Patent application number | Description | Published |
20140111686 | CAMERA BODY, LENS BARREL AND LENS-INTERCHANGEABLE CAMERA - A camera body includes a body-side bayonet lug, wherein a lens-side bayonet lug of a lens barrel is positioned immediately behind the body-side bayonet lug when the lens barrel is mounted to the camera body; an opposed surface formed on the rear surface of the body-side bayonet and positioned immediately in front of the lens-side bayonet lug; a body-side mount surface positioned in front of the opposed surface and with which the lens-side bayonet surface comes into contact; and a body-side contact portion, the front end of which contacts the rear end of the lens-side contact portion when the opposed surface faces the lens-side bayonet lug, the front end of the body-side contact portion being positioned in front of the opposed surface and behind the body-side mount surface. | 04-24-2014 |
20140119720 | CAMERA BODY - A camera body includes body-side bayonet lugs concentric with lens-side bayonet lugs, circular-arc openings, a circular arc protrusion positioned inside the camera body and projecting forward and concentric with the body-side bayonet lugs, body-side contact portions provided and arranged on the front end surface of the circular arc protrusion and come into contact with lens-side contact portions which are provided on the lens barrel, and rearward biasers provided immediately behind two of the body-side bayonet lugs to bias and move the lens-side bayonet lugs rearward, wherein two of the body-side contact portions located at both ends in the lengthwise direction and the two rearward biasers lie on radial-direction extension lines of the circular arc protrusion, respectively, as viewed in an optical axis direction. | 05-01-2014 |
20140119721 | CAMERA BODY, LENS BARREL AND LENS-INTERCHANGEABLE CAMERA - A camera body includes a plurality of body-side bayonet lugs which are provided on the peripheral edge of an opening; and a protrusion which is positioned in a circular-arc opening formed between adjacent body-side bayonet lugs of the body-side bayonet lugs, the distance between the protrusion and either of adjacent two body-side bayonet lugs of the body-side bayonet lugs being shorter than each of the lens-side bayonet lugs; and a body-side mount surface with which the lens-side bayonet surface comes into contact from the front side when the lens-side bayonet lugs are positioned immediately behind the body-side bayonet lugs. | 05-01-2014 |
Patent application number | Description | Published |
20090047539 | SURFACE-TREATED ELECTRO-DEPOSITED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME - It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 μm to 0.7 μm, the maximum peak to valley height (PV) to be 0.05 to 1.5 μm, and the surface roughness (Rzjis) to be 0.1 μm to 1.0 μm. The electro-deposited copper foil used for the manufacturing of this surface-treated electro-deposited copper foil is manufactured by using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and using a cathode having small surface roughness, under electrolysis conditions of carrying out continuous first-step electrolysis to n-th-step electrolysis at two or more different levels of electric current density. | 02-19-2009 |
20090166213 | PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSITED COPPER FOIL OBTAINED BY THE PRODUCTION METHOD, SURFACE-TREATED COPPER FOIL OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL AND COPPER-CLAD LAMINATE OBTAINED BY USING THE ELECTRO-DEPOSITED COPPER FOIL OR THE SURFACE-TREATED COPPER FOIL - An object of the present invention is to provide a production method which enables efficient production of an electro-deposited copper foil with further lower profile when compared to the low-profile electro-deposited copper foils which have been supplied to the market and is excellent in mechanical strength. For the purpose of achieving the object, a production method adopted obtains the electro-deposited copper foil by electrolyzing a sulfuric acid based copper electrolytic solution which contains a quaternary ammonium salt polymer having cyclic structure and chlorine, wherein for the quaternary ammonium salt polymer contained in the sulfuric acid based copper electrolytic solution, a DDAC dimer or higher polymer is used. For the quaternary ammonium salt polymer, a diallyl dimethyl ammonium chloride polymer having a number average molecular weight of 300 to 10000 is preferably used. The sulfuric acid based copper electrolytic solution preferably contains bis(3-sulfopropyl) disulfide or 3-mercapto-1-propanesulfonic acid that is a compound having a mercapto group. | 07-02-2009 |
20090314525 | Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation - A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process. | 12-24-2009 |