Patent application number | Description | Published |
20080201944 | MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A multilayer printed circuit board has an IC chip | 08-28-2008 |
20090000812 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a core substrate and a built-up wiring layer formed by alternately layering conductor circuits and insulating resin layers. The built-up wiring layer includes a first surface provided in contact with the core substrate and a second surface opposing the first surface and including a mounting area on which at least one semiconductor device is to be mounted. A first plurality of through-hole conductors is formed in a first portion of the core substrate which corresponds to the mounting area of the second surface, and a second plurality of through-hole conductors formed in a second portion of the core substrate which corresponds to another area of the second surface other than the mounting area. A pitch between the first plurality of through-hole conductors is smaller than a pitch between the second plurality of through-hole conductors. In one aspect, a ratio of pads to through holes directly below a processor core section of the semiconductor device is less that a number of pads to through holes in an area outside the processor core. | 01-01-2009 |
20090025216 | MULTI-LAYER PRINTED WIRING BOARD INCLUDING AN ALIGHMENT MARK AS AN INDEX FOR A POSITION OF VIA HOLES - A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film. | 01-29-2009 |
20090064493 | PRINTED CIRCUIT BOARD - A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between the first electrode and the second electrode, and a via-hole conductor structure formed through the second electrode and insulating layer and electrically connecting the second electrode and the conductor portion. The via-hole conductor structure has a first portion in the second electrode and a second portion in the insulating layer. The first portion of the via-hole conductor structure has a truncated-cone shape tapering toward the conductor portion. | 03-12-2009 |
20090070996 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad. | 03-19-2009 |
20090084594 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respective conductive layers are connected by via hole is formed. A via hole is formed on the surface of a mirror-processed Si substrate by using a heat resistant substrate composed of Si substrate so that finer wiring than a resin substrate having unevenness in its surface can be formed, whereby achieving fine pitches. Further, by forming the wiring on a mirror processed surface, dispersion of wiring decreases thereby decreasing dispersion of impedance. | 04-02-2009 |
20090090547 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board | 04-09-2009 |
20090159327 | PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD - A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern. | 06-25-2009 |
20090175011 | PACKAGE SUBSTRATE WITH BUILT-IN CAPACITOR AND MANUFACTURING METHOD THEREOF - When a package substrate with a built-in capacitor includes a first thin-film small electrode | 07-09-2009 |
20090199399 | METHOD FOR MANUFACTURING BOARD WITH BUILT-IN ELECTRONIC ELEMENTS - A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conductive pattern made of a metal material on the protective film by an additive method, placing an electronic element on the support substrate with the conductive pattern such that a surface of the electronic element where a circuit is formed faces the conductive pattern, covering the electronic element with an insulative resin, etching away the metal foil using a first etching solution such that the protective film is not dissolved by the first etching solution or that the protective film has an etching speed which is slower than an etching speed of the metal foil, and electrically connecting terminals of the electronic element and a part of the conductive pattern. | 08-13-2009 |
20090200069 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board | 08-13-2009 |
20090200639 | PACKAGE SUBSTRATE WITH BUILT-IN CAPACITOR AND MANUFACTURING METHOD THEREOF - When a package substrate with a built-in capacitor includes a first thin-film small electrode | 08-13-2009 |
20090255716 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up wiring layer including conductive layers, interlayer resin insulating layers and a via hole conductor connecting the conductive layers through one of the interlayer resin insulating layers. | 10-15-2009 |
20090260857 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate. | 10-22-2009 |
20100018049 | MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, forming a positioning mark on said substrate based on a positioning mark of said electronic component, and conducting working or formation based on the positioning mark of said substrate. | 01-28-2010 |
20100031503 | MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, removing a film on a surface of a die pad of said electronic component, forming a mediate layer to be connected to a via hole of a lowermost interlayer insulating layer, on said die pad, forming the interlayer insulating layers on said substrate, and forming the via holes connected to the conductor circuits and the mediate layers, in said interlayer resin insulating layers. | 02-11-2010 |
20100064512 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7. | 03-18-2010 |
20100108637 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer printed wiring board manufacturing method including forming conductor posts, which are of substantially uniform thickness and with which the top surfaces are protected by a resist, on a conductor pattern disposed on an upper surface of a build-up layer formed on a core substrate, shaping the conductor posts to have a constriction by adjusting the time of immersion in an etching solution that etches the conductor posts, forming a low elastic modulus layer of substantially the same height as the conductor posts after removing the resist at the top surfaces, and forming mounting electrodes on upper surfaces of the conductor posts. | 05-06-2010 |
20100193227 | PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A printed wiring board including a first insulating layer, a second insulating layer formed over the first insulating layer, a capacitor portion including an upper electrode, a lower electrode and a ceramic high dielectric layer formed between the upper electrode and the lower electrode, the capacitor portion sandwiched by the first insulating layer and the second insulating layer, an upper electrode connecting portion passing through the capacitor portion without contact and through the second insulating layer and electrically connected to the upper electrode of the capacitor portion, and a lower electrode connecting portion passing through the second insulating layer and the upper electrode of the capacitor portion without contact and electrically connected to the lower electrode in contact. | 08-05-2010 |
20100200285 | HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF - A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once. | 08-12-2010 |
20100288544 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a core substrate, a built-up wiring layer having a first surface in contact with the substrate and a second surface, the second surface including a mounting area for mounting a semiconductor device, the built-up layer including circuits and insulating layers, first through-hole conductors formed in a first portion of the substrate which corresponds to the mounting area, second through-hole conductors formed in a second portion of the substrate which corresponds to an area of the second surface other than the mounting area, third through-hole conductors formed in a processor core area of the first portion of the substrate which corresponds to a processor core section of the device, and pads provided on the second surface. The first conductors have a pitch smaller than a pitch of the second conductors, and the third conductors have a pitch smaller than the pitch of the first conductors. | 11-18-2010 |
20110063806 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, multiple electronic components provided on a surface of the wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a core substrate and a built-up wiring layer formed over the core substrate. The built-up wiring layer includes a conductive layer and an interlayer resin insulating layer, and the electronic components are electrically connected to the conductive layer of the built-up wiring layer. | 03-17-2011 |
20110063811 | MULTILAYER PRINTED WIRING BOARD - A printed wiring board includes a main body having a mounting portion and ground and power supply pads in the mounting portion such that a ground line of a semiconductor device is connected to a ground pad and a power supply line of the device is connected to a power supply pad, and a layered capacitor disposed in the main body and having a high dielectric constant layer and first and second layer electrodes sandwiching the dielectric layer. One of the electrodes is connected to the power supply line and the other electrode is connected to the ground line, the first electrode has a solid pattern including passage holes through which second rod terminals connected to the second electrode pass in a non-contacting manner, and the second electrode has a solid pattern including passage holes through which first rod terminals connected to the first electrode pass in a non-contacting manner. | 03-17-2011 |
20110100700 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board | 05-05-2011 |
20110259629 | HIGH-DIELECTRIC SHEET, A PRINTED CIRCUIT BOARD HAVING THE HIGH-DIELECTRIC SHEET AND PRODUCTION METHODS THEREOF - A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once. | 10-27-2011 |
20110290544 | PRINTED WIRING BOARD AND MANUFACTURING METHOD OF PRINTED WIRING BOARD - A printed wiring board including a core substrate, a build-up layer formed over the core substrate and including a first insulating layer, a conductor layer formed over the first insulating layer, and a second insulating layer formed over the conductor layer, and one or more wiring patterns formed over the first insulating layer. The conductor layer includes conductor portions, and the conductor portions have notched portions, respectively, facing each other across the wiring pattern. | 12-01-2011 |
20120000068 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component. | 01-05-2012 |
20120302010 | MULTILAYER PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming an uncalcined layer containing a raw ceramic material on a first metal layer, firing the uncalcined layer formed on the first metal layer such that a high dielectric constant layer having a ceramic body calcined in a sheet form is formed on the first metal layer, forming a second metal layer on the high dielectric constant layer on the opposite side of the high dielectric constant layer with respect to the first metal layer such that a layered capacitor having the high dielectric constant layer and first and second layer electrodes sandwiching the high dielectric constant layer is formed, and disposing the layered capacitor in a main body. | 11-29-2012 |