Patent application number | Description | Published |
20090008800 | FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING APPARATUS - The flip chip mounted body of the present invention includes: a circuit board ( | 01-08-2009 |
20090023245 | FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD - The invention involves mounting a solder resin composition ( | 01-22-2009 |
20090085227 | FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD - A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body. | 04-02-2009 |
20090203169 | FLIP CHIP MOUNTING BODY AND METHOD FOR MOUNTING SUCH FLIP CHIP MOUNTING BODY AND BUMP FORMING METHOD - In a flip chip mounted body in which a semiconductor chip ( | 08-13-2009 |
20090203170 | FLIP CHIP MOUNTING METHOD, FLIP CHIP MOUNTING APPARATUS AND FLIP CHIP MOUNTING BODY - A flip chip mounting method includes holding a circuit board ( | 08-13-2009 |
20100012936 | MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE - A layered film of a three-layer clad foil formed with a first metal layer | 01-21-2010 |
20100182144 | RFID MAGNETIC SHEET, NONCONTACT IC CARD AND PORTABLE MOBILE COMMUNICATION APPARATUS - Provided is a RFID magnetic sheet to be attached to an IC tag. The RFID magnetic sheet is provided with a plurality of stripe arranged layers ( | 07-22-2010 |
20100203675 | FLIP CHIP MOUNTING BODY, FLIP CHIP MOUNTING METHOD AND FLIP CHIP MOUNTING APPARATUS - The flip chip mounted body of the present invention includes: a circuit board ( | 08-12-2010 |
20100276691 | METHOD FOR FABRICATING FLEXIBLE SEMICONDUCTOR DEVICE AND LAYERED FILM USED THEREFORE - A method for fabricating a flexible semiconductor device includes: preparing a layered film | 11-04-2010 |
20100283054 | FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - There is provided a method for manufacturing a flexible semiconductor device characterized by comprising (i) a step of forming an insulating film on the upper surface of metal foil, (ii) a step of forming an extraction electrode pattern on the upper surface of the metal foil, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, (iv) a step of forming a sealing resin layer on the upper surface of the metal foil in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) a step of forming electrodes by etching the metal foil, wherein the metal foil is used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). A TFT element can be fabricated by a simple process because the metal foil serving as the support need not be finally stripped off. Further, a high-temperature process can be introduced to the fabrication of the insulating film and the semiconductor layer because the metal foil is used as the support, whereby the TFT characteristic is improved. | 11-11-2010 |
20110049598 | MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE - A layered film of a three-layer clad foil formed with a first metal layer | 03-03-2011 |
20110121298 | MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE - A method includes the steps of preparing a multilayer film | 05-26-2011 |
20110133137 | METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCESS AND BUMP-FORMING PROCESS USING THE SAME - A flip chip mounting process wherein a semiconductor chip and a circuit substrate are electrically interconnected. The process includes the steps of preparing a semiconductor chip on which a first plurality of electrodes are formed and a circuit substrate on which a second plurality of electrodes are formed; supplying a composition onto a surface of the circuit substrate, such surface being provided with second plurality of electrodes; bringing the semiconductor chip into contact with a surface of said composition such that the first plurality of electrodes are opposed to the second plurality of electrodes; and heating the circuit substrate, and thereby electrical connections including a metal component constituting the metal particles dispersed in the composition are formed between the first plurality of electrodes and the second plurality of electrodes. Also, a thermoset resin layer is formed between the semiconductor chip and the circuit substrate. | 06-09-2011 |
20110162578 | FLIP-CHIP MOUNTING METHOD AND BUMP FORMATION METHOD - [Problem] To provide a flip-chip mounting method and a bump formation method applicable to flip-chip mounting of a next generation LSI and having high productivity and high reliability. | 07-07-2011 |
20110201195 | FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD - The invention involves mounting a solder resin composition ( | 08-18-2011 |
20120181543 | FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - Disclosed are a flexible semiconductor device and manufacturing method therefor whereby the capacitances of capacitor parts of semiconductor elements and the like can be increased while decreasing parasitic capacitances that arise between multilevel interconnections. The disclosed flexible semiconductor device is provided with an insulating film on which a semiconductor element is formed. The top and bottom surfaces of the insulating film have a top wiring pattern layer and a bottom wiring pattern layer, respectively. The semiconductor element comprises: a semiconductor layer formed on the top surface of the insulating film; a source electrode and a drain electrode formed on the top surface of the insulating film so as to contact the semiconductor layer; and a gate electrode formed on the bottom surface of the insulating film so as to be opposite the semiconductor layer. A first thickness, which is the thickness of the insulting film facing the source electrode, the drain electrode, the top wiring pattern layer, and the bottom wiring pattern layer, is greater than a second thickness, which is the thickness of the insulating film between the gate electrode and the semiconductor layer. | 07-19-2012 |
20130168677 | FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used. | 07-04-2013 |
20140151085 | TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING THE SAME - There is provided a transparent electrode comprising a supporting substrate, a first transparent electrically-conductive film provided on the supporting substrate, a transparent insulating film provided on the first transparent electrically-conductive film, and a second transparent electrically-conductive film provided on the transparent insulating film. In the transparent electrode of the present invention, all of the first transparent electrically-conductive film, the second transparent electrically-conductive film and the transparent insulating film provided therebetween comprise a metal compound, and the first transparent electrically-conductive film and the second transparent electrically-conductive film have a crystalline structure, whereas the transparent insulating film has an amorphous structure. | 06-05-2014 |