Patent application number | Description | Published |
20100175477 | ACOUSTIC SENSOR - A vibrating electrode plate | 07-15-2010 |
20100212432 | ELECTROSTATIC CAPACITIVE VIBRATING SENSOR - An electrostatic capacitive vibration sensor has a substrate, a through-hole, a vibrating electrode plate, and a fixed electrode plate opposite the vibrating electrode plate. The fixed electrode plate is subjected to vibration to perform membrane oscillation. Pluralities of acoustic holes are made in the fixed electrode plate. The vibrating and fixed electrode plate are disposed on a surface side of the substrate such that an opening on the surface side of the through-hole is covered. A lower surface of an outer peripheral portion of the vibrating electrode plate is partially fixed to the substrate. A vent hole that communicates a surface side and a rear surface side of the vibrating electrode plate is made between the surface of the substrate and the lower surface of the vibrating electrode plate. In addition, the acoustic hole has a smaller opening area except at the outer peripheral portion. | 08-26-2010 |
20110266640 | ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME - An acoustic sensor lengthens the portion of the beam portion not fixed with the anchor without lowering the strength of the beam portion and the supporting strength of the diaphragm. On an upper surface of a silicon substrate, a beam portion made of polysilicon is formed through a second sacrifice layer made of silicon dioxide film on an extended portion of a first sacrifice layer made of polysilicon. The extended portion is formed under a region excluding a distal end of the beam portion. The extended portion is removed by etching from a back chamber arranged in the silicon substrate to form a hollow portion in a region excluding the distal end of the lower surface of the beam portion, and then the second sacrifice layer is removed by etching. The second sacrifice layer remaining on the lower surface of the distal end of the beam portion forms an anchor. | 11-03-2011 |
20110278683 | ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME - In an acoustic sensor, a diaphragm arranged on an upper side of a silicon substrate includes a back chamber, and an anchor supports the diaphragm. An insulating plate portion fixed to an upper surface of the silicon substrate covers the diaphragm with a gap. A conductive fixed electrode film arranged on a lower surface of the plate portion configures a back plate. The change in electrostatic capacitance between the fixed electrode film and the diaphragm outputs to the outside from a fixed side electrode pad and a movable side electrode pad as an electric signal. A protective film is arranged continuously with the plate portion at an outer periphery of the plate portion. The protective film covers the outer peripheral part of the upper surface of the silicon substrate, and the outer periphery of the protective film coincides with the outer periphery of the upper surface of the silicon substrate. | 11-17-2011 |
20110278684 | ACOUSTIC SENSOR - A diaphragm for sensing sound pressure faces a back plate including a plate portion and a fixed electrode film to form a capacitance type acoustic sensor. The back plate is opened with acoustic holes for passing vibration, and is arranged with a plurality of stoppers in a projecting manner on a surface facing the diaphragm. The stopper arranged in an outer peripheral area of the back plate has a small diameter, and the stopper arranged in an internal area has a large diameter. Thus, sticking of the diaphragm is prevented, and the diaphragm is less likely to break by impact when the sensor is dropped. | 11-17-2011 |
20110280419 | ACOUSTIC SENSOR AND MICROPHONE - An acoustic sensor includes a semiconductor substrate with a back chamber, a conductive diaphragm arranged on an upper side of the semiconductor substrate, an insulating fixed film fixed on an upper surface of the semiconductor substrate covering the conductive diaphragm with a gap, a conductive fixed electrode film arranged on the insulating fixed film facing the diaphragm, an extraction wiring extracted from the conductive fixed electrode film, and an electrode pad to which the extraction wiring is connected. The acoustic sensor converts an acoustic vibration to change electrostatic capacitance between the conductive diaphragm and the conductive fixed electrode film. A plurality of acoustic perforations are opened in a back plate including the insulating fixed film and the conductive fixed electrode film. An opening rate of the plurality of acoustic perforations is smaller in the extraction wiring and a region in the vicinity thereof than in other regions. | 11-17-2011 |
20120213400 | ACOUSTIC SENSOR AND MICROPHONE - Provided is an acoustic sensor capable of improving an S/N ratio of a sensor without preventing reduction in size of the sensor. A back chamber | 08-23-2012 |
20130070942 | ACOUSTIC TRANSDUCER, AND MICROPHONE USING THE ACOUSTIC TRANSDUCER - An acoustic sensor includes: a semiconductor substrate; a vibrating membrane, formed above the semiconductor substrate, which includes a vibrating electrode; and a fixed membrane, formed on an upper surface of the semiconductor substrate, which includes a fixed electrode, the acoustic sensor detecting an acoustic wave according to a change in capacitance between the vibrating electrode and the fixed electrode. The fixed membrane has a plurality of sound hole portions formed therein in order to allow the acoustic wave to reach the vibrating membrane from outside, and the fixed electrode is formed so that a boundary of an edge portion of the fixed electrode does not intersect the sound hole portions. | 03-21-2013 |
20140050338 | ACOUSTIC SENSOR AND MICROPHONE - Provided is an acoustic sensor capable of improving an S/N ratio of a sensor without preventing reduction in size of the sensor. A diaphragm | 02-20-2014 |
Patent application number | Description | Published |
20100176821 | ACOUSTIC SENSOR - A vibrating electrode plate | 07-15-2010 |
20110179876 | CAPACITANCE TYPE VIBRATION SENSOR - A capacitance type vibration sensor has a substrate including a hollow portion, a vibration electrode plate, which is arranged facing the hollow portion at an upper surface side of the substrate and which performs film vibration upon receiving vibration, and a fixed electrode plate which is arranged facing the vibration electrode plate and which is opened with a plurality of acoustic perforations passing therethrough in a thickness direction. The capacitance type vibration sensor has an air path, which communicates a space between the vibration electrode plate and the fixed electrode plate to the hollow portion, between an upper surface of the substrate and a lower surface of the vibration electrode plate in at least one part of a periphery of the hollow portion. | 07-28-2011 |
20140367811 | CAPACITANCE TYPE SENSOR AND METHOD OF MANUFACTURING THE SAME - A capacitance type sensor has a semiconductor substrate having a vertically opened penetration hole, a movable electrode film arranged above the penetration hole such that a periphery portion opposes to a top surface of the semiconductor substrate with a gap provided, and a fixed electrode film arranged above the movable electrode film with a gap with respect to the movable electrode film. A concave portion having at least a part thereof formed by an inclined surface is provided in the top surface of the semiconductor substrate in a region of the top surface of the semiconductor substrate which overlaps the periphery portion of the movable electrode film. | 12-18-2014 |
20140374859 | SENSOR DEVICE - A sensor device has a substrate, a sensor section provided on an upper surface of the substrate, a circuit section provided on the upper surface of the substrate, a plurality of connection pads that electrically conduct with the sensor section or the circuit section, and a metal protective film covering at least a part of the circuit section from above. | 12-25-2014 |
20150043759 | MICROPHONE, ACOUSTIC SENSOR, AND METHOD OF MANUFACTURING ACOUSTIC SENSOR - A microphone has a package, and an acoustic sensor, an under surface of which is fixed to an inner face of the package. The acoustic sensor has a substrate having a plurality of hollows penetrating the substrate from a top surface to an under surface, and a capacitor structure made by a movable electrode plate and a fixed electrode plate disposed above each of the hollows. A package sound hole is opened in the package in a position opposed to the under surface of the acoustic sensor. A dent which is communicated with each of the hollows and open below the under surface side of the substrate is formed below the under surface of the substrate. A height of the dent measured from the under surface of the substrate is equal to or less than half of a height of the hollow. | 02-12-2015 |
20150078591 | ACOUSTIC TRANSDUCER AND MICROPHONE - An acoustic transducer has a vibrating film and a fixed film formed above an opening portion of a substrate, and at least a first sensing portion and a second sensing portion that detect sound waves using change in capacitance between a vibrating electrode provided in the vibrating film and a fixed electrode provided in the fixed film, convert the sound waves into electrical signals, and output the electrical signals. In the first sensing portion and the second sensing portion, the fixed film is used in common, and the vibrating electrode is divided into a first sensing region and a second sensing region that respectively correspond to the first sensing portion and the second sensing portion. In the first sensing portion, a protrusion portion that protrudes toward the vibrating electrode is provided on a region of the fixed film that opposes the first sensing region. | 03-19-2015 |
20150104048 | CAPACITANCE SENSOR, ACOUSTIC SENSOR, AND MICROPHONE - A capacitance sensor has a substrate, a vibration electrode plate formed over an upper side of the substrate, a back plate formed over the upper side of the substrate to cover the vibration electrode plate, and a fixed electrode plate arranged on the back plate facing the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is divided into a plurality of regions. A sensing unit configured by the vibration electrode plate and the fixed electrode plate is formed in each of the divided regions. The plurality of sensing units output a plurality of signals having different sensitivities. At least some sensing units of the sensing units have vibration electrode plates having areas different from the areas of the vibration electrode plates in the other sensing units. | 04-16-2015 |
20150156576 | CAPACITANCE SENSOR, ACOUSTIC SENSOR, AND MICROPHONE - A capacitance sensor has a substrate, a vibration electrode plate formed over an upper side of the substrate, a back plate formed over the upper side of the substrate to cover the vibration electrode plate, and a fixed electrode plate arranged on the back plate facing the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is divided into a plurality of regions. A sensing unit configured by the vibration electrode plate and the fixed electrode plate is formed on each of the divided regions. An isolation portion that suppresses vibration from being propagated is formed on the back plate to partition the sensing units from each other. | 06-04-2015 |
20150230011 | ACOUSTIC TRANSDUCER - An acoustic transducer has a substrate having a cavity that is open at a top of the substrate, a vibration electrode film provided above the substrate so as to cover the cavity, and a fixed electrode film provided a distance above the vibration electrode film. A gap is formed between an upper surface of the substrate and a lower surface of the vibration electrode film around the cavity. In the gap across which the upper surface of the substrate and the lower surface of the vibration electrode film face each other, a narrow portion of the gap that is narrower than another portion of the gap is disposed. The narrow portion of the gap extends linearly. | 08-13-2015 |
Patent application number | Description | Published |
20090181489 | MICROPHONE MANUFACTURING METHOD - A sacrifice layer | 07-16-2009 |
20100038734 | VIBRATION SENSOR AND METHOD FOR MANUFACTURING THE VIBRATION SENSOR - A method for manufacturing a vibration sensor including forming a sacrifice layer at one part of a front surface of a semiconductor substrate of monocrystalline silicon with a material isotropically etched by an etchant for etching the semiconductor substrate, forming a thin film protective film with a material having resistance to the etchant on the sacrifice layer and the front surface of the semiconductor substrate at a periphery of the sacrifice layer, forming a thin film of monocrystalline silicon, polycrystalline silicon, or amorphous silicon on an upper side of the sacrifice layer, opening a backside etching window in a back surface protective film having resistance to the etchant for etching the semiconductor substrate formed on a back surface of the semiconductor substrate, forming a through-hole in the semiconductor substrate by etching the semiconductor substrate anisotropically by using crystal-oriented etching by applying the etchant from the back surface window, then etching the sacrifice layer isotropically by the etchant after the etchant reaches the front surface of the semiconductor substrate, and then etching the semiconductor substrate anisotropically by using crystal-oriented etching from a front side by the etchant spread to a space formed after the sacrifice layer is removed, and forming a holder for supporting the thin film on an upper surface of the semiconductor substrate by removing the thin film protective film partially. | 02-18-2010 |
20150230027 | ACOUSTIC TRANSDUCER - An acoustic transducer has a substrate having an opening in an upper surface thereof, a vibration electrode plate disposed above the substrate, and having an outer edge thereof facing the upper surface of the substrate with a gap therebetween, a fixed electrode plate facing the vibration electrode plate, and a plurality of projections protruding on a lower surface of the outer edge of the vibration electrode plate. The vibration electrode plate covers an upper side of the opening. The plurality of projections are disposed so as to not be positioned along a straight line or a curved line parallel to an edge of the opening in at least a part of one or at least two arrays formed on the lower surface of the outer edge. | 08-13-2015 |
20150245123 | CAPACITANCE TYPE SENSOR, ACOUSTIC SENSOR, AND MICROPHONE - A capacitance type sensor has a substrate, a vibration electrode plate formed over the substrate, a back plate formed over the substrate so as to cover the vibration electrode plate, and a fixed electrode plate provided on the back plate so as to be opposite to the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is separated into a plurality of regions, each of the plurality of regions being formed with a sensing section including the vibration electrode plate and the fixed electrode plate. A barrier electrode is provided between respective sensing sections of at least one adjacent pair of regions of the plurality of regions to prevent signal interference between the respective sensing sections. | 08-27-2015 |
Patent application number | Description | Published |
20090248179 | PLANT OPERATION DATA MONITORING APPARATUS - To provide a plant operation data monitoring apparatus capable of monitoring a plant error with high accuracy without requiring a skilled plant operator. | 10-01-2009 |
20090274567 | TUBING MISLOAD DETECTION MECHANISM FOR AN INFUSION PUMP - A an infusion tube misfitting detection device for an infusion pump, which can be implemented at a low cost while maintaining safety. When a door unit is to be closed with respect to a pump body in a misloaded state of an infusion tube, a mislead detection inner door is pressed by the infusion tube to operate on a handle lock part provided to a handle. Accordingly, a claw portion of the handle lock part is pushed up, so that the door unit cannot be locked with the pump body | 11-05-2009 |
20090275897 | TUBING MISLOAD DETECTION MECHANISM FOR AN INFUSION PUMP - [Object]To provide an infusion tube misfitting detection means for an infusion pump, which can be implemented at a low cost with a safety maintained.
| 11-05-2009 |
20090306592 | INFUSION PUMP - An infusion pump is provided with a slide clamp mechanism having a clamp member for closing or opening an infusion tube and a valve mechanism for pressing the infusion tube to stop flow of a solution in the infusion tube and has a structure where an interlocking mechanism for interlocking the slide clamp mechanism with the valve mechanism only by manipulation of a handle is disposed. During a series of manipulations of the handle, the infusion tube is always closed by one or both of the slide clamp and valves 14A and 14B, so that free flow of a solution in the infusion tube 40 can be entirely prevented. | 12-10-2009 |
Patent application number | Description | Published |
20130294622 | ACOUSTIC TRANSDUCER - Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals. | 11-07-2013 |
20140191343 | SOUND TRANSDUCER AND MICROPHONE USING SAME - Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals. | 07-10-2014 |