| Patent application number | Description | Published |
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| 20100066213 | METHOD OF MANUFACTURING QUARTZ RESONATOR ELEMENT, QUARTZ RESONATOR ELEMENT, QUARTZ RESONATOR, AND QUARTZ OSCILLATOR - To provide a method of manufacturing a quartz resonator element having a small CI value, a quartz resonator element manufactured by this method, a quartz resonator, and a quartz oscillator. | 03-18-2010 |
| 20100117490 | Method of manufacturing piezoelectric resonator, piezoelectric resonator, and electronic component - To provide a piezoelectric resonator in which a casing houses a tuning-fork piezoelectric resonator element and whose failure occurrence caused when shavings of adjustment films scatter and adhere to excitation electrodes is prevented. In a method of manufacturing a quartz-crystal resonator in which a casing | 05-13-2010 |
| 20100141100 | Method of manufacturing piezoelectric oscillating pieces, piezoelectric oscillating piece, and piezoelectric resonator - Wafer-level processing of making outer peripheral ends (beveled portions) of piezoelectric oscillating pieces thinner than center portion sides is made possible easily and at low cost. A metal film which is a mask of a piezoelectric substrate and a photoresist film which is a mask of the metal film and has a pattern with which connection support portions supporting piezoelectric oscillating pieces on the piezoelectric substrate are formed are stacked on the piezoelectric substrate in this order from the substrate side, and by etching with the photoresist film and the metal film used as masks, contours of the plural piezoelectric oscillating pieces are formed in the piezoelectric substrate. Then, from a direction of through spaces (side surfaces) formed by this etching, the metal film is etched with an etching solution without peeling off the photoresist film, whereby outer peripheral sides of the metal film are removed and surfaces of outer peripheral ends of the piezoelectric oscillating pieces are exposed, and the exposed surfaces are etched with an etching solution, whereby the piezoelectric oscillating pieces are processed so that outer peripheral ends thereof become thinner than inner peripheral sides. | 06-10-2010 |
| 20110063040 | Method of manufacturing piezoelectric resonator, piezoelectric resonator, and electronic component - To provide a piezoelectric resonator in which a casing houses a tuning-fork piezoelectric resonator element and whose failure occurrence caused when shavings of adjustment films scatter and adhere to excitation electrodes is prevented. In a method of manufacturing a quartz-crystal resonator in which a casing | 03-17-2011 |
| 20110191995 | Method for manufacturing piezoeletric resonator - To provide a method for manufacturing a piezoelectric resonator which can conduct frequency matching with high reliability when performing rough adjustment of the frequency by adjusting the shape of a piezoelectric oscillating piece before forming an electrode film, and thereby it becomes possible to avoid reduction of the yield. Etching for forming the shape of a piezoelectric oscillating piece, and etching for forming grooves are conducted simultaneously, and after forming the grooves, the shape formation of the piezoelectric oscillating piece is started again from the same depth as the groove in a state of covering the groove with a metal film, and after the shape formation, matching of frequency is conducted by etching the side surface of the piezoelectric oscillating piece in succession. By composing such a structure, it is possible to conduct rough adjustment of frequency at a low etching rate so that the frequency matching can be performed with no due difficulty and with high accuracy. | 08-11-2011 |
| 20110241492 | Quartz Crystal Device Using At-Cut Quartz Substrate and Manufacturing the Same - The quartz crystal device of a first aspect comprises a quartz crystal element having an vibrating portion which vibrates when a voltage is applied and a frame portion which surrounds the periphery of the vibrating portion, the quartz crystal element being formed of an AT-cut quartz crystal material specified by the X-axis, the Y′-axis and the Z′-axis; a base which is bonded to one main surface of the frame portion, the base being formed of a Z-cut quartz crystal material specified by the X-axis, the Y-axis and the Z-axis; and a lid which is bonded to other main surface of the frame portion, the frame portion being formed of the Z-cut quartz crystal material. The Z′-axis of the quartz crystal element is coincident with the X-axis or the Y-axis of the base and the lid. | 10-06-2011 |
| 20120032561 | Piezoelectric Device With Tuning-Fork Type Piezoelectric Vibrating Piece - To provide the piezoelectric device and the manufacturing method thereof, in which the quartz-crystal side surface electrodes and the base side surface electrodes are ensured to be electrically connected without disconnection. The piezoelectric device ( | 02-09-2012 |
| 20120068578 | Piezoelectric Device - A piezoelectric device ( | 03-22-2012 |
| 20120176004 | QUARTZ-CRYSTAL DEVICES EXHIBITING REDUCED ELECTRICAL IMPEDANCE - Quartz-crystal vibrating devices are disclosed, including vibrating and frame portions separated by a through-slot. An edge surface of the slot has a protrusion preventing unwanted formation of artifact “electrodes.” The vibrating portion and frame are made of AT-cut quartz as a unit. A joining portion couples the frame and vibrating portion together across the through-slot. A package base has two external electrodes. A third frame region has first and second plane surfaces. The protrusion projects toward the vibrating portion and has first and/or second sloped surfaces. First and second extraction electrodes extend from respective excitation electrodes via respective joining portions to respective external electrodes. The extraction electrodes pass across the first plane surface and first sloped surface or across the second plane surface and second slanted surface. | 07-12-2012 |
| Patent application number | Description | Published |
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| 20090058232 | TUNING-FORK TYPE PIEZOELECTRIC VIBRATING DEVICES AND METHODS FOR MANUFACTURING SAME - Piezoelectric vibrating devices are disclosed that include a base formed of a piezoelectric material, at least two vibrating arms extending in a predetermined direction from an edge of the base, and grooves defined in the vibrating arms. A first metal film comprising a single layer of at least one of Cr, Ni, and Ti is formed at least in the grooves for use as driving electrodes. Also disclosed are methods for manufacturing such devices. | 03-05-2009 |
| 20100117489 | PACKAGE-TYPE PIEZOELECTRIC RESONATOR AND METHOD OF MANUFACTURING PACKAGE-TYPE PIEZOELECTRIC RESONATOR - It is an object of the present invention to provide a package-type piezoelectric resonator which can be packaged at a wafer stage and is suitable for mass production. | 05-13-2010 |
| 20100123369 | Piezoelectric devices and methods for manufacturing same - Piezoelectric devices and method for making them are disclosed. An exemplary piezoelectric device has a package base defining a cavity on a first surface thereof. An opposing second surface of the package base has at least one through-hole, a mounting electrode on which a piezoelectric vibrating piece is attached, and a respective sealing electrode sealing each through-hole. At least one external electrode is on the second surface, and a lid is bonded to the package base to enclose the piezoelectric vibrating piece. The mounting electrode, sealing electrodes, and external electrodes are formed integrally. | 05-20-2010 |
| 20100314355 | Ultrasonic probe - There is provided a crystal resonator (crystal element) in which the probability of chipping occurring in separation is small when there is one supporting section with respect to a frame section of a crystal wafer, and inclined surfaces due to the anisotropy of etching are eliminated. The present invention relates to a crystal resonator manufacturing method such that an AT-cut crystal wafer is etched, a large number of rectangular crystal elements are joined with frame sections by supporting sections, and the crystal elements are mechanically cut away from the frame sections. On both sides of the +X-axis one end section of the crystal element, at least the outer side surface has a planarly tapered projection having a triangular inclined surface with an apex in the −X-axis direction, and the tip end of the projection has processing traces of the etching in the +X-axis direction. | 12-16-2010 |
| 20100327987 | Method of manufacturing crystal element and crystal resonator manufactured thereby - The present invention relates to a crystal element manufacturing method for manufacturing a plurality of crystal elements at a wafer level, and to a crystal resonator manufactured by this method. The method is comprised when the frequencies of the crystal elements are adjusted by adjusting the thickness of a crystal wafer that constitutes the crystal element in two stages by partial wet etching, the thicknesses of a large number of the step sections are coarse-adjusted in a first stage by collectively subjecting the step sections to partial wet etching, and then variations in the thicknesses of each group of a small number of the step sections are fine-adjusted in a second stage by collectively subjecting the step sections to partial wet etching. Alternatively, variations in the thicknesses of a small number of the step sections are coarse-adjusted and made uniform by means of partial wet etching, and then in a second stage, the thicknesses of a group of a plurality of the step sections having equal thicknesses are fine-adjusted by collectively subjecting the step sections to partial wet etching. Step sections having different areas are respectively formed on both of the front and back surfaces of a crystal wafer; at a crystal wafer level, these step sections are first collectively subjected to partial wet etching and thereby coarse-adjusted; then the thickness of each of the step sections is individually fine-adjusted by means of partial wet etching; and thereby the tact (the amount of operation time) required in partial wet etching is reduced. | 12-30-2010 |
| 20110019296 | Optical filter - An object of the invention is to provide an optical filter that prevents an optical thin film formed on an optical plate from being partially removed, and prevents micro-cracks occurring in an outer peripheral edge section of a principle surface of the optical plate, and that has a high yield rate. An optical filter is provided with an optical plate which has a chamfered section formed on an outer peripheral edge section of one principle surface of the optical plate, and has isotropy with respect to wet-etching, and the chamfered section is of an arc shape which is cross-sectionally concave in an inward direction of the optical plate, and is formed by means of wet-etching. A crossing angle between the one principle surface and a concave surface where the chamfered section is formed, and a crossing angle between the concave surface and a side surface of the optical plate 3 where the chamfered section is formed, namely, crossing angles θG and θH are respectively 100° or greater and less than 180° . | 01-27-2011 |
| 20110234052 | QUARTZ-CRYSTAL DEVICES AND METHODS FOR MANUFACTURING SAME - Methods are disclosed for manufacturing quartz-crystal devices. In an exemplary method three wafers are prepared. One is a quartz-crystal wafer defining multiple quartz-crystal pieces; a second is a wafer defining multiple package bases; and a third is a wafer defining multiple lids for the package bases. Each quartz-crystal piece has a respective excitation portion that vibrates when electrically energized and a respective frame portion surrounding the excitation portion. The quartz-crystal wafer has main surfaces that are lapped and polished to mirror-finish them. The base wafer defines multiple package bases each having a floor surface, a bonding surface surrounding the floor surface, and a lower main surface. The lid wafer defines multiple lids each having a ceiling surface, a bonding surface surrounding the ceiling surface, and a upper main surface. The quartz-crystal wafer is sandwiched between the base and lid wafers. The wafers are bonded together by bonding respective main surfaces of the frame portion to respective bonding surfaces. At least two of the upper main surface, lower main surface, floor surface, and ceiling surface are rougher than the surfaces of the excitation portion. | 09-29-2011 |
| 20110234054 | PIEZOELECTRIC DEVICES INCLUDING ELECTRODE-LESS VIBRATING PORTIONS - An exemplary piezoelectric device has a piezoelectric vibrating board including a portion that exhibits thickness-shear vibration, and a frame portion extending around and supporting the vibrating portion. A first cover board, bonded to the first main surface of the frame portion, has a first excitation electrode. A second cover board, bonded to the second main surface of the frame portion, has a second excitation electrode. Thus, the vibrating portion is sealed in a package formed by the frame portion and cover boards. A first convexity, defined either on the bonded main surface of the first cover board or on the first main surface of the frame portion, surrounds the excitation electrode and establishes a predetermined gap between the vibrating portion and excitation electrode. The first cover board and frame portion are bonded by adhesive applied, adjacent the first convexity but not on the first convexity, continuously around the vibrating portion. | 09-29-2011 |
| 20110241491 | SURFACE-MOUNTABLE QUARTZ-CRYSTAL DEVICES AND METHODS FOR MANUFACTURING SAME - In an exemplary method for making crystal vibrating devices, four wafers are provided: a crystal wafer, a base wafer, a first-lid wafer, and a second-lid wafer. The crystal wafer defines multiple crystal vibrating pieces including respective frames and respective electrodes formed on both main surfaces thereof. The base wafer defines multiple base plates bondable to one main surface of respective frames. The first-lid wafer defines multiple first lids bondable to the other main surface of the respective frames. Each first lid defines a void registrable with respective electrodes. The second-lid wafer is sized similarly to and bondable to the first-lid wafer so as to sealably close the voids. In a first bonding step the crystal wafer is bonded to the base wafer and first-lid wafer. In a subsequent adjustment step the thickness of at least one electrode per each crystal vibrating piece is adjusted to adjust the vibrational frequency of the respective vibrating portion. Thickness adjustment occurs through the respective voids. In a second bonding step, the second-lid wafer is bonded to the first-lid wafer. The resulting wafer sandwich is cut up into individual quartz crystal devices. | 10-06-2011 |
| 20120098390 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING PIEZOELECTRIC SUBSTRATES USED IN SUCH DEVICES - In a piezoelectric device, a piezoelectric substrate includes a vibrating piece with respective excitation electrodes on each principal surface thereof. The piezoelectric substrate is surrounded by an outer frame separated therefrom by a through-void except for a supporting portion connecting the vibrating piece to the frame. Extraction electrodes extend from the excitation electrodes across the supporting portion to the frame, and on edge surfaces of the supporting portion. The piezoelectric substrate is sandwiched between a lid and a package base to form a piezoelectric device. The outer surface of the package base is a mounting surface to which the extraction electrodes extend via an edge surface of the through-void in a region that does not overlap the excitation electrode. | 04-26-2012 |
| 20120139391 | PIEZOELECTRIC DEVICES AND METHODS FOR MANUFACTURING THE SAME - Piezoelectric vibrating devices have piezoelectric vibrating pieces of which the vibration frequency is measurable individually on a wafer scale, without being affected by adjacent piezoelectric devices on the wafer. An exemplary piezoelectric device includes a piezoelectric vibrating piece having excitation electrodes and respective extraction electrodes. The device includes a package base with two connecting electrodes facing the vibrating piece and connected to respective extraction electrodes. Two pairs of mounting terminals are situated on the outer surface of the package base. Also on the outer surface of the package base are two pairs of opposing castellations that are recessed toward the center of the package base. Edge-surface electrodes connect the first and second main surfaces of the base; one pair is connected to the connecting electrodes and the other pair is connected to respective mounting terminals. | 06-07-2012 |
| 20120169182 | AT-CUT QUARTZ-CRYSTAL VIBRATING PIECES AND DEVICES, AND METHODS FOR MANUFACTURING SAME - AT-cut quartz-crystal vibrating pieces and corresponding quartz-crystal devices are disclosed each having a vibrating portion surrounded by a frame portion across a through-slot configured to provide a wide vibrating portion. An exemplary vibrating piece has a quartz-crystal vibrating portion that vibrates when electrically energized, a frame portion surrounding the vibrating portion, and a through-slot defined between the vibrating portion and the frame portion. The through-slot includes a first through-slot extending in the X-axis direction along +Z′-edge of the vibrating portion, and a second through-slot extending in the X-axis direction along the −Z′-edge of the vibrating portion. The first through-slot has a different width than the second through-slot. | 07-05-2012 |
| 20120217846 | Crystal Device - A surface-mount type crystal device is provided, having a rectangular crystal element including an excitation part and a frame surrounding the excitation part, wherein the frame has sides respectively along a first and a second directions intersected with each other; a rectangular base, bonded to a principal plane of the frame, having sides respectively along the first and the second directions; a rectangular lid, bonded to another principal plane of the frame, having sides respectively along the first and the second directions. A first and a second bonding materials, respectively corresponding to a thermal expansion coefficient in the first and the second directions of the crystal element, are respectively applied on the sides of the first and the second directions of each of the frame of a crystal material, the base and the lid. A second bonding material is different from the first bonding material. | 08-30-2012 |
| 20120229002 | PIEZOELECTRIC VIBRATING PIECE AND PIEZOELECTRIC DEVICE - A piezoelectric vibrating piece and a piezoelectric device are provided, in which the deterioration of the vibrating characteristics of a vibrating portion is prevented. The piezoelectric vibrating piece comprises a rectangular-shaped first surface having a long side and a short side; a second surface opposing the first surface; and side surfaces, connecting the first surface and the second surface. The piezoelectric vibrating piece further comprises a first excitation electrode formed on a central part of the first surface; a first extraction electrode extracted from the first excitation electrode to an outer peripheral portion of the second surface via only the side surface at the short side; a second excitation electrode formed on the second surface opposite to the first excitation electrode; and a second extraction electrode extracted from the second excitation electrode to the outer peripheral portion of the second surface. | 09-13-2012 |
| 20120235542 | PIEZOELECTRIC DEVICE - To facilitate positioning of an external terminal and ensure sufficient solder joint strength at the time of mounting a piezoelectric device on a mounting board by soldering. In a crystal device of the present invention, an external terminal is formed, for example, at four corners on an external bottom surface of a base having a rectangular shape as seen in a plan view, and the external terminals include two active terminals arranged opposite to each other on a diagonal line, and two ground terminals arranged opposite to each other on another diagonal line crossing the diagonal line. An arbitrary sign, character, or figure is marked on a mounting surface of at least one ground terminal of external terminals to determine the direction of the active terminal. | 09-20-2012 |
| 20120242193 | QUARTZ-CRYSTAL DEVICES EXHIBITING REDUCED CRYSTAL IMPEDANCE - Quartz-crystal devices are disclosed, of which the CI value is reduced by adjusting the shortest distance between an edge of electrically conductive adhesive and an edge of the excitation electrode. The device has a quartz-crystal plate having long-edges and short-edges. Excitation electrodes are on first and second surfaces of the plate. Conductive pads are electrically connected to respective excitation electrodes and extend to the short-edge of the quartz-crystal plate. A package having a pair of external mounting terminals and respective connecting electrodes are situated on opposing sides of the mounting terminals for making electrical connections to the mounting terminals. An electrically conductive adhesive bonds the connecting terminals and respective conductive pads together, and the quartz-crystal plate onto the package. The shortest distance between an edge of the adhesive and an edge of the excitation electrode is 10%-15% the length of the quartz-crystal plate in the long-edge direction. | 09-27-2012 |
| 20120249255 | CRYSTAL DEVICE AND MANUFACTURING METHOD THEREOF - A crystal device includes; a base, a framed crystal vibrating blank in which a mesa section is formed on an upper face end bonded to a seal path on an upper surface of the base via a low melting point glass layer or a resin adhesive layer, and a lid bonded to a seal path on an upper surface of the framed crystal vibrating blank via a low melting point glass layer or a resin adhesive layer. A pillow made of low melting point glass or a resin adhesive that suppresses vibration amplitude at the time of a drop impact of the framed crystal vibrating blank is formed on a rear surface of the lid simultaneously with the low melting point glass layer or the resin adhesive layer. | 10-04-2012 |
