Patent application number | Description | Published |
20110102102 | DUPLEXER - A duplexer that achieves a reduction in the size and an increase in the performance includes a transmission filter including piezoelectric thin film resonators and a reception filter including piezoelectric thin film resonators and an elastic wave resonator. The piezoelectric thin film resonators of the transmission filter and the piezoelectric thin film resonators and the elastic wave resonator of the reception filter are provided on the same substrate. | 05-05-2011 |
20110131774 | METHOD OF MANUFACTURING STACKED THIN FILM PIEZOELECTRIC FILTER - A method of manufacturing a stacked thin film piezoelectric filter includes the steps of forming a lower thin film piezoelectric resonator on a substrate, measuring a frequency of the lower thin film piezoelectric resonator and adjusting the frequency, forming an acoustic coupling layer on the lower thin film piezoelectric resonator whose frequency has been adjusted, forming the stacked thin film piezoelectric filter by forming an upper thin film piezoelectric resonator on the acoustic coupling layer, and measuring a frequency of the upper thin film piezoelectric resonator and adjusting the frequency. | 06-09-2011 |
20110146041 | METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE - A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded. | 06-23-2011 |
20110193654 | ELASTIC WAVE FILTER DEVICE AND MODULE INCLUDING THE SAME - An elastic wave filter device in which elastic wave filters and parallel resonators are provided on a piezoelectric substrate includes a plurality of ground ports. The elastic wave filters include input-side resonators and output-side resonators. The input-side resonators are connected between a reception input port and a first one of the ground ports. The output-side resonators are connected between reception output ports and the first ground port. The parallel resonators are connected in parallel to output lines and are connected to second and third ground ports. | 08-11-2011 |
20120001704 | ACOUSTIC WAVE DEVICE - An acoustic wave device includes resonator structures each including resonators arranged next to each other, and each of the resonator structures is excited in at least two vibration modes as the resonators thereof are coupled and resonate with each other. At least one of the resonator structures exhibits stronger resonance characteristics in one of the vibration modes than in the other vibration mode or modes within the filter band. | 01-05-2012 |
20120194034 | PIEZOELECTRIC DEVICE - A piezoelectric device includes first and second piezoelectric resonators each including a piezoelectric thin film, an upper electrode provided on one main surface of the piezoelectric thin film, and a lower electrode provided on another main surface of the piezoelectric thin film. In the piezoelectric resonators, portions in which the upper and lower electrodes are superposed on each other with the piezoelectric thin film therebetween define piezoelectric vibrating portions that are acoustically isolated from a substrate. The first and second piezoelectric resonators are connected in series or parallel between an input terminal and an output terminal such that polarization directions of corresponding portions of the piezoelectric thin film are opposite to each other when seen from the input terminal. The first piezoelectric resonator and the second piezoelectric resonator are arranged to have different resonant frequencies of a transverse vibration mode. | 08-02-2012 |
20130057113 | ELASTIC WAVE DEVICE - In an elastic wave device that significantly reduces and prevents deterioration of a frequency characteristic without roughening an undersurface of a piezoelectric substrate, a structure is bonded to a surface of a piezoelectric substrate other than a main surface of the piezoelectric substrate on which IDTs are located. The structure is provided so that a path difference is defined between a first component and a second component of a bulk wave that is excited by the IDT and propagates in the piezoelectric substrate toward the bonding surface. The first component of the bulk wave is reflected from the bonding surface. The second component of the bulk wave enters the structure from the bonding surface, propagates in the structure, enters the piezoelectric substrate from the bonding surface, and propagates in the same direction as that of the first component reflected from the bonding surface in the piezoelectric substrate. | 03-07-2013 |
20130127300 | PIEZOELECTRIC THIN-FILM RESONATOR AND METHOD FOR PRODUCING PIEZOELECTRIC THIN FILM - A piezoelectric thin-film resonator includes a piezoelectric thin film which includes aluminum nitride containing Sc and which has a concentration distribution such that the concentration of Sc is non-uniform in a thickness direction of the piezoelectric thin film; a first electrode; a second electrode facing the first electrode across the piezoelectric thin film; and a substrate supporting a piezoelectric vibrating section defined by the piezoelectric thin film and the first and second electrodes. | 05-23-2013 |
20140368401 | COMMUNICATION DEVICE - A communication device is provided with a band elimination filter that has one end connected to an antenna terminal, and a first multiplexer that is connected to the other end of the band elimination filter. The band elimination filter is configured to eliminate signals of a frequency band that is different from the frequencies of signals transmitted and received in the first multiplexer, and is configured from a filter circuit that includes a bulk wave element. | 12-18-2014 |
20150017320 | METHOD OF MANUFACTURING STACKED THIN FILM PIEZOELECTRIC FILTER - A method of manufacturing a stacked thin film piezoelectric filter includes the steps of forming a lower thin film piezoelectric resonator on a substrate, measuring a frequency of the lower thin film piezoelectric resonator and adjusting the frequency, forming an acoustic coupling layer on the lower thin film piezoelectric resonator whose frequency has been adjusted, forming the stacked thin film piezoelectric filter by forming an upper thin film piezoelectric resonator on the acoustic coupling layer, and measuring a frequency of the upper thin film piezoelectric resonator and adjusting the frequency. | 01-15-2015 |
Patent application number | Description | Published |
20080265355 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed. | 10-30-2008 |
20100330725 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed. | 12-30-2010 |
20130056756 | LIGHT-TRANSMISSIVE MEMBER, OPTICAL DEVICE, AND MANUFACTURING METHODS THEREOF - A light-transmissive member has a first principal face, a second principal face, and side faces. The first principal face has a first portion including a center of the first principal face and a second portion between the first portion and the side face sides. The member includes a plurality of altered portions formed between the first principal face and the second principal face so that the plurality of altered portions do not appear on the first principal face, the second principal face, and the side faces. Orthogonal projections of the plurality of altered portions onto the first principal face are included in the second portion. | 03-07-2013 |
Patent application number | Description | Published |
20130106756 | TACTILE SENSATION PROVIDING APPARATUS AND CONTROL METHOD FOR TACTILE SENSATION PROVIDING APPARATUS | 05-02-2013 |
20130201137 | TACTILE SENSATION PROVIDING APPARATUS AND CONTROL METHOD FOR TACTILE SENSATION PROVIDING APPARATUS - By dual chips exchanging a signal indicating a pressing load detected for providing the tactile sensation, application process based thereon is performed. A tactile sensation providing apparatus includes a touch sensor, a load detection unit for detecting the pressing load on the sensor for providing the sensation, a tactile sensation providing unit for vibrating a surface the sensor, a provision control unit for controlling drive of the providing unit, and a main control unit for controlling an application. The main control unit determines whether a predetermined area of the surface is touched based on an output of the sensor and, when touched, transmits an instruction to the provision control unit. The provision control unit, upon receiving the instruction from the main control unit, detects the pressing load and transmits the detected load to the main control unit. The main control unit, based on the load, performs the application process. | 08-08-2013 |
20130207919 | TACTILE SENSATION PROVIDING APPARATUS AND CONTROL METHOD FOR TACTILE SENSATION PROVIDING APPARATUS - Dual chips exchange a signal indicating a pressing load detected for providing the tactile sensation such that application process based on the pressing load is performed. A tactile sensation providing apparatus according to the present invention includes a touch sensor, a load detection unit configured to detect the pressing load on the touch sensor for providing the tactile sensation, a tactile sensation providing unit configured to vibrate a touch face of the touch sensor, a tactile sensation provision control unit configured to control drive of the tactile sensation providing unit, and a main control unit configured to control an application. The tactile sensation provision control unit transmits the pressing load to the main control unit. The main control unit, based on an output of the touch sensor and the pressing load received from the tactile sensation provision control unit, performs the application process. | 08-15-2013 |