Patent application number | Description | Published |
20090091045 | Themosetting Composition for Optical Semiconductor, Die Bond Material for Optical Semiconductor Device, Underfill Material for Optical Semiconductor Device, Sealing Agent for Optical Semiconductor Device, and Optical Semiconductor Device - A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2). The content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol %: | 04-09-2009 |
20100171414 | SEALING AGENT FOR OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR ELEMENT - The sealing agent for an optical semiconductor device, which comprises: a silicone resin having a cyclic ether-containing group in the molecular structure; a heat curing agent capable of reacting with the cyclic ether-containing group; and a fine particulate material of silicon oxide, and the sealing agent having a viscosity of 500 to 10,000 mPa·s measured by an E-type viscometer at 25° C. at 5 rpm, a thixotropic value of 1.2 to 2.5 calculated by dividing a viscosity measured by the E-type viscometer at 25° C. at 1 rpm by a viscosity measured at 10 rpm (viscosity at 1 rpm/viscosity at 10 rpm), and a minimum viscosity of 100 mPa·s or higher measured at 1 s | 07-08-2010 |
20120070778 | RESIN, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN - A resin having a structural unit derived from a compound represented by the following formula (I), wherein R | 03-22-2012 |
20120122034 | RESIN AND PHOTORESIST COMPOSITION COMPRISING THE SAME - The present invention provides a resin comprising a structural unit represented by the formula (aa): | 05-17-2012 |
20120153342 | DIE-BONDING MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICES AND OPTICAL SEMICONDUCTOR DEVICE USING SAME - The present invention provides a die bonding material for an optical semiconductor device which has high thermal conductivity and can prevent cracking in an optical semiconductor device including the die bonding material. | 06-21-2012 |
20120294487 | OBJECT DETECTING DEVICE, IMAGE DIVIDING DEVICE, INTEGRATED CIRCUIT, METHOD OF DETECTING OBJECT, OBJECT DETECTING PROGRAM, AND RECORDING MEDIUM - An object detection device is provided with a plurality of processor units each detecting an object included in an image. The object detection device generates divided images by dividing the image, taking into consideration both the processing load for detection of an object by each processor element and the transfer load for transfer of the divided images to the processor elements. Independently of each other, the processor elements detect an object in each of the divided images. | 11-22-2012 |
20130094777 | IMAGE COMPRESSION DEVICE, IMAGE COMPRESSION METHOD, INTEGRATED CIRCUIT, PROGRAM, AND PICTURE DISPLAY APPARATUS - Degradation in image quality of color difference components is to be suppressed. Provided is an image compression device that performs fixed length compression of data to be compressed composed of a plurality of components including a luminance component. The image compression device includes a code amount allocation unit configured to determine, according to the luminance component, the code amount to be allocated to each of the plurality of components such that a total of the code amount allocated to each of the components remains constant, and a compression unit configured to compress each of the plurality of components in accordance with the code amount determined by the code amount allocation unit. | 04-18-2013 |
20140003742 | TRANSPOSITION OPERATION DEVICE, INTEGRATED CIRCUIT FOR THE SAME, AND TRANSPOSITION METHOD | 01-02-2014 |