Patent application number | Description | Published |
20110102528 | COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND INKJET RECORDING METHOD - An embodiment of the composition contains any of compounds of the formula A-LG in which A represents any of residues of general formula (A-1) below and LG represents any of groups that are cleaved to generate acids of the formula A-H when acted on by an acid. The composition further contains at least one of a compound that generates an acid when exposed to actinic rays or radiation and a compound that generates an acid when heated. | 05-05-2011 |
20110318691 | RESIST COMPOSITION FOR SEMICONDUCTOR, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME - An embodiment of the composition contains any of compounds of general formula (I) below: | 12-29-2011 |
20110318693 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME - An embodiment of the composition contains a resin (P) containing a repeating unit (A) that is configured to decompose when exposed to actinic rays or radiation to thereby generate an acid. The repeating unit (A) contains a cation structure with a monocyclic or polycyclic heterocycle containing a nitrogen atom. | 12-29-2011 |
20120003590 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE SAME - An actinic ray-sensitive or radiation-sensitive resin composition containing a resin having (A) a repeating unit represented by a specific formula (I) and (B) a repeating unit capable of generating an acid upon irradiation with an actinic ray or radiation. | 01-05-2012 |
20120100481 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME - An actinic ray-sensitive or radiation-sensitive composition, including: (1) a low molecular compound having a molecular weight of 500 to 5,000 and containing (G) an acid-decomposable group; and (2) a compound capable of generating an acid of 305 Å | 04-26-2012 |
20140099572 | ACTINIC-RAY- OR RADIATION SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound (P) containing at least one phenolic hydroxyl group and at least one group with a phenolic hydroxyl group whose hydrogen atom is replaced by any of groups of general formula (1) below. | 04-10-2014 |
20140199617 | PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE - A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid and (B) a low molecular weight compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation and decomposing by an action of an acid to decrease a solubility of the low molecular weight compound (B) in an organic solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of developing the film with a developer containing an organic solvent after the exposing to form a negative pattern. | 07-17-2014 |
20140349223 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-OR RADIATION-SENSITIVE FILM THEREFROM, METHOD OF FORMING PATTERN, PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND COMPOUND - Provided is an actinic-ray- or radiation-sensitive resin composition including a compound that when exposed to actinic rays or radiation, generates any of acids of general formula (I) below. | 11-27-2014 |
20150118628 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM, METHOD OF FORMING PATTERN, PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (P) comprising any of repeating units (A) of general formula (I) below, each of which contains an ionic structural moiety that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid in a side chain of the resin. | 04-30-2015 |
Patent application number | Description | Published |
20090138729 | INFORMATION PROCESSING DEVICE, PROGRAM VERIFICATION METHOD, AND RECORDING MEDIUM - A first storage unit stores a plurality of security functions each defining a first protection attribute requiring a storage of a value of an argument for input/output of data. A second storage unit stores a program list describing a second protection attribute of a variable indicating a storage area of the data and an executing procedure of a predetermined process. An identifying unit identifies a third protection attribute of an actual argument for input/output of a security function based on the second protection attribute. When a judging unit judges not all of third protection attributes match with first protection attributes, an output unit outputs error information indicating a mismatch of the protection attributes. | 05-28-2009 |
20110107336 | Microprocessor - A microprocessor executes programs in a pipeline architecture that includes a task register management unit that switches a value of a task register to second register information that is used when a second task is executed after the execution of a first task is completed, if a switch instruction to the second task is issued when a plurality of units executes the first task, and a task manager that switches a value of a task identification information register to a second task identifier after the value is switched to the second register information, and grants each of the plurality of units permission to execute the second task. | 05-05-2011 |
20120237035 | KEY SCHEDULING DEVICE AND KEY SCHEDULING METHOD - According to one embodiment, in a key scheduling device, a non-linear transformation unit non-linearly transforms at least one of partial keys resulting from dividing an expanded key. A first linear transformation unit includes first and second circuits. The second circuit linearly transforms the partial key by directly using a transformation result from the non-linear transformation unit. A first storage stores the partial key linearly transformed by the first linear transformation unit. A second linear transformation unit linearly transforms, inversely to the first linear transformation unit, each of partial keys other than the partial key linearly transformed by the second circuit out of the partial keys stored in the first storage, and outputs inversely transformed partial keys. A second storage stores one of inputs to the second circuit. An outputting unit connects the respective inversely transformed partial keys and the input stored in the second storage to be output as a second key. | 09-20-2012 |
20130219408 | COMPUTER PROGRAM PRODUCT, AND INFORMATION PROCESSING APPARATUS AND METHOD - According to an embodiment, a computer program product includes a computer-readable medium including program, when executed by a computer, to have a plurality of modules run by the computer. The computer includes a memory having a shared area, which is an area accessible to only those modules which run cooperatively and storing therein execution module identifiers. Each of the modules includes a first operation configured to store, just prior to a switchover of operations to an other module that runs cooperatively, an identifier of the other module as the execution module identifier in the shared area; and a second operation configured to execute, when the execution module identifier stored in the shared area matches with an identifier of own module immediately after a switchover of operations from the other module, a function inside the own module. | 08-22-2013 |
Patent application number | Description | Published |
20110076615 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound that when exposed to actinic rays or radiation, generates any of acids of general formula (I) below, | 03-31-2011 |
20110189609 | ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE COMPOSITION - According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes an arylsulfonium salt that when exposed to actinic rays or radiation, generates an acid, the arylsulfonium salt containing at least one aryl ring on which there are a total of one or more electron donating groups, the acid generated upon exposure to actinic rays or radiation having a volume of 240 Å | 08-04-2011 |
20120082939 | ACTIVE LIGHT RAY SENSITIVE OR RADIOACTIVE RAY SENSITIVE RESIN COMPOSITION, AND ACTIVE LIGHT RAY SENSITIVE OR RADIOACTIVE RAY SENSITIVE FILM AND PATTERN FORMING METHOD USING THE SAME - An active light ray sensitive or radioactive ray sensitive resin composition which satisfies high sensitivity, high resolution, good pattern configuration, and good line edge roughness at the same time to a great extent, while having sufficiently good outgassing performance during exposure, and an active light ray sensitive or radioactive ray sensitive film formed by using the composition, and a pattern-forming method, are provided. | 04-05-2012 |
20140212797 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD EACH USING THE COMPOSITION, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND PRODUCTION METHOD OF RESIN - An actinic ray-sensitive or radiation-sensitive resin composition includes: (P) a resin that contains (A) a repeating unit capable of decomposing upon irradiation with an actinic ray or radiation to generate an acid in a side chain of the resin (P) and (C) a repeating unit represented by the following formula (I) as defined in the specification, wherein a polydispersity of the resin (P) is 1.20 or less. | 07-31-2014 |
20140272692 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM USING THE SAME, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE AND RESIN - There is provided an actinic ray-sensitive or radiation-sensitive composition comprising (P) a compound having a phenolic hydroxyl group and a group formed by substituting for the hydrogen atom in a phenolic hydroxyl group by a group represented by the specific formula, a resist film formed using the specific actinic ray-sensitive or radiation-sensitive composition, a pattern forming method containing steps of exposing and developing the resist film, a manufacturing method of an electronic device, containing the pattern forming method, and an electronic device manufactured by the specific manufacturing method of an electronic device. | 09-18-2014 |
20140342275 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, AND, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM AND PATTERN FORMING METHOD, EACH USING THE COMPOSITION - An actinic ray-sensitive or radiation-sensitive resin composition contains a compound (P) that contains at least one phenolic hydroxyl group and at least one group in which a hydrogen atom of a phenolic hydroxyl group has been substituted with a group represented by the following General Formula (1) (in the formula, M | 11-20-2014 |
20140349224 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THE SAME AND ELECTRONIC DEVICE - There is provided a pattern forming method comprising (1) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin containing an acid-decomposable repeating unit and being capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a compound capable of decomposing by the action of an acid to generate an acid, and (D) a solvent; (2) a step of exposing the film by using an actinic ray or radiation, and (4) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern. | 11-27-2014 |
20150086912 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD USING THE SAME, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising (P) a resin having a repeating unit (A) represented by the specific formula (I) capable of generating an acid on the side chain of the resin upon irradiation with an actinic ray or radiation, and a resist film formed with the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method comprising: exposing the resist film, and developing the exposed resist film, and a method for manufacturing a semiconductor device, containing the pattern forming method, and a semiconductor device manufactured by the manufacturing method of the semiconductor device. | 03-26-2015 |
20150185612 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE - There is provided an actinic ray-sensitive or radiation-sensitive resin composition comprising: (A) a resin having a repeating unit represented by the specific formula and a group capable of decomposing by an action of an acid to produce a polar group; and an ionic compound represented by the specific formula, and a resist film comprising the actinic ray-sensitive or radiation-sensitive resin composition. | 07-02-2015 |
Patent application number | Description | Published |
20090147490 | SUBSTRATE FOR WIRING, SEMICONDUCTOR DEVICE FOR STACKING USING THE SAME, AND STACKED SEMICONDUCTOR MODULE - In a stacked semiconductor module, a test covering connecting terminals is easily conducted and high reliability is achieved. | 06-11-2009 |
20100096739 | STACKED SEMICONDUCTOR MODULE - A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. The top surface of the first semiconductor substrate is provided with a first connection terminal and the bottom surface of the first semiconductor substrate is provided with an external connection terminal. A region of the bottom surface of the second semiconductor substrate lying opposite to the second semiconductor chip is provided with a second connection terminal. A conductive connecting member connects the first connection terminal to the second connection terminal. | 04-22-2010 |
20100148342 | STACKED SEMICONDUCTOR MODULE - A stacked semiconductor module is made by stacking a second semiconductor device having a second semiconductor chip mounted to the top surface of a second semiconductor substrate above the top surface of a first semiconductor device having a first semiconductor chip mounted to a first semiconductor substrate. The top surface of the first semiconductor substrate is provided with a first connection terminal and the bottom surface of the first semiconductor substrate is provided with an external connection terminal. A region of the bottom surface of the second semiconductor substrate lying opposite to the second semiconductor chip is provided with a second connection terminal. A conductive connecting member connects the first connection terminal to the second connection terminal. | 06-17-2010 |
20100295186 | SEMICONDUCTOR MODULE FOR STACKING AND STACKED SEMICONDUCTOR MODULE | 11-25-2010 |
20110156271 | SEMICONDUCTOR MODULE - A semiconductor module having a second semiconductor package | 06-30-2011 |
20120070917 | APPARATUS AND METHOD FOR MOUNTING SEMICONDUCTOR LIGHT EMITTING ELEMENT - When bump electrodes | 03-22-2012 |
20120161313 | SEMICONDUCTOR DEVICE, AND INSPECTION METHOD THEREOF - In a substrate for a stacking-type semiconductor device including a connection terminal provided for a connection with a semiconductor chip to be stacked and an external terminal connected to the connection terminal through a conductor provided in a substrate, connection terminals of a power supply, a ground and the like, which terminals have an identical node, are electrically continuous with each other. Thus, it is possible to facilitate an inspection of electrical continuity between each connection terminal and an external terminal corresponding to each connection terminal by minimum addition of inspecting terminals. Further, it is possible to improve reliability of a stacking-type semiconductor module. | 06-28-2012 |
20140103502 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first semiconductor chip held on a substrate and including an expanded portion expanding outward from a side surface of a body of the first semiconductor chip; a first wire connecting the expanded portion of the first semiconductor chip to the substrate; and a second wire connecting the body of the first semiconductor chip to the substrate. | 04-17-2014 |
20140103504 | SEMICONDUCTOR DEVICE - A first chip including electrodes is mounted above an expanded semiconductor chip formed by providing an expanded portion at an outer edge of a second chip including chips. The electrodes of the first chip are electrically connected to the electrodes of the second chip by conductive members. A re-distribution structure is formed from a top of the first chip outside a region for disposing the conductive members along a top of the expanded portion. Connection terminals are provided above the expanded portion, and electrically connected to ones of the electrodes of the first chip via the re-distribution structure. | 04-17-2014 |
20140103536 | SEMICONDUCTOR DEVICE - A semiconductor device includes: on an upper surface of a second semiconductor chip on a circuit board, a ring dam section formed at an outer circumference of a mounting region above which a first semiconductor chip is mounted; and an interconnect extending from the dam section to a center section of the first semiconductor chip or the second semiconductor chip in a region in which the first semiconductor chip faces the second semiconductor chip. The interconnect is electrically connected to a connection terminal on a circuit formation surface of the first or second semiconductor chip at the center section of the first or second semiconductor chip. The dam section and the interconnect are power supply interconnects or ground interconnects. | 04-17-2014 |
20140103544 | SEMICONDUCTOR DEVICE - A semiconductor device includes an extended semiconductor chip including a first semiconductor chip and an extension outwardly extending from a side surface of the first semiconductor chip; and a second semiconductor chip connected to the extended semiconductor chip through a plurality of bumps and electrically connected to the first semiconductor chip. The first semiconductor chip is smaller than the second semiconductor chip. At least one external terminal is provided on the extension. | 04-17-2014 |
20140327157 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A lamination structure includes a first semiconductor chip and a second semiconductor chip stacked via a bonding section so that a rear surface of the first semiconductor chip faces the main surface of the second semiconductor chip. At least a part of a side surface of the first semiconductor chip are covered with a first resin, a distribution layer is formed on the plane formed of the main surface of the first semiconductor chip and a surface of the first resin. At least part of electrodes existing in the main surface of the second semiconductor chip is electrically connected to at least part of first external electrodes formed on the distribution layer via the penetration electrodes that penetrate the first semiconductor chip. | 11-06-2014 |
20150371971 | SEMICONDUCTOR DEVICE - To provide a CoC type semiconductor device capable of preventing a power supply voltage from dropping (IR drop) in a center portion of a chip, and preventing deterioration in timing reliability. The semiconductor device includes a substrate, a first semiconductor chip placed on the substrate, having a circuit formation surface on an upper surface provided opposite to a surface facing the substrate, and including a TSV electrode and a connection pad electrically connected to the substrate, a second semiconductor chip placed on the upper surface of the first semiconductor chip, and electrically connected to the first semiconductor chip through a bump, a connection member for electrically connecting the connection pad of the first semiconductor chip to the substrate, and a redistribution layer formed on the upper surface of the first semiconductor chip, and electrically connected to the TSV electrode. | 12-24-2015 |
Patent application number | Description | Published |
20120069997 | ENCRIPTION DEVICE AND DECRYPTION DEVICE - According to one embodiment, an encryption device includes a storage unit, an input unit, first to fourth partial encryption units, a generation unit, and an output unit. The first partial encryption unit calculates first intermediate data from input plain data to store in the storage unit. The generation unit generates a round key, which is used in calculations for the first intermediate data and N-th intermediate data, from the secret key. The second partial encryption unit calculates (i+1)th intermediate data from i-th intermediate data (i is smaller than N) and the round key to store in the storage unit. The third partial encryption unit performs an arithmetic operation including predetermined conversion for mixing the N-th intermediate data, and calculates (N+1)th intermediate data to store in the storage unit. The fourth partial encryption unit obtains encrypted data by performing an arithmetic operation including inverse conversion of the conversion on the (N+1)th intermediate data. | 03-22-2012 |
20120079283 | MEMORY MANAGEMENT DEVICE AND MEMORY MANAGEMENT METHOD - According to an embodiment, a memory management device increments a lower value of a first counter, updates the counter by incrementing an upper value and resetting the lower value when the lower value overflows, increments to update the lower counter value when the upper value is incremented as a result of writing a second data piece having the upper value in common to a memory, recalculates a first secret value calculated using the first counter values and a root secret value in response to the first counter update, writes a first data piece and the first secret value to the memory, and at reading of the first data piece and the first secret value, calculates a second secret value using the updated first counter values and the root secret value, and compares the first secret value with the second secret value to verify the first data piece. | 03-29-2012 |
20130077790 | ENCRYPTION PROCESSING APPARATUS - According to an embodiment, a first linear transformation unit performs a linear transformation from mask data to first mask data. A second linear transformation unit performs a linear transformation from mask data to second mask data. A first calculator calculates first data based upon data to be processed and the first mask data. A selecting unit selects the first data or the second mask data. A non-linear transformation unit performs a non-linear transformation on the selected first data or second mask data. A second calculator calculates second data based upon the first data after the non-linear transformation and the mask data. A third linear transformation unit performs a linear transformation on the second data. The second data after the linear transformation by the third linear transformation unit is retained as new data to be processed, and the second mask data after the non-linear transformation is retained as new mask data. | 03-28-2013 |
20130236005 | CRYPTOGRAPHIC PROCESSING APPARATUS - According to an embodiment, a cryptographic processing apparatus performs processes to encrypt plain text or decrypt cipher text. The processes include a non-linear process using multiplication. The non-linear process is a process performed using intermediate data masked with mask data. The intermediate data is data in a middle of the plurality of processes. The mask data hides the intermediate data. The apparatus includes a non-linear processing unit configured to receive first data that is an exclusive OR of a product of the intermediate data and first mask data and second mask data, and output second data that is an exclusive OR of a product of data obtained by the non-linear process on the intermediate data and data obtained by the non-linear process on the first mask data and third mask data having a predetermined correspondence relation with the second mask data. | 09-12-2013 |