| Patent application number | Description | Published |
|---|
| 20110095843 | HIGH-FREQUENCY MODULE - In a high-frequency module, a duplexer element and a matching element are mounted on a surface of a multilayer substrate. On a layer close to the surface, an individual-terminal-side wiring electrode connected to an individual terminal of the duplexer element is provided. On two layers below the layer close to the surface, first and second ground electrodes are respectively provided. On a layer below the layers on which the first and second ground electrodes are provided, a common-terminal-side wiring electrode connected to the common terminal of the duplexer element and one end of the matching element is provided. On a layer close to a bottom surface of the multilayer substrate, a third ground electrode connected to the other end of the matching element is provided. | 04-28-2011 |
| 20110109401 | HIGH-FREQUENCY MODULE - A high-frequency switch module includes an ESD device, a switch IC, and a SAW filter element that are mounted on the surface of a multilayer substrate. A ground-side land for the ESD device is connected to an external-connection ground electrode for the ESD device by via holes and plane electrode patterns. A ground connection land for the switch IC and a ground connection land for the SAW filter element are connected to a common inner ground electrode by via holes, and are connected to a common external-connection ground electrode by via holes and another common inner ground electrode. | 05-12-2011 |
| 20110133850 | HIGH-FREQUENCY MODULE - A high frequency module includes RF terminal lands at a first layer that is a surface layer of a multilayer substrate on which RF terminal electrodes of a switch IC are mounted that are arranged in a line. Each of the RF terminal lands is electrically connected to one end of a lead electrode at a second layer via a via hole. Some of the lead electrodes extend from corresponding ones of the RF terminal lands in an outward direction away from a side of the switch IC. The remaining ones of the lead electrodes extend from corresponding ones of the RF terminal lands in an inward direction that is opposite to the outward direction. | 06-09-2011 |
| 20110193614 | HIGH-FREQUENCY SWITCH MODULE AND HIGH-FREQUENCY SWITCH APPARATUS - A high-frequency switch module includes a multi-layer substrate, and a switch circuit mounted on the multi-layer substrate. The multi-layer substrate includes a terminal through which a plurality of high-frequency signals in a plurality of frequency bands are input and output, a plurality of switch terminals, terminals to which control signals to control the switch circuit are supplied, current paths that connect the terminals to the switch circuit, and resistors that are provided on the current paths and have resistance values greater than the resistance values of the current paths. The switch circuit connects the terminal to the switch terminals corresponding to the frequency bands of high-frequency signals input and output through the terminal based on the control signals. | 08-11-2011 |
| 20110234295 | HIGH-FREQUENCY SWITCH MODULE - A high-frequency switch module includes a switch IC. An impedance matching circuit is connected to the antenna port of the switch IC. The impedance matching circuit includes a high-pass filter and a low-pass filter. The high-pass filter is disposed on the side of the antenna port, and is a substantially L-shaped circuit including a capacitor and an inductor. The antenna port is connected to the ground by the inductor. | 09-29-2011 |
| 20110300820 | HIGH-FREQUENCY MODULE - A high-frequency module includes a switch IC. An antenna filter is connected to a common terminal of the switch IC and arranged adjacent to an antenna. The antenna filter is a low-pass filter whose attenuation band includes higher harmonic frequency bands of GSM1800/GSM1900 transmission signals and TDS-CDMA transmission signals. An individual-terminal filter is connected to one individual terminal of the switch IC. The individual-terminal filter is a low-pass filter whose attenuation band includes higher harmonic frequency bands of GSM850/GSM900 transmission signals. | 12-08-2011 |
| 20120075002 | HIGH-FREQUENCY SWITCH MODULE - A high-frequency switch module that significantly reduces deterioration of high-frequency characteristics and improves harmonic wave distortion characteristics includes a high-frequency switch and SAW filters mounted on a multilayer substrate. Low pass filters are provided within the multilayer substrate. The terminals of the high-frequency switch are located on the bottom surface of the semiconductor substrate. The high-frequency switch includes a high-frequency circuit ground terminal and a control circuit ground terminal, the multilayer substrate includes therein a ground electrode which is electrically connected to a top surface connection electrode to which the high-frequency circuit ground terminal is connected, and a wiring electrode electrically connected to a top surface connection electrode to which the control circuit ground terminal is connected is arranged so as to be insulated from the ground electrode. | 03-29-2012 |
| 20120206886 | HIGH-FREQUENCY MODULE - In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged to output a negative voltage applied to the switch element and which is mounted on the laminate, are integrally formed. A test external terminal for external connection which outputs a signal to the outside is provided on a back surface of the laminate. The laminate includes a voltage transmission path electrically connecting the test terminal to the test external terminal. | 08-16-2012 |
| 20120208475 | HIGH-FREQUENCY MODULE - In a high frequency module, an inductor is formed with a common terminal of a switch element as a starting point so as to wind in a substantially spiral shape clockwise when viewed from an upper surface side of a laminated body, and inductors are formed with a first individual external terminal and a second individual external terminal as starting points so as to wind in a substantially spiral shape clockwise when viewed from the upper surface side of the laminated body, the first individual external terminal and the second individual external terminal defining input ends of transmission signals. Other inductors are also formed so as to wind in a substantially spiral shape clockwise when viewed from the upper surface side of the laminated body such that all the directions of magnetic fields generated by the inductors coincide with one another. | 08-16-2012 |
| 20120208591 | HIGH-FREQUENCY MODULE - In a high-frequency module, a first individual terminal in a switch IC is connected to a first filter and a third filter whose pass bands are far from each other. A low-pass-filter phase circuit including an inductor and a capacitor is connected between the first individual terminal and the first filter. A second individual terminal is connected to a second filter and a fourth filter whose pass bands are far from each other. A low-pass-filter phase circuit is connected between the second individual terminal and the second filter. | 08-16-2012 |
