Patent application number | Description | Published |
20090008159 | WEIGHT MEASUREMENT DEVICE, DROPLET DISCHARGE DEVICE, AND WEIGHT MEASUREMENT METHOD - A weight measurement device is configured and arranged to measure the weight of a measurement object. the weight measurement device includes a container and a wind-guard cover. The container is configured and arranged to receive the measurement object therein. The wind-guard cover is configured and arranged to selectively cover an upper space of the container. The wind-guard cover has a transverse air-blocking part configured and arranged to block an air flow flowing in a transverse direction with respect to the container. | 01-08-2009 |
20090133820 | SEPARATING METHOD OF BONDED BODY - A separating method of a bonded body, the bonded body including two base members and a bonding film through which the base members are boded together, enabling to easily and efficiently separating the bonded body into the two original base members is provided. Further, the bonding film contains a silicone material composed of silicone compounds. The separating method includes: preparing the bonded body with the bonding film; and applying energy for separation to the bonding film so that cleavage is generated within the bonding film due to breakage of a part of molecular bonds of the silicone compounds, to thereby separate the bonded body into the first and second base members. | 05-28-2009 |
20090136767 | BONDING METHOD AND BONDED BODY - A bonding method of bonding two base members together through a bonding film having a fine pattern at low cost, and a bonded body with the bonding film which is formed using the bonding method are provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through a bonding film having a predetermined pattern. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members using a liquid droplet ejecting method, to form a liquid coating having a pattern corresponding to the predetermined pattern on the surface; drying the liquid coating so that it is transformed into the bonding film having the predetermined pattern on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film. | 05-28-2009 |
20090147051 | LIQUID DROPLET EJECTION HEAD AND LIQUID DROPLET EJECTION APPARATUS - A liquid droplet ejection head having superior dimensional accuracy, superior chemical resistance and high reliability and being capable of printing in high quality for a long period of time, and a liquid droplet ejection apparatus provided with such a liquid droplet ejection head and therefore being capable of providing high reliability are provided. The liquid droplet ejection head includes: a substrate having first through-holes that serve as ejection liquid reservoir chambers for reserving an ejection liquid and a second through-hole that serves as an ejection liquid supply chamber for supplying the ejection liquid to the ejection liquid reservoir chambers, the substrate having one surface and the other surface opposite to the one surface; a nozzle plate having nozzles that ejects the ejection liquid in the form of liquid droplets, the nozzle plate provided on a side of the one surface of the substrate so as to cover the first through-holes and the second through-hole of the substrate; a sealing plate provided on a side of the other surface of the substrate so as to cover the first through-holes of the substrate; a driving means that drives the liquid droplet ejection head to eject the ejection liquid from the nozzles; a first bonded portion through which the substrate and the nozzle plate are bonded together; and a second bonded portion through which the substrate and the sealing plate are bonded together, wherein at least one of the first and second bonded portions includes a bonding film formed by drying a liquid coating formed of a liquid material containing a silicone material composed of silicone compounds, and wherein the bonding film bonds the substrate and at least one of the nozzle plate and the sealing plate together due to a bonding property developed in the bonding film by applying energy thereto. | 06-11-2009 |
20090183825 | METHOD OF FORMING BONDED BODY AND BONDED BODY - A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 80 atom % or higher but lower than 90 atom % at an atomic ratio. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided. | 07-23-2009 |
20090186215 | METHOD OF FORMING BONDED BODY AND BONDED BODY - A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted of copper and an organic component, and an amount of copper contained in each of the first bonding film and the second bonding film is 90 atom % or higher but lower than 99 atom % at an atomic ratio. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided. | 07-23-2009 |
20090186242 | METHOD OF FORMING BONDED BODY AND BONDED BODY - A method of forming a bonded body comprised of a first base member, a second base member, and a first bonding film and a second bonding film provided between the first base member and the second base member is provided. The first bonding film and the second bonding film are constituted mainly of copper. The method is comprised of: forming the first bonding film on the first base member by using a chemical vapor-film formation method; forming the second bonding film on the second base member by using a chemical vapor-film formation method; bringing the first bonding film formed on the first base member into contact with the second bonding film formed on the second base member so that the first bonding film faces the second bonding film; and applying a compressive force to the first base member and the second base member so that the first bonding film and the second bonding film are bonded together to thereby obtain the bonded body. Two base members can be firmly and efficiently bonded together with high dimensional accuracy at a low temperature, and the two base members can be efficiently separated (peeled off) to each other after use of the bonded body. Further, a bonded body is also provided. | 07-23-2009 |
20090250168 | METHOD FOR DISASSEMBLING BONDED STRUCTURE - There is provided a method for disassembling a bonded structure obtained by bonding a first base member and a second base member to each other via a bonding film mainly made of a compound having a branched polyorganosiloxane skeleton having a structural unit expressed by a following general formula (1) at a terminal portion, a structural unit expressed by a following general formula (2) at a linking portion, and a structural unit expressed by a following general formula (3) at a branched portion: | 10-08-2009 |
20090317617 | BASE MEMBER WITH BINDING FILM, BONDING METHOD, AND BONDED STRUCTURE - A bonding film-formed base member includes a base member and a bonding film formed by supplying a liquid material containing a metal complex on a surface of the base member and then drying and burning the liquid material. The bonding film includes a metal atom and a leaving group made of an organic component. In the bonding-film formed base member, energy is applied to at least a partial region of a surface of the bonding film to eliminate the leaving group present near the surface of the bonding film from the bonding film so as to allow the at least a partial region of the surface to have adhesion to an object intended to be bonded to the bonding film-formed base member. | 12-24-2009 |
20100092767 | BONDING METHOD AND BONDED BODY - A bonding method includes applying a liquid material containing silicone materials to at least one of the first base member and the second base member so as to form a liquid film, drying the liquid film so as to obtain a bonding film on the at least one of the first base member and the second base member, heating the bonding film so as to cross-link the silicone materials contained in the bonding film to each other, and applying energy to the bonding film so as to develop adhesiveness around a surface of the bonding film so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed between the first base member and the second base member. | 04-15-2010 |
20100092788 | BONDING METHOD AND BONDED BODY - A bonding method includes: a) applying a liquid material containing a silicone material to at least one of the first base member and the second base member so as to form a liquid film on the at least one of the base members; b) drying the liquid film so as to obtain the bonding film on the at least one of the first base member and the second base member; c) bringing plasma into contact with the bonding film so as to develop adhesiveness around a surface of the bonding film; and d) bringing the first base member and the second base member into contact with each other in a manner to interpose the bonding film on which adhesiveness is developed therebetween so as to obtain a bonded body in which the first base member and the second base member are bonded to each other with the bonding film interposed therebetween. | 04-15-2010 |
20100206474 | BONDING METHOD AND BONDED STRUCTURE - A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and curing the liquid coating to obtain a bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film. | 08-19-2010 |
20100302312 | LIQUID DROPLET EJECTION HEAD AND LIQUID DROPLET EJECTION APPARATUS - A liquid droplet ejection head includes: a substrate, a sealing plate and a nozzle plate therebetween that define an ejection liquid storage chamber. An activated bonding film between the substrate and the nozzle plate or the sealing plate contains a polyester-modified silicone material obtained by a dehydration condensation reaction between a silicone material having a branched polyorganosiloxane backbone having a structural unit represented by (1) at a branched portion, a structural unit represented by (2) or (3) at a linking portion, and a structural unit represented by (4) or (5) at a terminal portion and a polyester resin obtained by an esterification reaction between trimethylolpropane and terephthalic acid: | 12-02-2010 |
20100304156 | BONDING METHOD AND BONDED STRUCTURE - A bonding method includes: preparing a first base material and a second base material to be bonded to each other via a bonding film; forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of the first base material and the second base material, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, | 12-02-2010 |
20100304157 | BONDING METHOD AND BONDED STRUCTURE - A bonding method includes: forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, | 12-02-2010 |
20100304159 | BONDING METHOD AND BONDED STRUCTURE - A bonding method includes: forming a liquid coating by supplying an epoxy-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film with developed adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film. | 12-02-2010 |
20110100725 | DROPLET DISCHARGE DEVICE - A droplet discharge device for discharging a liquid material onto a workpiece includes a droplet discharge head, a guide rail, a stage, a maintenance stage and a weight measurement device. The droplet discharge head discharges the liquid material. The guide rail extends in a prescribed direction. The stage, on which the workpiece is mounted, moves on the guide rail along the prescribed direction. The maintenance stage moves on the guide rail along the prescribed direction. The weight measurement device is disposed on the maintenance stage, the weight measurement device measuring weight of droplets discharged from the droplet discharge head and is able to be disposed at a location opposite the droplet discharge head when the maintenance stage moves along the guide rail. | 05-05-2011 |
20110273518 | LIQUID DROPLET EJECTION HEAD AND LIQUID DROPLET EJECTION APPARATUS - An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet. | 11-10-2011 |
20130307904 | LIQUID DROPLET EJECTION HEAD AND LIQUID DROPLET EJECTION APPARATUS - An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet. | 11-21-2013 |