Patent application number | Description | Published |
20100175477 | ACOUSTIC SENSOR - A vibrating electrode plate | 07-15-2010 |
20100212432 | ELECTROSTATIC CAPACITIVE VIBRATING SENSOR - An electrostatic capacitive vibration sensor has a substrate, a through-hole, a vibrating electrode plate, and a fixed electrode plate opposite the vibrating electrode plate. The fixed electrode plate is subjected to vibration to perform membrane oscillation. Pluralities of acoustic holes are made in the fixed electrode plate. The vibrating and fixed electrode plate are disposed on a surface side of the substrate such that an opening on the surface side of the through-hole is covered. A lower surface of an outer peripheral portion of the vibrating electrode plate is partially fixed to the substrate. A vent hole that communicates a surface side and a rear surface side of the vibrating electrode plate is made between the surface of the substrate and the lower surface of the vibrating electrode plate. In addition, the acoustic hole has a smaller opening area except at the outer peripheral portion. | 08-26-2010 |
20110266640 | ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME - An acoustic sensor lengthens the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On an upper surface of a silicon substrate, a beam portion made of polysilicon is formed through a second sacrifice layer made of silicon dioxide film on an extended portion of a first sacrifice layer made of polysilicon. The extended portion is formed under a region excluding a distal end of the beam portion. The extended portion is removed by etching from a back chamber arranged in the silicon substrate to form a hollow portion in a region excluding the distal end of the lower surface of the beam portion, and then the second sacrifice layer is removed by etching. The second sacrifice layer remaining on the lower surface of the distal end of the beam portion forms an anchor. | 11-03-2011 |
20110278683 | ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME - In an acoustic sensor, a diaphragm arranged on an upper side of a silicon substrate includes a back chamber, and an anchor supports the diaphragm. An insulating plate portion fixed to an upper surface of the silicon substrate covers the diaphragm with a gap. A conductive fixed electrode film arranged on a lower surface of the plate portion configures a back plate. The change in electrostatic capacitance between the fixed electrode film and the diaphragm outputs to the outside from a fixed side electrode pad and a movable side electrode pad as an electric signal. A protective film is arranged continuously with the plate portion at an outer periphery of the plate portion. The protective film covers the outer peripheral part of the upper surface of the silicon substrate, and the outer periphery of the protective film coincides with the outer periphery of the upper surface of the silicon substrate. | 11-17-2011 |
20110278684 | ACOUSTIC SENSOR - A diaphragm for sensing sound pressure faces a back plate including a plate portion and a fixed electrode film to form a capacitance type acoustic sensor. The back plate is opened with acoustic holes for passing vibration, and is arranged with a plurality of stoppers in a projecting manner on a surface facing the diaphragm. The stopper arranged in an outer peripheral area of the back plate has a small diameter, and the stopper arranged in an internal area has a large diameter. Thus, sticking of the diaphragm is prevented, and the diaphragm is less likely to break by impact when the sensor is dropped. | 11-17-2011 |
20110280419 | ACOUSTIC SENSOR AND MICROPHONE - An acoustic sensor includes a semiconductor substrate with a back chamber, a conductive diaphragm arranged on an upper side of the semiconductor substrate, an insulating fixed film fixed on an upper surface of the semiconductor substrate covering the conductive diaphragm with a gap, a conductive fixed electrode film arranged on the insulating fixed film facing the diaphragm, an extraction wiring extracted from the conductive fixed electrode film, and an electrode pad to which the extraction wiring is connected. The acoustic sensor converts an acoustic vibration to change electrostatic capacitance between the conductive diaphragm and the conductive fixed electrode film. A plurality of acoustic perforations are opened in a back plate including the insulating fixed film and the conductive fixed electrode film. An opening rate of the plurality of acoustic perforations is smaller in the extraction wiring and a region in the vicinity thereof than in other regions. | 11-17-2011 |
20120213400 | ACOUSTIC SENSOR AND MICROPHONE - Provided is an acoustic sensor capable of improving an S/N ratio of a sensor without preventing reduction in size of the sensor. A back chamber | 08-23-2012 |
20130070942 | ACOUSTIC TRANSDUCER, AND MICROPHONE USING THE ACOUSTIC TRANSDUCER - An acoustic sensor includes: a semiconductor substrate; a vibrating membrane, formed above the semiconductor substrate, which includes a vibrating electrode; and a fixed membrane, formed on an upper surface of the semiconductor substrate, which includes a fixed electrode, the acoustic sensor detecting an acoustic wave according to a change in capacitance between the vibrating electrode and the fixed electrode. The fixed membrane has a plurality of sound hole portions formed therein in order to allow the acoustic wave to reach the vibrating membrane from outside, and the fixed electrode is formed so that a boundary of an edge portion of the fixed electrode does not intersect the sound hole portions. | 03-21-2013 |
20140050338 | ACOUSTIC SENSOR AND MICROPHONE - Provided is an acoustic sensor capable of improving an S/N ratio of a sensor without preventing reduction in size of the sensor. A diaphragm | 02-20-2014 |