Patent application number | Description | Published |
20090168322 | SEMICONDUCTOR MEMORY CARD - The semiconductor memory card related to the present invention is arranged with a plurality of semiconductor memory packages, a controller chip which controls the plurality of semiconductor memory packages, and a substrate mounted with the plurality of semiconductor chips on one surface and the controller chip mounted on the other surface corresponding to a position in which the external force of the first surface is concentrated. | 07-02-2009 |
20090230386 | BENZOBISTHIAZOLE COMPOUND, BENZOBISTHIAZOLE POLYMER, ORGANIC FILM INCLUDING THE COMPOUND OR POLYMER AND TRANSISTOR INCLUDING THE ORGANIC FILM - A benzobisthiazole compound having a specific formula, and a benzobisthiazole polymer having a specific benzothiazole structure. An organic film including the benzobisthiazole polymer, the benzobisthiazole compound and/or a polymer obtained from the benzobisthiazole compound. An organic thin-film transistor including an organic semiconductor layer including the organic film; a pair of electrodes configured to flow an electric current through the organic semiconductor layer; and a third electrode configured to apply a voltage to the organic semiconductor layer. | 09-17-2009 |
20090230534 | SEMICONDUCTOR MEMORY APPARATUS - The semiconductor memory apparatus related to an embodiment of the present invention includes a wiring substrate arranged with a device mounting part and connection pads aligned along one exterior side of the wiring substrate, a plurality of semiconductor memory devices including electrode pads which are arranged along one external side of the wiring substrate, a semiconductor memory device group in which the plurality of semiconductor memory devices are stacked on the device mounting part of the wiring substrate so that pad arrangement sides all face in the same direction, and a controller device including the electrode pads arranged along at least one external side of the wiring substrate, wherein the electrode pads of the plurality of semiconductor memory devices and the electrode pads of the controller device are arranged parallel to an arrangement position of the connection pads of the wiring substrate. | 09-17-2009 |
20100120203 | SEMICONDUCTOR DEVICE AND MEMORY CARD USING THE SAME - A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks. | 05-13-2010 |
20100171650 | MULTI-ANTENNA MEASUREMENT METHOD AND MULTI-ANTENNA MEASUREMENT SYSTEM - There is provided a multi-antenna measurement method of measuring a device under test having at least two receive antennas and capable of considering the spatial correlation between antennas in a simpler configuration. Two different uncorrelated signal sequences “a” and “b” are generated by the pseudo base transceiver station | 07-08-2010 |
20100172112 | SEMICONDUCTOR MEMORY CARD WITH CONTROLLER CHIP - A semiconductor memory card includes a semiconductor memory, a controller, input/output terminals, resistive elements, first wires, and second wires. The semiconductor memory is mounted on one surface of a substrate. The controller is mounted on the other surface of the substrate and controls the semiconductor memory. The input/output terminals input and output signals to and from the semiconductor memory via the controller. The resistive elements electrically connect input/output terminals to the controller. The first wires connect one-side ends of each of the resistive elements to the controller and each of which has a wire length of 4.0 mm or less. The second wires connect the other-side ends of each of the resistive elements to the input/output terminals. | 07-08-2010 |
20110175143 | SEMICONDUCTOR MEMORY APPARATUS - The semiconductor memory apparatus related to an embodiment of the present invention includes a wiring substrate arranged with a device mounting part and connection pads aligned along one exterior side of the wiring substrate, a plurality of semiconductor memory devices including electrode pads which are arranged along one external side of the wiring substrate, a semiconductor memory device group in which the plurality of semiconductor memory devices are stacked on the device mounting part of the wiring substrate so that pad arrangement sides all face in the same direction, and a controller device including the electrode pads arranged along at least one external side of the wiring substrate, wherein the electrode pads of the plurality of semiconductor memory devices and the electrode pads of the controller device are arranged parallel to an arrangement position of the connection pads of the wiring substrate. | 07-21-2011 |
20120230228 | RADIO COMMUNICATION TERMINAL - A mobile communication terminal ( | 09-13-2012 |
20120231751 | RADIO COMMUNICATION TERMINAL - A mobile communication terminal ( | 09-13-2012 |
20120243445 | BASE STATION DEVICE AND MOBILE COMMUNICATION METHOD - To reduce deterioration of a downlink signal when a multicarrier transmission is performed. A base station device eNB according to the present invention communication system includes: an uplink signal reception unit | 09-27-2012 |
20120243450 | BASE STATION DEVICE AND USER EQUIPMENT - When multicarrier transmission is performed, a mobile communication service is appropriately provided according to the configuration of a user equipment. A radio base device eNB according to the present invention includes a control signal reception unit | 09-27-2012 |
20120243495 | BASE STATION DEVICE AND MOBILE COMMUNICATION METHOD - When multicarrier transmission is performed, the degradation of a downlink signal is reduced. A base station device eNB according to the present invention includes a simultaneous communication instruction unit | 09-27-2012 |
20120244821 | RADIO COMMUNICATION APPARATUS - A communication apparatus includes a radio portion ( | 09-27-2012 |
20120257588 | BASE STATION DEVICE AND MOBILE COMMUNICATION METHOD - To reduce deterioration of a downlink signal when a multicarrier transmission is performed. A base station device eNB according to the present invention includes an uplink resource assignment unit | 10-11-2012 |
20130034185 | WIRELESS COMMUNICATION DEVICE AND WIRELESS COMMUNICATION METHOD - A wireless communication device includes a mixer that multiplies quadrature-modulated transmission data by a local oscillation frequency signal and outputs a high-frequency signal; a distributor that distributes the high-frequency signal; a detector circuit that detects a direct current component included in the high-frequency signal, based on the high-frequency signal distributed by the distributor; a correction signal generating unit that generates a correction signal for removing the direct current component from the high-frequency signal, based on the direct current component detected by the detector circuit; a correction unit that corrects the high-frequency signal by the correction signal generated by the correction signal generating unit; and a transmission unit that transmits the high-frequency signal that has been corrected by the correction unit. | 02-07-2013 |
20150035174 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first component that generates heat when used, a second component, and a sealing portion. The sealing portion includes a first region and a second region. The first region covers the first component. The second region is thermally divided from the first region and covers the second component. | 02-05-2015 |