Patent application number | Description | Published |
20080222885 | METHOD FOR MANUFACTURING HYBRID PRINTED CIRCUIT BOARD - A method for manufacturing a hybrid printed circuit board having two kinds of wiring boards. The circuit board has method has a first wiring board having a first terminal and, a second wiring board wherein a dent wherein the first wiring board is fitted and equipped with a second terminal is formed, and forming the same plane as the first wiring board. The board also has an insulating adhesive material disposed around the first terminal, and a conductive adhesive joining the first terminal with the second terminal. | 09-18-2008 |
20090084590 | CIRCUIT BOARD - A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer. | 04-02-2009 |
20090294056 | METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED CIRCUIT BOARD UNIT - The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other. | 12-03-2009 |
20090294160 | METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE BINDER - A thermosetting resin sheet is sandwiched between first and second support bodies so that a first electrically-conductive land on the first support body is opposed to a second electrically-conductive land on the second support body in an opening formed in the sheet. The opening is filled with an electrically-conductive binder. The electrically-conductive binder includes matrix material containing a thermosetting resin and fillers including copper particles dispersed in the matrix material. The copper particles have the surface coated with a tin-bismuth alloy. When heat is applied to the electrically-conductive binder, the tin-bismuth alloy melts. The tin forms an intermetallic compound on the surface of the individual copper particle. The copper-tin alloy layers serve to unit the copper particles together. Electrical connection is established. The bismuth embeds the copper particles. The bismuth is hardened or cured. The matrix material is then hardened or cured. | 12-03-2009 |
20100130147 | RADIO COMMUNICATION APPARATUS, RADIO COMMUNICATION SYSTEM AND SIGNAL SWITCHING METHOD - A radio communication system for conducting the radio communication with a terminal device includes a first radio communication apparatus for processing a first signal; a second radio communication apparatus for processing a second signal, and to combine the first signal and the second signal; a common amplifier for amplifying the first and second signals from the second radio communication apparatus, transmitting the amplified signals to the terminal device, amplifying first and second signals received from the terminal device, and outputting the amplified signals to the second radio communication apparatus, the second radio communication apparatus separating the amplified first and second signals; and a switching apparatus coupled to the first radio communication apparatus, the second radio communication apparatuses and the common amplifier to disconnect the first or second radio communication apparatus when a fault occurs in the first or second radio communication apparatus, respectively. | 05-27-2010 |
20100157949 | Wireless Base Station And Control Method Thereof - For processing an uplink signal from a mobile station without desiring a high AFC capability in any state, in a wireless base station including a plurality of antennas, reception signals from a mobile station are taken in to perform a signal transmission and reception with the mobile station by a first antenna providing a higher reception signal level, in which a switchover from a signal transmission to the mobile station by the first antenna to that by a second antenna is performed when a frequency variation characteristic measured for an allocated frequency of the reception signal from the first antenna indicates that the mobile station is moving away from the first antenna. | 06-24-2010 |
20110100690 | ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF MAKING THE SAME - An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases. | 05-05-2011 |
20130126221 | METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOARD, AND ELECTRONIC DEVICE - There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered, the manufacturing. The method includes arranging an adhesive resin sheet on the first board so that one face faces the first board, the adhesive resin sheet including a plurality of variant via holes, an opening area on the one face of each of the plurality of variant via holes being larger than an opening area on the other face, filling the variant via holes with conductive paste, arranging the second board on the other face of the adhesive resin sheet after the filling with the conductive paste, and performing heat press treatment to apply pressure to the adhesive resin sheet in a layering direction of the first board and the second board under heat. | 05-23-2013 |
20130340249 | METHOD OF MANUFACTURING MULTILAYER CIRCUIT SUBSTRATE - A method of manufacturing a multilayer circuit substrate, the method includes: injecting a conductive paste into through-holes provided in an insulating substrate to one or both sides of which a protection film is attached; cooling and setting the conductive paste injected into the through-holes; and removing the protection film from the insulating substrate after cooling and setting the conductive paste. | 12-26-2013 |
20130341767 | SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate. | 12-26-2013 |
20140193953 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE - A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate. | 07-10-2014 |
20140318840 | STACKED STRUCTURE AND MANUFACTURING METHOD OF THE SAME - An embodiment of a stacked structure includes: a first substrate that includes a first electrode; a second substrate that includes a second electrode; and an adhesive resin material that is provided between the first substrate and the second substrate and includes a plurality of conductive vias, the plurality of conductive vias electrically connecting the first electrode and the second electrode. | 10-30-2014 |
20140376187 | PACKAGE MOUNTING STRUCTURE - A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate. | 12-25-2014 |
Patent application number | Description | Published |
20100182350 | IMAGE DISPLAY APPATAUS - In general, when a user views an image displayed on a display apparatus, visual environments, such as ambient brightness, a distance from the user to the display apparatus and so on, may disadvantageously cause the image displayed on the display apparatus to become difficult to view. Moreover, it is complicated and troublesome for the user to enter information of ambient light amount and others when setting a picture quality. An image display apparatus holds both question constituent information related to visual environments and choice information serving as answers to questions constituted by the question constituent information, and further holds a plurality of picture quality control rules suitable for visual environments assumed in accordance with the choice information serving as the answers. When sensing a power-up, the image display apparatus outputs the questions; acquires result information that is choices serving as answers from the user to those questions and that is used to acquire the picture quality control rules; and controls the picture quality in accordance with the picture quality control rules acquired in accordance with the result information. | 07-22-2010 |
20130278830 | VIDEO DISPLAY DEVICE - A histogram generation portion calculates a prescribed feature value of a pixel and the maximum feature value for the pixel, for each pixel of one frame of an input video signal. Then, the ratio of the feature value of the pixel to the maximum feature value is calculated for each pixel as an index of color brightness, and a histogram generated wherein the numbers of pixels are integrated by index value. An enhancement processing portion applies gain and carries out an enhancement for pixel values wherein the index in the histogram which the histogram generation portion generates is greater than or equal to a prescribed threshold. The feature value is treated as a luminosity (L*) which is defined with CIELAB chroma space. Additionally, the feature value may be data which has the maximum tone value among pixel RGB data, or may be a luminosity value (Y) of the pixel. | 10-24-2013 |
20150077640 | DISPLAY DEVICE AND DISPLAY METHOD - To optimize combinations of values of four primary colors in a display device supporting four-primary-color display, with consideration given to display performances such as the power consumption in a light-emitting display device and the viewing angle characteristics in the non-light-emitting display device. The display device of the present invention displays video indicated by an input video signal using pixels composed of four primary colors and each having at least one sub-pixel for one primary color. When representing pixel colors of pixel signals in the input video signal, at least one pixel color which has a lightness less than a predetermined lightness determined depending on a color gamut representable by the display device and which is in areas except on a boundary of the color gamut is represented using only three primary colors among the four primary colors. For example, if the four primary colors are red, green, blue, and yellow, the pixel colors are represented using either a set of green, blue, and yellow, or a set of red, blue, and yellow depending on chromaticity indicated by the pixel signals. | 03-19-2015 |
Patent application number | Description | Published |
20110199541 | VIDEO DISPLAY DEVICE - When conducting video display with a wide color gamut display based on a video signal conforming to a standard (sRGB standard and the like) having a color reproduction range narrower than that of the wide color gamut display, the video processing circuit | 08-18-2011 |
20110279740 | VIDEO DISPLAY DEVICE - When a wide color gamut display displays video based on a video signal that complies with a narrower color reproduction range standard, in order to make full use of the feature of the wide color gamut display capable of displaying highly saturated and vivid reds, while eliminating the problem of seeing glaring images in the part of the red color region near the highest brightness and saturation, a video processing circuit ( | 11-17-2011 |
20130099678 | LIGHTING DEVICE, LIGHTING CONTROL DEVICE AND LIGHTING SYSTEM - A lighting device includes a pyroelectric sensor, a shutter and a lighting control unit. The lighting control unit is configured, when the lighting load is turned off, to turn the lighting load on if the pyroelectric sensor detects a change in infrared radiation. The lighting control unit is also configured, when the lighting load is turned on, to turn the lighting load off if a repetition count or time of a lighting retention time reaches a specified count or time, respectively, with no change in infrared radiation detected through the pyroelectric sensor within each lighting retention time per the passage of lighting retention time. | 04-25-2013 |