Patent application number | Description | Published |
20130110306 | MANAGING MULTIPLE COOLING SYSTEMS IN A FACILITY | 05-02-2013 |
20130110564 | SPOT PRICING TO REDUCE WORKLOAD IN A DATA CENTER | 05-02-2013 |
20130111494 | MANAGING WORKLOAD AT A DATA CENTER | 05-02-2013 |
20130116803 | MANAGING THE CARBON FOOTPRINT OF A STRUCTURE - Carbon footprint management for structures is disclosed. In an example, a method includes determining a value of a first carbon footprint of the structure when operated at an existing demand for a first time period, and comparing the value of the first carbon footprint to a value of a prorated carbon cap of the structure for the first time period. If the first carbon footprint is less than or equal to the prorated carbon cap, the structure is operated for a second time period according to the existing demand or other demand that keeps a second carbon footprint of the structure below a prorated carbon cap for the second time period. Otherwise, the demand is adjusted to bring the second carbon footprint to approximate the prorated carbon cap for the second time period, and the structure is operated according to the adjusted demand for the second time period. | 05-09-2013 |
20130174597 | ADIABATIC COOLING UNIT - Mixing gases within an adiabatic cooling unit can include allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. Mixing gases within an adiabatic cooling unit can also include allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. Furthermore, mixing gases within an adiabatic cooling unit can include creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media. | 07-11-2013 |
20130190941 | RESOURCE MANAGEMENT FOR DATA CENTERS - Resource management for data centers is disclosed. In an exemplary embodiment, a method includes determining electrical power usage for the data center, and determining cooling fluid usage for the data center. The method also includes processing a resource utilization cap for the data center, and adjust ng at least one of the electrical power and the cooling fluid for the data center based on the resource utilization cap. | 07-25-2013 |
20140105244 | TEMPERATURE BAND OPERATION LOGGING - In a system, temperature measurements are logged. From the logged measurements, duration of operation of the system in each of a plurality of temperature bands is determined. | 04-17-2014 |
20140174545 | THERMALLY ACTUATED VALVE - A thermally actuated valve is provided herein. The thermally actuated valve includes a valve fitting, a valve body, and a movement control mechanism. The valve fitting includes an active member to selectively activate based on an input. The valve body includes a passive wax member that moves between a passive contraction state and a passive expansion state based on a passive temperature. The movement control mechanism is disposed between the valve fitting and the valve body. The movement control mechanism controls movement of the valve body between an open state and a dosed state based on movement of at least one of the active member and the passive wax member. | 06-26-2014 |
20140211411 | Data Center Canopy Including Turning Vanes - Examples provide data center canopies, data center housings, and data centers including turning vanes to facilitate air flow. In some examples, a data center canopy may include turning vanes to direct portions of an exhaust flow from an exhaust inlet toward floor sections to be output via exhaust outlets opposite the floor sections. Other examples are described and claimed. | 07-31-2014 |
20140376176 | LIQUID TEMPERATURE CONTROL COOLING - Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack ( | 12-25-2014 |
20140376178 | HEAT DISSIPATING SYSTEM - Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar. | 12-25-2014 |