Taillefer
Eric Taillefer, Quebec CA
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20110156898 | ENVIRONMENT SENSING SYSTEM FOR THE HEARING-IMPAIRED - There is provided an environment sensing system for the deaf/hearing-impaired. A user wears a personal unit for notifying him/her of a sound event in its surrounding environment. The personal unit is also in communication with a central station, for the user to request immediate assistance. When receiving a sound event message from a sound detection unit in the environment, the personal unit vibrates and displays a notification on a screen. At any time, the user may request immediate assistance to the central station using push buttons located on the personal unit. The central station may contact the user by displaying inquiries or messages on the screen. The user may then confirm that immediate assistance is actually required or communicate more information to the central station using the push buttons. | 06-30-2011 |
Jean-Paul Taillefer, Buzet Sur Tarn FR
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20120211040 | BOTTOM-TRIGGERING WIND SAFETY UMBRELLA - The invention relates to an umbrella including a security system having a triggering device located on the contact area of the mast with the ground. The triggering device includes a slider, a slider return spring, a flexible transmission assembly connected to the head of the slider; a mechanism to inactivate the trigger, including a cam pivotally mounted on the trigger and capable of resting against the mast. | 08-23-2012 |
Kevin Taillefer, Calgary CA
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20140076891 | FASTENING SYSTEM FOR MODULAR CONTAINERS - A fastening system for use with a modular panel assembly having at least two panels includes one or more securing apertures formed through a first panel and one or more engaging projections provided on a second panel, each one of the engaging projections being sized and positioned to be engageable with a corresponding one of the securing apertures on the first panel. Panels for use in forming a modular panel assembly, modular containers, and methods of constructing modular containers are provided. | 03-20-2014 |
20140158681 | FASTENING ASSEMBLY FOR MODULAR CONTAINER - Modular panels for forming a container have a plurality of securing receptacles on a first end of the panel and a plurality of securing receptacles on a second end of the panel. Each one of the securing receptacles on the first end of the panel is position at approximately the same height as a corresponding one of the securing receptacles on the second end of the panel. Each pair of corresponding securing receptacles is dimensioned to receive a securing bar therein that can be locked in place to hold adjacent panels in a secured position. | 06-12-2014 |
Marc Taillefer, Vailhauques FR
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20090326240 | Iron-Copper Co-Catalyzed Process for Carbon-Carbon or Carbon-Heteroatom Bonding - The present invention relates to a process for creating a Carbon-Carbon bond (C—C) or a Carbon-Heteroatom bond (C—HE) by reacting a compound carrying a leaving group with a nucleophilic compound carrying a carbon atom or a heteroatom (HE) that can substitute for the leaving group, creating a C—C or C—HE bond, wherein the reaction takes place in the presence of an effective quantity of a catalytic system comprising iron and copper. | 12-31-2009 |
20100121076 | METHOD FOR THE PREPARATION OF PHOSPHINE BUTADIENE LIGANDS, COMPLEXES THEREOF WITH COPPER AND USE THEREOF IN CATALYSIS - The present invention relates to a method for preparing phosphine butadiene-type ligands, and their use, particularly as catalytic metal ligands used in the reactions leading to the formation of carbon-carbon and carbon-heteroatom bonds. | 05-13-2010 |
20100298569 | USE OF CYCLOVINYL PHOSPHINE/COPPER COMPLEXES AS ARYLATION CATALYSTS - The invention relates to the use of cyclovinyl phosphine compounds in the form of complexes with copper, as catalysts for reactions leading to the formation of carbon-carbon and carbon-heteroatom bonds. The invention also relates to complexes of copper with at least one cyclovinyl phosphine, as well as to the method for creating a carbon-carbon or a carbon-heteroatom bond catalysed by a cyclovinyl phosphine/copper complex. | 11-25-2010 |
20100298571 | ARYLAMINE SYNTHESIS METHOD - The invention relates to a method for preparing arylamines and, in particular, a method for preparing aniline and anilines substituted on the aromatic ring from ammonia, under easily-industrialised mild conditions with good selectivity and yields, in the presence of a catalytic system including a copper complex. | 11-25-2010 |
20110306782 | New Catalytic System for Cross-Coupling Reactions - The present invention concerns a process for creating a Carbon-Carbon bond (C—C) or a Carbon-Heteroatom bond (C-HE) by reacting a compound carrying a leaving group with a nucleophilic compound carrying a carbon atom or a heteroatom (HE) that can substitute for the leaving group, creating a C—C or C-HE bond, wherein the reaction takes place in the presence of an effective quantity of a. a catalytic system comprising a ligand and at least a metal-based catalyst, such a metal catalyst being chosen among iron or copper compounds proviso that only a single metal is present. | 12-15-2011 |
20120157704 | Method for the Hydroxylation of Halogenated Aryl Compounds - The present invention relates to a method for the hydroxylation of halogen aryl compounds carried out at a temperature lower than 200° C. in the presence of a catalytic system including a copper-based catalyst and a ligand L according to reaction scheme Formula (A), in which: R is selected from the groups having an acceptor inductive effect and the groups having a donor mesomer effect; M is selected from alkaline or alkaline-earth cations; X is a halogen atom; r is between 0 and 5; and the ligand L is selected from compounds having formula I. | 06-21-2012 |
20130165667 | METHOD FOR THE PREPARATION OF PHOSPHINE BUTADIENE LIGANDS, COMPLEXES THEREOF WITH COPPER AND USE THEREOF IN CATALYSIS - A method for the creation of a carbon-carbon (C—C) bond or of a carbon-heteroatom (C-HE) bond includes reacting a compound carrying a leaving group with a nucleophilic compound carrying a carbon atom or a heteroatom (HE) capable of replacing the leaving group, thus creating a C—C or C-HE bond, in which process the reaction is carried out in the presence of an effective amount of a catalytic system comprising at least one copper/butadienylphosphine complex. | 06-27-2013 |
Marc Taillefer, Vaihauques FR
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20090240061 | Method for forming a carbon-carbon or carbon-heteroatom bond - The invention relates to a method for forming a carbon-carbon or carbon-heteroatom bond by reacting an unsaturated compound carrying a leaving group and a nucleophilic compound, in the absence of a ligand. The aim of the invention is especially to form carbon-nitrogen bonds according to a method for the arylation of nitrogenated organic derivatives. According to the inventive method, a carbon-carbon or carbon-heteroatom bond is formed by reacting an unsaturated compound carrying a leaving group with a nucleophilic compound donating a carbon atom or a heteroatom (HE) that can substitute the leaving group, thus forming a C—C or C—HE bond, in the presence of a copper-based catalyst and a base. Said metal is characterised in that the reaction takes place in the absence of a ligand and in a nitrile-type solvent. | 09-24-2009 |
Martin Taillefer, Mountain View, CA US
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20080215305 | Emulated Memory Management - A first software program executing on a computing device emulates a second computing device executing a software program using emulated memory. The first software program permits the second software program to perform an operation on a contiguous portion of the emulated memory only when a pointer and a table entry both contain the same identifier, thus protecting against common types of memory usage errors in the second software program. The pointer has an address to the contiguous portion. The table entry maps to the contiguous portion. A plurality of table entries map to a respective plurality of contiguous portion of the emulated memory. A plurality of the pointers each contain the address to a respective contiguous portion of the emulated memory as well as containing an identifier corresponding to the respective contiguous portion of the emulated memory. The second computing device can be high or low in resources. | 09-04-2008 |
Régis Taillefer, Le Versoud FR
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20150131251 | PROCESS FOR MANUFACTURING AN ELECTRICALLY CONDUCTIVE MEMBER FOR AN ELECTRONIC COMPONENT COMPRISING AN END EQUIPPED WITH A CAVITY - This process for manufacturing an electrically conductive member for an electronic component comprises the following steps: providing a structure comprising at least one blind hole having a bottom and at least one internal lateral flank connected to said bottom via a base of said lateral flank; forming the member, this forming step comprising a step of growing an electrically conductive material in order to form at least one portion of the member in the blind hole, said growth being faster at the base of the lateral flank of the blind hole than on the rest of said lateral flank, said member when formed comprising a cavity arranged at that end of said member which is located opposite the bottom of the blind hole, said cavity being entirely or partially bordered by a rim. | 05-14-2015 |
Régis Taillefer, Le Versoud FR
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20120064671 | METHOD FOR PRODUCING CHIP ELEMENTS EQUIPPED WITH WIRE INSERTION GROOVES - The invention relates to a method for producing chip elements provided with a groove, comprising the following steps: on an interconnect substrate, providing a conductive track arranged to connect a contact area of an active surface of a chip to an area corresponding to a first wall of the groove; growing a contact bump by electrodeposition on the conductive track at the level of the area corresponding to the first wall of the groove; assembling the chip on the substrate via its active surface so that a side wall of the chip forms the bottom of the groove; machining the chip via its rear surface in parallel to the substrate while measuring the distance between the rear surface of the chip and the contact bump; stopping machining when the measured distance reaches a required value; and assembling by bonding a plate to the rear surface of the chip so as to form a second wall of the groove. | 03-15-2012 |