Patent application number | Description | Published |
20100143673 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation. | 06-10-2010 |
20100221559 | ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION - There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a | 09-02-2010 |
20100295190 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A photosensitive adhesive composition comprising (A) an alkali-soluble polymer, (B) a thermosetting resin, (C) one or more radiation-polymerizable compounds and (D) a photoinitiator, wherein the 5% weight reduction temperature of the mixture of all of the radiation-polymerizable compounds in the composition is 200° C. or higher. | 11-25-2010 |
20110031631 | PHOTOSENSITIVE ADHESIVE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device | 02-10-2011 |
20110045639 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 02-24-2011 |
20110121435 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater. | 05-26-2011 |
20110151195 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION - There is provided a photosensitive adhesive composition having a lowest melt viscosity at 20° C. to 200° C. after pattern formation of 30,000 Pa·s or lower. | 06-23-2011 |
20110159238 | PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT - A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T | 06-30-2011 |
20110223397 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - The invention provides a semiconductor device comprising a semiconductor element and an adherend, thermocompression bonded via a patterned photosensitive film adhesive, wherein the water content of the patterned photosensitive film adhesive just before thermocompression bonding is no greater than 1.0 wt %, with the aim of providing a semiconductor device exhibiting excellent heat resistance. | 09-15-2011 |
20120282547 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 11-08-2012 |
20130062787 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART - A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator. | 03-14-2013 |