Patent application number | Description | Published |
20080231509 | Gps Positioning Method and Gps Position Device - In the present invention, a conditional probability distribution function of received signal which is conditioned with a received signal amplitude (a), a pseudo range (p) and a navigation bit (b | 09-25-2008 |
20090282903 | ANGULAR VELOCITY/ANGULAR ACCELERATION CALCULATOR, TORQUE ESTIMATOR, AND COMBUSTION STATE ESTIMATOR - An angular velocity/angular acceleration calculator of the crankshaft in an internal combustion engine includes a crank angle detection device, a crank angle correction device, and an angular velocity/angular acceleration calculation device. The crank angle detection device detects a crank angle in the internal combustion engine and a time at the crank angle. The crank angle correction device corrects the crank angle and the time thus detected to an equiangular crank angle and a time corresponding thereto. The angular velocity/angular acceleration calculation device calculates an angular velocity and an angular acceleration of the crankshaft by converting a function of the time with respect to the crank angle that are corrected by the crank angle correction device so as to be regarded as a periodic function, and utilizing the discrete Fourier transform of the converted function. | 11-19-2009 |
20100139819 | METHOD FOR PRODUCING STEEL PART HAVING LONG ROLLING CONTACT FATIGUE LIFE - A steel part having a long rolling contact fatigue life and capable of further increasing the life of a bearing under severer using condition than usual conditions. The steel part includes steel having a composition containing 0.7% by mass to 1.1% by mass of C, 0.5% by mass to 2.0% by mass of Si, 0.4% by mass to 2.5% by mass of Mn, 1.6% by mass to 5.0% by mass of Cr, 0.1% by mass to less than 0.5% by mass of Mo, 0.010% by mass to 0.050% by mass of Al, less than 0.0015% by mass of Sb as an impurity, and the balance composed of Fe and inevitable impurities, the steel being hardened and tempered. In the steel structure of a portion from the surface to a depth of 5 mm, residual cementite has a grain diameter of 0.05 to 1.5 μm, prior austenite has a grain diameter of 30 μm or less, and the ratio by volume of the residual austenite is less than 25%. | 06-10-2010 |
20100290505 | CODE CONVERTING APPARATUS, RECEIVER, AND CODE CONVERTING METHOD - A code converting apparatus is designed to estimate the incoming time and the like of a signal modulated by a spreading sequence composed of m elements in a set A having n kinds of symbols as elements accurately. A symbol sequence memory section | 11-18-2010 |
20110015321 | POLYACETAL RESIN COMPOSITION AND PREPARATION PROCESS THEREOF - Provided is a polyacetal resin composition obtained from a raw material composition containing a polyacetal resin, a hydrazine derivative, and a compound for lowering the melting point of the hydrazine derivative, wherein a mixture of the hydrazine derivative and the compound satisfies both of the following conditions: T101-20-2011 | |
20110049341 | OPTICAL ENCODER - Present invention provides an optical encoder capable of improving the precision of an interpolation angle in a single signal track, in an encoder of sine-wave angle interpolation type. The optical encoder includes a waveform, in which a phase-modulated wave is superimposed in a predetermined period over a sine-wave of a fundamental period, as a signal track ( | 03-03-2011 |
20110170576 | RANGING APPARATUS, POSITIONING APPARATUS, AND METHODS OF RANGING AND POSITIONING THEREFOR - A multipath mitigation technology (MMT) can mitigate the influence of multipath when a received signal is composed of a single direct-path wave and a single multipath wave. However, in an actual environment, it is not always true that the number of multipath wave is only one. When a plurality of multipath waves is included in the received signal, the influence of multipath cannot be completely removed. On the contrary, when no multipath wave is included, an error occurs because a single direct-path wave is deemed as a single direct-path wave and a single multipath wave for estimation. In addition, difficulties arise in calculation when maximum likelihood estimation is performed targeting a time-domain signal. A positioning apparatus estimates parameters for a signal model by applying thereto the maximum likelihood estimation in the frequency domain, and estimates the signal model based on an information criterion, so that multipath errors are mitigated. | 07-14-2011 |
Patent application number | Description | Published |
20110022392 | INFORMATION PROCESSING SYSTEM AND INFORMATION PROCESSING METHOD - A framework is provided which performs location-based analysis using an individual feature such as a stress level obtained based on biological information. An information processing system includes an acquisition unit which acquires frequency power information of a voice inputted at a mobile terminal having a voice communication function, and position information of a base station device that relayed voice communication of the mobile terminal when the voice was inputted; a storage unit which stores the acquired frequency power information and the acquired position information in association with each other; an acceptance unit which accepts designation of an area; and an output unit which identifies the position information related to the designated area, acquires the frequency power information associated with the identified position information with reference to the storage unit, obtains a stress level of a user of the mobile terminal in the designated area based on frequency power information of a frequency greater than or equal to a threshold value within the acquired frequency power information, and outputs the stress level in association with the designated area. | 01-27-2011 |
20120103191 | AIR PURIFICATION SYSTEM AND METHOD FOR CLEANING AIR - Air purification systems comprising a plurality of disks, and methods for their use, are provided. Each of the plurality of disks comprises a metal substrate, an undercoat layer disposed on the metal substrate, a photosensitive layer disposed on the undercoat layer, and a charge transfer layer disposed on the photosensitive layer. | 05-03-2012 |
20120279392 | AIR PURIFICATION SYSTEM AND METHOD FOR CLEANING AIR - Air purification systems comprising a plurality of disks, and methods for their use, are provided. Each of the plurality of disks comprises a metal substrate, an undercoat layer disposed on the metal substrate, a photosensitive layer disposed on the undercoat layer, and a charge transfer layer disposed on the photosensitive layer. | 11-08-2012 |
20130278275 | SENSOR FOR DETECTING DAMAGE TO AN OBJECT - A sensor for detecting damage to an object may include a housing, a first coating provided on a surface of a first end of the housing, and a second coating provided on a surface of a second end of the housing opposing the first end. The first coating may be configured to be exposed to an environment in which the object is placed, while the second coating may be configured to be hermitically sealed. The sensor may further include a plurality of electrodes placed in the housing connected to the first end and the second end so as to measure an electrical signal generated therebetween. | 10-24-2013 |
20130323548 | BATTERY ASSEMBLY, UNIT CELL AND CUT-OFF DEVICE - In an aspect, a battery assembly is adapted to accommodate a plurality of unit cells, the battery assembly has: a unit cell wiring configured to provide at least one connection for the unit cells; a cut-off device having a fuse circuit and a heater circuit, the fuse circuit configured to disconnect the connection by heat produced in the heater circuit; and a power supply wiring configured to supply the heater circuit of the cut-off device with an electric power. | 12-05-2013 |
Patent application number | Description | Published |
20090309673 | BRANCHING FILTER AND METHOD FOR MANUFACTURING THE SAME - A branching filter that is capable of being reduced in size, particularly in height, has a configuration in which a transmitting filter chip and a receiving filter chip include a first piezoelectric substrate and a second piezoelectric substrate, respectively, and are spaced from each other. The transmitting filter chip includes a first insulating layer which extends over an IDT or which is disposed above the IDT. The receiving filter chip includes a first insulating layer which extends over an IDT or which is disposed above the IDT. The upper surfaces of the transmitting and receiving filter chips and are covered with a second insulating layer. External terminals arranged on the upper surface of a third insulating layer are electrically connected to the IDTs and through conductors and extending through the first insulating layers and the second insulating layer and the conductors, and include plating films. | 12-17-2009 |
20100052472 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A method for manufacturing an electronic component includes a first step of preparing a piezoelectric body with a flat surface, a second step of implanting ions into the piezoelectric body such that an ion-implanted layer is formed in the piezoelectric body, a third step of forming sacrificial layers on the flat surface of the piezoelectric body, a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure, a fifth step of dividing the piezoelectric body at the ion-implanted layer to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure. | 03-04-2010 |
20100107388 | METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method for manufacturing an electronic device, an ion implantation layer is formed at a desired depth from one principal surface of a piezoelectric single crystal substrate by implanting hydrogen ions into the piezoelectric single crystal substrate under desired conditions. The piezoelectric single crystal substrate in which the ion implantation layer has been formed is bonded to a supporting substrate, and a piezoelectric thin film is then formed by the application of heat using the ion implantation layer as a detaching interface. This heated detachment is performed at a reduced pressure less than atmospheric pressure and at a heating temperature determined in accordance with the reduced pressure. | 05-06-2010 |
20100108248 | METHOD FOR PRODUCING PIEZOELECTRIC COMPOSITE SUBSTRATE - A method for producing a piezoelectric composite substrate having a single-crystal thin film of a piezoelectric material includes an ion-implantation step and a separation step. In the ion-implantation step, He | 05-06-2010 |
20100112233 | METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - A lower electrode and an adhesive layer made of an insulator are formed on a back surface on the ion implantation layer side of a piezoelectric single crystal substrate. A supporting substrate in which sacrificial layers made of a conductive material have been formed is bonded to the surface of the adhesive layer. By heating the composite body including the piezoelectric single crystal substrate, the lower electrode, the adhesive layer, and the supporting substrate, a layer of the piezoelectric single crystal substrate is detached to form a piezoelectric thin film. A liquid polarizing upper electrode is formed on a detaching interface of the piezoelectric thin film. A pulsed electric field is applied using the polarizing upper electrode and the sacrificial layers as counter electrodes. Consequently, the piezoelectric thin film is polarized. | 05-06-2010 |
20100175236 | METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method for manufacturing a piezoelectric device, an ion implantation layer is formed at a desired depth from one principal surface of a piezoelectric single crystal substrate by implanting hydrogen ions into the piezoelectric single crystal substrate under desired conditions. The piezoelectric single crystal substrate in which the ion implantation layer has been formed is bonded to a supporting substrate, and THG laser light is irradiated from the supporting substrate side. Since the optical absorptance of the piezoelectric single crystal substrate to the THG laser light is higher than that of the supporting substrate, the irradiated light is absorbed primarily at the bonding surface side of the piezoelectric single crystal with the supporting substrate and heat is locally generated. With the generated heat, a piezoelectric thin film is detached from the piezoelectric single crystal substrate using the ion implantation layer as a detaching interface, and a piezoelectric composite substrate including a piezoelectric thin film and the supporting substrate is formed. | 07-15-2010 |
20120284979 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A method for manufacturing an electronic component includes a first step of preparing a piezoelectric body with a flat surface, a second step of implanting ions into the piezoelectric body such that an ion-implanted layer is formed in the piezoelectric body, a third step of forming sacrificial layers on the flat surface of the piezoelectric body, a fourth step of forming an insulating body over the flat surface of the piezoelectric body and the sacrificial layers to form a piezoelectric structure, a fifth step of dividing the piezoelectric body at the ion-implanted layer to form a piezoelectric laminar structure in which a piezoelectric film separated from the piezoelectric body is bonded to the insulating body, a sixth step of forming electrodes on portions of a division surface of the piezoelectric film, and a seventh step of removing the sacrificial layers from the piezoelectric laminar structure. | 11-15-2012 |
Patent application number | Description | Published |
20080260748 | Methods for Damaging Cells Using Effector Function of Anti-Dsc2 Antibody - The present invention is based on the discovery that the cytoxicity of anti-desmocollin 2 (DSC2) antibodies can be used for treating various cancers including lung, colon, pancreatic, prostate, breast, gastric or liver cancers. Specifically, the present invention provides antibodies against DSC2 that have effector function. Furthermore, the present invention provides methods and pharmaceutical compositions that comprise anti-DSC2 antibody as an active ingredient for damaging DSC2-expressing cells via the effector function of the antibody. | 10-23-2008 |
20090155219 | METHODS FOR DAMAGING CELLS USING EFFECTOR FUNCTIONS OF ANTI-GFRA1 ANTIBODIES - The present invention relates to the use of cytoxicity based on the effector function of anti-GFRA1 antibodies. Specifically, the present invention provides methods and pharmaceutical compositions that comprise an anti-GFRA1 antibody as an active ingredient for damaging GFRA1-expressing cells using antibody effector function. Since GFRA1 is strongly expressed in breast, gastric, liver, renal or lung cancer cells, the present invention is useful in breast, gastric, liver, renal or lung cancer therapies. | 06-18-2009 |
Patent application number | Description | Published |
20110203839 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A wiring substrate with improved heat dissipation capability and with reduced size is disclosed. The wiring substrate includes a metal core substrate, a buffer layer formed so as to cover at least a part of the metal core substrate and containing a phase change material or a material with an electrocaloric effect, an electronic device mounted on a surface of a base including the metal core substrate and the buffer layer or inside the base, and a thermal via formed between the electronic device and the buffer layer. | 08-25-2011 |
20110206361 | IMAGE TAKING DEVICE AND IMAGE TAKING METHOD - An image taking device and an image taking method are provided. The image taking device and image taking method allow a shutter to be released without having to apply much force while preventing camera shake that can occur during image taking of a subject and while preventing unintended release of the shutter. | 08-25-2011 |
20110206910 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR DISASSEMBLING WIRING SUBSTRATE - Embodiments provide a wiring substrate that allows a wire to be released from an insulating material after use, a method for manufacturing the wiring substrate, and a method for disassembling the wiring substrate. A wiring substrate includes a release layer formed between an insulating material and a wire. The release layer is configured to reduce an a strength of adhesion between the wire and the insulating layer when disassembling or recycling the wiring substrate. | 08-25-2011 |
20120184649 | CORROSION-RESISTANT METAL-REINFORCED COMPOSITES - Disclosed herein are metal-reinforced composites that can exhibit improved corrosion resistance. In particular, the composites may include a polymer dispersed within a binding medium that can impede or inhibit the corrosive effects caused by certain salts. The composites, for example, can be prepared without departing from standard procedures for preparing the composite. Also disclosed herein are methods of making the composite, corrosion-resistant components of the composite, and methods of making the corrosion-resistant components. | 07-19-2012 |
20130091803 | BARRIERS AND FILMS - Provided herein are various bathers and methods of making and using them. In some embodiments, the barriers include a porous crystalline charge-transfer complex and a filler. | 04-18-2013 |
20130146664 | CODED FIBERS - Provided herein are coded fibers. In some embodiments, informationally-encoded carbon fiber structures are provided. In some embodiments, methods of manufacturing and/or reading a coded fiber are provided. | 06-13-2013 |
20130199916 | ELONGATIONAL STRUCTURES - The present disclosure generally relates to expandable electrodes and/or components that are expandable and/or flexible during, prior to, and/or after the manufacture of the electrodes. | 08-08-2013 |
Patent application number | Description | Published |
20110266918 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - A piezoelectric device includes IDT electrodes and solves various problems resulting from the IDT electrodes. The piezoelectric device has a configuration in which a piezoelectric thin-film and a support are bonded together such that the piezoelectric thin-film is supported by the support. IDT electrodes and interconnect electrodes are provided on a surface of the piezoelectric thin-film that is located on the support side. The piezoelectric thin-film includes a region in which the IDT electrodes are provided and on which no support is provided but an opening is formed. This allows the IDT electrodes and the piezoelectric thin-film and the IDT electrode-formed region of the piezoelectric thin-film to not be in contact with the support, thereby defining a membrane including only the piezoelectric thin-film and the IDT electrodes as elements, the piezoelectric thin-film and the IDT electrodes being disposed therein and being important for properties of the piezoelectric device. | 11-03-2011 |
20110277928 | METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE - A method for manufacturing a composite substrate that prevents undesirable effects of etching a thin film includes a pattern forming step, an ion implanting step, a bonding step, and a separation step. In the pattern forming step, a pattern region and a reverse pattern region are formed on a principal surface of a functional material substrate. In the ion implanting step, by implanting ions into the functional material substrate, a separation layer is formed inside at a certain distance from the surface of each of the pattern region and the reverse pattern region. In the bonding step, the functional material substrate at the pattern region is bonded to a supporting substrate. In the separation step, the pattern region is separated from the functional material substrate, and the reverse pattern region is made to fall off. | 11-17-2011 |
20110278993 | METHOD FOR MANUFACTURING COMPOSITE PIEZOELECTRIC SUBSTRATE AND PIEZOELECTRIC DEVICE - A piezoelectric device is manufactured in which the material of a supporting substrate can be selected from various alternative materials. Ions are implanted into a piezoelectric substrate to form an ion-implanted portion. A temporary supporting substrate is formed on the ion-implanted surface of the piezoelectric substrate. The temporary supporting substrate includes a layer to be etched and a temporary substrate. The piezoelectric substrate is then heated to be divided at the ion-implanted portion to form a piezoelectric thin film. A supporting substrate is then formed on the piezoelectric thin film. The supporting substrate includes a dielectric film and a base substrate. The temporary supporting substrate is made of a material that produces a thermal stress at the interface between the temporary supporting substrate and the piezoelectric thin film less than the thermal stress at the interface between the supporting substrate and the piezoelectric thin film. | 11-17-2011 |
20120073099 | METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - An ion implantation layer is formed in a piezoelectric single crystal substrate by implanting hydrogen ions. A lower electrode is formed on the surface of the piezoelectric single crystal substrate at a side at which the ion implantation layer is formed. A sacrificial layer is formed on the surface of the piezoelectric single crystal substrate at a side at which the ion implantation layer and the lower electrode are formed. The formation of the sacrificial layer is performed by direct formation thereof on the surface of the piezoelectric single crystal substrate, for example, by sputtering or coating. A support layer is formed on the piezoelectric single crystal substrate on which the sacrificial layer is formed, and after the surface of the support layer is planarized, a support base material is bonded thereto. | 03-29-2012 |
20120098387 | ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME - An elastic wave device includes a piezoelectric thin film formed from a piezoelectric single crystal substrate by peeling, an inorganic layer formed on a rear surface of the piezoelectric thin film, an elastic layer disposed on a surface of the inorganic layer opposite to the piezoelectric thin film, and a support member adhered to a surface of the elastic layer opposite to the inorganic layer. The elastic layer reduces stress generated when the piezoelectric thin film provided with the inorganic layer and the support member are adhered to each other and has a predetermined elastic modulus. The inorganic layer is formed of a material having a higher elastic modulus than that of the elastic layer and prevents damping generated when the elastic layer is provided. | 04-26-2012 |
20120205754 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - A piezoelectric device includes a piezoelectric thin film formed by separating and forming a piezoelectric single crystal substrate, an inorganic layer formed on a back surface of the piezoelectric thin film, an elastic body layer disposed on a surface opposite to the piezoelectric thin film of the inorganic layer, and a support pasted to a surface opposite to the inorganic layer of the elastic body layer. In a membrane structure portion, the inorganic layer and the elastic body layer are disposed on the piezoelectric thin film through a gap layer. The elastic body layer reduces a stress caused by pasting the piezoelectric thin film including the inorganic layer and the support and has a certain elastic modulus. The inorganic layer is formed with a material having an elastic modulus higher than that of the elastic body layer and suppresses damping caused by disposing the elastic body layer. | 08-16-2012 |
20140130319 | METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method of manufacturing a piezoelectric device, a compressive stress film is formed on a back surface of a piezoelectric single crystal substrate opposite to a surface on an ion-implanted side. The compressive stress film compresses the surface on the ion-implanted side of the piezoelectric single crystal substrate. The compressive stress produced by the compressive stress film is applied to half of the piezoelectric single crystal substrate on the ion-implanted side with respect to the center line of the thickness of the piezoelectric single crystal substrate to prevent the piezoelectric single crystal substrate from warping. A supporting substrate is then bonded to the surface of a bonding film on the flat piezoelectric single crystal substrate. The joined body of the piezoelectric single crystal substrate and the supporting substrate is then heated to initiate isolation at the ion-implanted portion as the isolation plane. | 05-15-2014 |
20140139075 | PIEZOELECTRIC DEVICE AND METHOD FOR PRODUCING PIEZOELECTRIC DEVICE - A piezoelectric device that prevents defects due to pyroelectric charge without limiting how the piezoelectric device can be used includes a first metal layer located on a bonding surface of a piezoelectric single crystal substrate. A second metal layer is located on a bonding surface of a support substrate. The first and second metal layers are overlaid on each other to define a metal bonded layer. Subsequently, by oxidizing the metal bonded layer, a semi-conducting layer is formed. | 05-22-2014 |
20140167565 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method for manufacturing a piezoelectric device while stably achieving strong bonding, a moisture-absorbing layer is formed on a bonding surface side of a piezoelectric single-crystal substrate. The moisture-absorbing layer is allowed to absorb moisture. A binder layer is formed on a bonding surface side of a supporting substrate. The moisture-absorbing layer is placed on the binder layer. A silica precursor in the binder layer is converted into silica through a hydrolysis reaction with moisture in the moisture-absorbing layer. | 06-19-2014 |
20140191619 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - In a method of manufacturing a piezoelectric device, among a +C plane on a +Z axis side of a piezoelectric thin film and a −C plane on a −Z axis side of the piezoelectric thin film, the −C plane on the −Z axis side of the piezoelectric thin film is etched. Thus, −Z planes of the piezoelectric thin film on which epitaxial growth is possible are exposed. Ti is epitaxially grown on the −Z planes of the piezoelectric thin film in the −Z axis direction such that the crystal growth plane thereof is parallel to the −Z planes of the piezoelectric thin film. Al is then epitaxially grown on the surface of the Ti electrode in the −Z axis direction such that the crystal growth plane thereof is parallel to the −Z planes of the piezoelectric thin film. | 07-10-2014 |
20150028966 | ELASTIC WAVE FILTER DEVICE AND MANUFACTURING METHOD OF THE SAME - An elastic wave filter device includes a transmission elastic wave filter chip and a reception elastic wave filter chip. The transmission elastic wave filter chip includes an insulating support substrate, a piezoelectric layer directly or indirectly supported by the support substrate, and an IDT electrode in contact with the piezoelectric layer. The reception elastic wave filter chip includes a piezoelectric substrate and an IDT electrode provided on the piezoelectric substrate. The thermal conductivity of the support substrate is higher than the thermal conductivity of either of the piezoelectric layer and the piezoelectric substrate. | 01-29-2015 |
20150035413 | PIEZOELECTRIC DEVICE AND METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE - A piezoelectric device includes a piezoelectric thin film formed by separating and forming a piezoelectric single crystal substrate, an inorganic layer formed on a back surface of the piezoelectric thin film, an elastic body layer disposed on a surface opposite to the piezoelectric thin film of the inorganic layer, and a support pasted to a surface opposite to the inorganic layer of the elastic body layer. In a membrane structure portion, the inorganic layer and the elastic body layer are disposed on the piezoelectric thin film through a gap layer. The elastic body layer reduces a stress caused by pasting the piezoelectric thin film including the inorganic layer and the support and has a certain elastic modulus. The inorganic layer is formed with a material having an elastic modulus higher than that of the elastic body layer and suppresses damping caused by disposing the elastic body layer. | 02-05-2015 |