thereby displaying an elastic image identifiable accurately and easily. | 06-11-2009 |
20090177084 | Ultrasonic Diagnostic Apparatus - A compressed state evaluation unit | 07-09-2009 |
20100016724 | ULTRASONOGRAPHIC DEVICE - An ultrasonic diagnostic apparatus is characterized by including a displacement/strain calculation unit | 01-21-2010 |
20100324421 | ULTRASONIC IMAGING APPARATUS - An ultrasonic imaging apparatus according to the present invention includes an ultrasonic probe ( | 12-23-2010 |
20120016238 | METHOD OF DISPLAYING ELASTIC IMAGE AND DIAGNOSTIC ULTRASOUND SYSTEM - To carry out objective or definitive diagnosis on the basis of an elastic image regardless of experience and proficiency, a method of displaying an elastic image includes the steps of measuring ultrasound cross-section data of a cross-section region of a subject by applying pressuring to the subject, determining a physical value correlating with the elasticity of tissue in the cross-section region on the basis of the ultrasound cross-section data, generating an elastic image of the cross-section region on the basis of the physical value and displaying the elastic image on a display device, determine compression state information relating to the compression state of the cross-section region on the basis of the pressure applied to the subject, and displaying the compression state information together with the elastic image on the display device. | 01-19-2012 |
Patent application number | Description | Published |
20100165420 | IMAGE PROCESSING APPRATUS, IMAGE PROCESSING METHOD AND COMPUTER PROGRAM - Conventionally, in the case where multiple readings of a document are carried out in order to generate an output image, image processing to the super-resolution image has been started after waiting for completion of the multiple readings necessary for giving target resolution to the image after super-resolution processing. Therefore, a lot of times have been required for processing. In an image processing apparatus including: a document reading component configured to read a plurality of image data each having a different phase from a document by single scanning; a super-resolution processing component configured to generate super-resolution image data by using the plurality sheets of image data each having a different phase, so as to have resolution higher than those of the plurality of image data; and an image processing component configured to carry out multiple image processing to the super-resolution image data. | 07-01-2010 |
20120105884 | INFORMATION PROCESSING APPARATUS, CONTROL METHOD OF INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM - An image processing apparatus of the present invention is provided with input means for inputting a job, selection means for selecting circuit configuration data corresponding to a type of the job input by the input means from a plurality of circuit configuration data stored in the storage means, reconfiguration means for reconfiguring the circuitry of the data processing means using the circuit configuration data selected by the selection means, and control means for causing the data processing means whose circuitry has been reconfigured by the reconfiguration means to execute the job input by the input means. | 05-03-2012 |
20120287446 | PRINTING APPARATUS, CONTROL METHOD FOR PRINTING APPARATUS, AND STORAGE MEDIUM - The present invention provides technology according to which, in the case of changing a print setting and performing reprinting, a printing apparatus causes an information processing apparatus to regenerate print data via a network as necessary depending on whether processing in accordance with a changed print setting can be executed by the printing apparatus. | 11-15-2012 |
20140126809 | IMAGE PROCESSING APPARATUS CAPABLE OF DETERMINING COLOR AMOUNT, IMAGE PROCESSING METHOD, AND PROGRAM - When a printing fee is changed, if a printing fee is changed to one for a color amount that is smaller than an actual color amount of an input image, an image processing apparatus automatically performs image processing in order to maximize the color amount at the selected printing fee and prints an image processing result. | 05-08-2014 |
20150229808 | SYSTEM, AND METHOD FOR CONTROLLING THE SYSTEM - An image forming apparatus, which forms an image on paper and is connected to be communicable with an image capturing apparatus that captures a person existing around the image forming apparatus, includes a receiving unit configured to receive a job, a generation unit configured to generate information representing a user who has input the job received by the receiving unit, and a transmission unit configured to transmit the information representing the user, which has been generated by the generation unit, to the image capturing apparatus. | 08-13-2015 |
Patent application number | Description | Published |
20090004227 | Peroral Vaccine Carrier System - The present invention provides a system in which a recombinant plant expressing a target peptide is orally administered to thereby achieve exertion of the function of the peptide, along with the genetically recombinant plant, and the present invention relates to a carrier system for oral administration of a target peptide by oral administration of a plant (potato) that expresses a target peptide by expressing for example a fused gene obtained by fusing the LRE1 gene coding for the immunogenic peptide LRE1 derived from the | 01-01-2009 |
20110138497 | Non-Diffusing Plant Virus Vector - The present invention is to provide a novel non-diffusing plant virus vector wherein virus vector infection and proliferation are possible only in a recombinant plant transfected with a gene necessary for viral proliferation, thereby enabling avoidance of unintended diffusion of a recombinant virus, a selective and specific expression system therefor, and a method of expression thereof which comprises combining a non-diffusing virus vector lacking a gene involved in intercellular movement of a cucumber mosaic virus (CMV) genome and a transgenic plant transfected with the lacked gene involved in intercellular movement for the non-diffusing virus vector to establish infection and proliferation selectively and specifically in the transgenic plant. | 06-09-2011 |
20110173720 | Method for Modifying Sugar Chain Structure in Plant, and Plant Produced by the Method - The present invention provides a method for reducing or inhibiting fucose modification to a N-linked sugar chain in a plant, and a transgenic plant, or the like, in which the fucose modification has been reduced or inhibited. Transcription or translation of a gene coding for an enzyme involved in synthesis of sugar nucleotide GDP-fucose is inhibited by post-transcriptional gene silencing (PTGS), virus-induced gene silencing (VIGS) or transcriptional gene silencing (TGS), and an amount of GDP-fucose in a plant cell is reduced, to reduce or inhibit fucose modification to a sugar chain including glycoprotein sugar chain, glycolipid sugar chain, oligosaccharide, polysaccharide, and the like, thereby enabling production of a glycoprotein, or the like, from which fucose modification, which may become an allergen, has been removed, and enabling clinical application of a medicinal glycoprotein produced with a plant. | 07-14-2011 |
20120115776 | ADIPONECTIN-CONTAINING EATING BEHAVIOR CONTROL AGENT FOR ORAL ADMINISTRATION - Disclosed is a technique that facilitates the oral ingestion of adiponectin in a large quantity and enables the expansion of the range of use applications of adiponectin. Specifically disclosed is an appetite control agent for oral administration, which comprises adiponectin as an active ingredient. Particularly, the appetite control agent comprises a transformant capable of expressing adiponectin. Also specifically disclosed is a food composition for controlling appetite, which comprises the appetite control agent. | 05-10-2012 |
Patent application number | Description | Published |
20110217501 | DICING DIE-BONDING FILM - A dicing die-bonding film with excellent peeling property when a diced semiconductor chip and its die-bonding film are, without deteriorating a holding force during dicing a semiconductor wafer even if it is thin. A dicing die-bonding film, comprising a dicing film having at least a pressure-sensitive adhesive layer formed on a supporting base material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the thickness of the pressure-sensitive adhesive layer is 5 to 80 μm, and when the dicing film is peeled off from the die-bonding film after dicing from the side of the die-bonding film to a part of the pressure-sensitive adhesive layer, the maximum value of a peeling force in the vicinity of the cut surface is 0.7 N/10 mm or less under the conditions of a temperature of 23° C., a peeling angle of 180°, and a peeling point moving rate of 10 mm/min. | 09-08-2011 |
20120003470 | ACTIVE ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE FOR RE-RELEASE AND DICING DIE-BONDING FILM - Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P3) and an oxazoline group-containing monomer (m3) to react with each other, and a polymer obtained by causing an oxazoline group-containing polymer (P4) and a carboxyl group-containing monomer (m2) to react with each other. | 01-05-2012 |
20120070960 | DICING DIE BOND FILM, METHOD OF MANUFACTURING DICING DIE BOND FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present invention aims to provide a dicing die bond film that is capable of suppressing peeling of the dicing die bond film from a dicing ring. The present invention provides a dicing die bond film in which the pressure-sensitive adhesive layer contains a polymer formed by performing an addition reaction on a specific acrylic polymer with a specific isocyanate compound, and a specific crosslinking agent, and the specific peeling adhesive power of a portion of the pressure-sensitive adhesive layer where the dicing ring is pasted is 1.0 N/20 mm tape width or more and 10.0 N/20 mm tape width or less, the tensile storage modulus at 23° C. of the portion where the dicing ring is pasted is 0.05 MPa or more and less than 0.4 MPa, and the die bond film is pasted to the pressure-sensitive adhesive layer after irradiation with an ultraviolet ray. | 03-22-2012 |
20120126379 | DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM - A semiconductor device having an electromagnetic wave shielding layer can be manufactured without decreasing productivity. The present invention provides a die bond film including an adhesive layer and an electromagnetic wave shielding layer made of a metal foil or a die bond film including an adhesive layer and an electromagnetic wave shielding layer formed by vapor deposition. | 05-24-2012 |
20120126380 | FILM FOR THE BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, DICING TAPE-INTEGRATED FILM FOR THE BACKSIDE OF SEMICONDUCTOR, METHOD OF MANUFACTURING FILM FOR THE BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE - An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer. | 05-24-2012 |
20120126381 | ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - An object of the present invention is to decrease the influence of an electromagnetic wave emitted from one semiconductor chip on other semiconductor chips in the same package, amounted substrate, adjacent devices, and the package. The present invention provides an adhesive film for a semiconductor device having an adhesive layer and an electromagnetic wave shielding layer, in which the attenuation of the electromagnetic wave that penetrates the adhesive film for a semiconductor device is 3 dB or more in at least a portion of the frequency range of 50 MHz to 20 GHz. | 05-24-2012 |
20120208009 | FILM FOR FORMING PROTECTIVE LAYER - The present invention aims to provide a film for forming a protective layer that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer while suppressing an increase in the number of steps in the manufacture of a semiconductor device. This object is achieved by a film for forming a protective layer on a bumped wafer in which a low dielectric material layer is formed, including a support base, an adhesive layer, and a thermosetting resin layer, laminated in this order, wherein the melt viscosity of the thermosetting resin layer is 1×10 | 08-16-2012 |
20120208350 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present invention aims to provide a method of manufacturing a semiconductor device that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer, while also suppressing an increase in the number of steps in the manufacturing process. This object is achieved by a method of manufacturing a semiconductor device including the steps of pasting a film for forming a protective layer in which a support base, an adhesive layer, and a thermosetting resin layer are laminated, in that order, onto a bumped wafer in which a low dielectric material layer is formed, with the thermosetting resin layer serving as a pasting surface, and further, peeling the support base and the adhesive layer from the thermosetting resin layer, forming a protective layer by thermally curing the thermosetting resin layer, and dicing the bumped wafer and the protective layer together. | 08-16-2012 |
20120295416 | ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE - An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm. | 11-22-2012 |
20120302042 | ADHESIVE COMPOSITION FOR PRODUCING SEMICONDUCTOR DEVICE AND ADHESIVE SHEET FOR PRODUCING SEMICONDUCTOR DEVICE - An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more. | 11-29-2012 |
20130157419 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The objective of the present invention is to provide a method of manufacturing a semiconductor device having less contamination of a semiconductor chip and good productivity. The present invention is a method of manufacturing a semiconductor device having a semiconductor chip, with the steps of preparing a plurality of semiconductor chips, preparing a resin sheet having a thermosetting resin layer, arranging the plurality of semiconductor chips on the thermosetting resin layer, arranging a cover film on the plurality of semiconductor chips, and embedding the plurality of semiconductor chips in the thermosetting resin layer by a pressure applied through the arranged cover film, in which the contact angle of the cover film to water is 90° or less. | 06-20-2013 |
20130183469 | RESIN SHEET FOR HOLLOW ENCAPSULATION AND PRODUCTION METHOD FOR THE SHEET, AND PRODUCTION METHOD FOR HOLLOW ELECTRONIC PART APPARATUS AND HOLLOW ELECTRONIC PART APPARATUS - A resin sheet is provided for hollow encapsulation excellent in productivity, and excellent in resin strength and heat resistance as well. The resin sheet for hollow encapsulation to be used for subjecting electronic parts mounted on an aggregate substrate to hollow encapsulation includes an epoxy resin composition containing the following components (A) to (D), in which the resin sheet for hollow encapsulation has, in one surface of a sheet main body, a plurality of cavities for storing the electronic parts to subject the parts to hollow encapsulation: (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler; and (D) a curing accelerator. | 07-18-2013 |
20130185934 | RESIN COMPOSITION SHEET FOR ENCAPSULATING ELECTRONIC PARTS AND METHOD OF PRODUCING ELECTRONIC PART APPARATUS USING THE SHEET - A resin composition sheet for encapsulating electronic parts and a method of producing an electronic part apparatus using the sheet are provided. The method includes: loading, on a substrate, a resin composition sheet for encapsulating electronic parts including a thermosetting resin composition containing an epoxy resin, a phenol resin, an inorganic filler, and a curing accelerator, having a lowest viscosity in a specific range, and a thickness in a specific range; heating the substrate in a chamber in a decompressed state to sag an end portion of the sheet until it is in contact with a surface of the substrate; and releasing a pressure in the chamber to cause the sheet to adhere onto the substrate due to a difference between a pressure in the space between the sheet and the substrate, and the pressure in the chamber after the release, followed by thermal curing. | 07-25-2013 |
20130217187 | FILM FOR FORMING PROTECTIVE LAYER - The present invention aims to provide a film for forming a protective layer that is capable of preventing cracks in a low dielectric material layer of a semiconductor wafer while suppressing an increase in the number of steps in the manufacture of a semiconductor device. This object is achieved by a film for forming a protective layer on a bumped wafer in which a low dielectric material layer is formed, including a support base, an adhesive layer, and a thermosetting resin layer, laminated in this order, wherein the melt viscosity of the thermosetting resin layer is 1×10 | 08-22-2013 |
20130273361 | Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Release and Dicing Die-Bonding Film - Provided is an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray. The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), in which the polymer (P) includes one of a polymer obtained by causing a carboxyl group-containing polymer (P | 10-17-2013 |
20130330910 | DICING DIE BOND FILM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present invention provides a dicing die bond film in which yielding and breaking of the dicing film are prevented and in which the die bond film can be suitably broken with a tensile force. In the dicing die bond film of the present invention, the tensile strength of the contact part in which the outer circumference of the push-up jig contacts the dicing film at 25° C. is 15 N or more and 80 N or less and the yield point elongation is 80% or more, the tensile strength of the wafer bonding part of the dicing film at 25° C. is 10 N or more and 70 N or less and the yield point elongation is 30% or more, [(the tensile strength of the contact part)−(the tensile strength of the wafer bonding part)] is 0 N or more and 60 N or less, and the breaking elongation rate of the die bond film at 25° C. is more than 40% and 500% or less. | 12-12-2013 |
20140000793 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140004635 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140004636 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140004637 | METHOD OF MANUFACTURING AN LED | 01-02-2014 |
20140004683 | METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT | 01-02-2014 |
20140042645 | RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING RESIN-SEALED TYPE SEMICONDUCTOR DEVICE - An electronic-component-sealing resin sheet capable of restraining the warp amount of a package obtained by use of the sheet, a resin-sealed type semiconductor device high in reliability, and a method for producing the device are provided. The present invention relates to a resin sheet for sealing an electronic component, wherein after the resin sheet is hot-pressed onto an iron nickel alloy plate containing 42% by weight of nickel and having a shape 90 mm square and a thickness of 0.15 mm to give a thickness 0.2 mm and the resultant hot-pressed unit is cured at 150° C., the unit exhibits a warp amount of 5 mm or less. | 02-13-2014 |
20140061955 | THERMOSETTING RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING RESIN-SEALED TYPE SEMICONDUCTOR DEVICE - A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components. | 03-06-2014 |
20140249269 | THERMALLY-DETACHABLE SHEET - In order to provide a thermally-detachable sheet that detaches at higher temperatures, this thermally-detachable sheet has a shear bond strength with respect to a silicon wafer of 0.25 kg/5×5 mm or larger, at a temperature of 200° C., after said temperature has been maintained for one minute, and a shear bond strength with respect to a silicon wafer of 0.25 kg/less than 5×5 mm at any temperature in a range of over 200° C. to not more than 500° C., after said temperature has been maintained for three minutes. | 09-04-2014 |