Patent application number | Description | Published |
20080273438 | ELECTRONIC APPARATUS AND PERSONAL COMPUTER - An electronic apparatus includes: a housing that is provided with an opening at a bottom face thereof; a printed circuit board accommodated in the housing; a first lid member that is detachably arranged so as to cover the opening; a disk drive that is mounted in a lower position than the printed circuit board inside the opening in a state where the first lid member is removed from the opening; and a second lid member that is detachably arranged so as to cover the opening in a state where the disk drive is mounted inside the opening, wherein the second lid member has a storage section, and the disk drive is stored in the storage section. | 11-06-2008 |
20090073655 | ELECTRONIC APPARATUS AND DAUGHTERBOARD - An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller. | 03-19-2009 |
20100172097 | ELECTRONIC APPARATUS AND DAUGHTERBOARD - An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller. | 07-08-2010 |
20110205714 | ELECTRONIC APPARATUS AND DAUGHTERBOARD - A daughterboard to be attached to a motherboard on which a host controller is mounted includes a first connector electrically connected to the host controller, a bridge controller electrically connected to the first connector, a chip electrically connected to the bridge controller, and a second connector electrically connected to the bridge controller and configured to electrically connect to other daughterboards. | 08-25-2011 |
Patent application number | Description | Published |
20090296977 | Electronic Apparatus - According to one embodiment, an electronic apparatus includes a housing including a top wall, a keyboard supported on the top wall, and a speaker contained in the housing. A region of the top wall positioned on the front side of the keyboard comprises a palm-rest surface on which a user's hand is to be placed, and a speaker exposure surface including an opening part exposing the speaker to an outside of the housing. The speaker exposure surface is depressed and lower than the palm-rest surface. | 12-03-2009 |
20110141673 | Electronic Apparatus - According to one embodiment, an electronic apparatus includes a housing including a top wall, a keyboard supported on the top wall, and a speaker contained in the housing. A region of the top wall positioned on the front side of the keyboard comprises a palm-rest surface on which a user's hand is to be placed, and a speaker exposure surface including an opening part exposing the speaker to an outside of the housing. The speaker exposure surface is depressed and lower than the palm-rest surface. | 06-16-2011 |
20120026406 | ELECTRONIC DEVICE AND INPUT-SIGNAL SWITCHING METHOD - According to one embodiment, an electronic device receives inputs of video signals from a plurality of input systems. The electronic device includes a priority determination table, a video switching instruction module, a video switching module. In the priority determination table, video display priorities of the video signals from the input systems are determined in advance. The video switching instruction module instructs to switch among the video signals from the input systems on the basis of the priorities determined in the priority determination table. The video switching module switches among the video signals from the input systems according to a switching instruction from the video switching instruction module. | 02-02-2012 |
Patent application number | Description | Published |
20090078455 | LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME - Provided are: a light emitting module which has an improved heat-dissipating property and whose reflectance reduction is prevented. The light emitting module mainly includes: a metal substrate; a conductive pattern formed on the upper surface of the metal substrate; and a light emitting element disposed on the upper surface of the metal substrate and electrically connected to the conductive pattern. Furthermore, in the light emitting module, an insulating layer is removed in a region where the conductive pattern is not formed, but is left unremoved in a region right below (or covered with) the conductive pattern. In other words, in the region where the conductive pattern is not formed, the upper surface of the metal substrate is not covered with the conductive pattern, and a metal material constituting the metal substrate is exposed. | 03-26-2009 |
20090129038 | CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a simplified structure of a circuit device in which a power element generating a large amount of heat is incorporated. The circuit device according to the present invention includes: a circuit board whose surface is covered with an insulating layer; a conductive pattern formed on the surface of the insulating layer; a circuit element electrically connected to the conductive pattern; and a lead connected to a pad formed of the conductive pattern. Furthermore, a power element is fixed to the top surface of a land portion formed of a part of the lead. Accordingly, the land portion serves as a heat sink, thereby contributing to heat dissipation. | 05-21-2009 |
20090135572 | Circuit Device and Method of Manufacturing the Same - Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface of the circuit boards. Furthermore, these circuit boards are integrally supported by a sealing resin. Moreover, a lead connected to the electronic circuit formed on the surface of the circuit board is led out from the sealing resin to the outside. | 05-28-2009 |
20100299920 | METHODS FOR MANUFACTURING DEVICE MOUNTING BOARD AND CIRCUIT SUBSTRATE - To reduce connection defects between a circuit substrate provided on a core substrate and a circuit to be mounted thereon, thereby improving reliability as a multilayered device mounting substrate. The device mounting substrate includes: a first circuit substrate composed of a substrate, an insulating layer formed on this substrate, and a first conductive layer (including conductive parts) formed on this insulating layer; and a second circuit substrate mounted on the first circuit substrate, being composed of a base, a second conductive layer (including conductive parts) formed on the bottom of the base, and a third conductive layer (including conductive parts) formed on the top of the base. Here, the first and second circuit substrates are bonded by pressure so that the first and second conductive parts are laminated and embedded together into the insulating layer. The first and second conductive parts form connecting areas in the insulating layer, thereby connecting the first and second circuit substrates electrically. | 12-02-2010 |
20160135293 | SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE - A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces. | 05-12-2016 |
Patent application number | Description | Published |
20090166895 | CIRCUIT SUBSTRATE, CIRCUIT DEVICE AND MANUFACTURING PROCESS THEREOF - A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces. | 07-02-2009 |
20110121335 | LIGHT EMITTING MODULE AND MANUFACTURING METHOD THEREOF - Provided are a light emitting module and a manufacturing method thereof, the light emitting module having improved heat radiation properties and improved adhesion between a sealing resin for sealing a light emitting element and other members. A light emitting module | 05-26-2011 |
20120018201 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FOIL PROVIDED WITH INSULATING LAYER - Provided are a circuit board easy to process by laser and a manufacturing method thereof A circuit board of the present invention includes a substrate, an insulating layer covering an upper surface of the substrate, and a conductive pattern of a predetermined shape formed on an upper surface of the insulating layer. The insulating layer is made of a resin material highly filled with a filler made of silica. Further, a colorant made of an inorganic material is added to the resin material. Accordingly, when a laser is radiated onto the insulating layer in order to perform cutting and removing processing, the insulating layer is removed because the laser is absorbed by the colored resin material. | 01-26-2012 |