Patent application number | Description | Published |
20080296475 | Vertical image sensors and methods of fabricating the same - A vertical CMOS image sensor includes a plurality of photodiodes formed vertically in a substrate to a first depth. The vertical CMOS image sensor further includes a plurality of signal processing devices formed to correspond to the plurality of photodiodes. The plurality of signal processing devices are formed to transmit signals generated from the plurality of photodiodes. Each of the signal processing devices is substantially formed on the same plane with a corresponding one of the plurality of photodiodes. | 12-04-2008 |
20080296641 | Multi-well CMOS image sensor and methods of fabricating the same - Provided is a multi-well CMOS image sensor and a method of fabricating the same. The multi-well CMOS image sensor may include a plurality of photodiodes vertically formed in a region of a substrate, an n+ wall that vertically connects an outer circumference of the photodiodes, and a floating diffusion region that is connected to the photodiodes on a side of the n+ wall to receive charges from the photodiodes, wherein a p-type region is formed between the floating diffusion region and the n+ wall, and the plurality of photodiodes have a multi-potential well structure. | 12-04-2008 |
20090213893 | END PUMPING VERTICAL EXTERNAL CAVITY SURFACE EMITTING LASER - A vertical external cavity surface emitting laser (VECSEL) is provided, in which the incident loss of a pumping beam is reduced. The VECSEL device comprising: a transparent substrate; an optical pump radiating a pumping beam onto a first surface of the transparent substrate; a first anti-reflection coating (ARC) layer formed of a first light-transmitting insulating material on a second surface of the transparent substrate to reduce loss of the pumping beam; a distributed Bragg reflector (DBR) layer formed on the first ARC layer; a periodic gain layer formed on the DBR layer; and an external cavity mirror facing the periodic gain layer. | 08-27-2009 |
20100051986 | Light-emitting diodes using nano-rods and methods of manufacturing a light-emitting diode - Light-emitting diodes, and methods of manufacturing the light-emitting diode, are provided wherein a plurality of nano-rods may be formed on a reflection electrode. The plurality of nano-rods extend perpendicularly from an upper surface of the reflection electrode. Each of the nano-rods includes a first region doped with a first type dopant, a second region doped with a second type dopant that is an opposite type to the first type dopant, and an active region between the first region and the second region. A transparent insulating layer may be formed between the plurality of nano-rods. A transparent electrode may be formed on the plurality of nano-rods and the transparent insulating layer. | 03-04-2010 |
20100096614 | Light-emitting diode and method of manufacturing the same - A light-emitting diode and a method of manufacturing the light-emitting diode are provide, the light-emitting diode including a lower electrode on a substrate, a template layer on the lower electrode. The template layer may have a plurality of open regions. A plurality of nano-dashes may be formed in the plurality of open regions of the template layer. A transparent insulating layer may be formed between the nano-dashes. A transparent upper electrode may be formed on the nano-dashes and the transparent insulating layer. | 04-22-2010 |
20100123158 | Light emitting device and method of manufacturing the same - Provided is a light emitting diode (LED) manufactured by using a wafer bonding method and a method of manufacturing a LED by using a wafer bonding method. The wafer bonding method may include interposing a stress relaxation layer formed of a metal between a semiconductor layer and a bonding substrate. When the stress relaxation layer is used, stress between the bonding substrate and a growth substrate may be offset due to the flexibility of metal, and accordingly, bending or warpage of the bonding substrate may be reduced or prevented. | 05-20-2010 |
20100124798 | Method of manufacturing light emitting device - Provided is a method of manufacturing a light emitting device from a large-area bonding wafer by using a wafer bonding method using. The method may include forming a plurality of semiconductor layers, each having an active region for emitting light, on a plurality of growth substrates. The method may also include arranging the plurality of growth substrates on which the semiconductor layers are formed on one bonding substrate and simultaneously processing each of the semiconductor layers formed on each of the growth substrates through subsequent processes. The bonding wafer may be formed of a material that reduces or prevents bending or warping due to a difference of thermal expansion coefficients between a wafer material, such as sapphire, and a bonding wafer. According to the above method, because a plurality of wafers may be processed by one process, mass production of LEDs may be possible which may reduce manufacturing costs. | 05-20-2010 |
20100127238 | Light emitting diode - Example embodiments provide a light emitting diode (LED) having improved polarization characteristics. The LED may include wire grid polarizers on and below a light emitting unit. The wire grid polarizers may be arranged at an angle to each other. Thus, because the LED may emit a light beam in a given polarization direction, an expensive component, e.g., a dual brightness enhanced film (DBEF), is not required. Thus, manufacturing costs of a backlight unit including the LED and a display apparatus including the backlight unit may be reduced. | 05-27-2010 |
20100180936 | Multijunction solar cell - A multijunction solar cell according to example embodiments may include a plurality of sub cells, each sub cell having a different band gap energy. At least one of the plurality of sub cells may be a GaAsN sub cell having alternately stacked first layers and second layers. The first layers may be formed of GaAs | 07-22-2010 |
20100264400 | White light emitting device - A light emitting device (LED) may include a first semiconductor layer; an active layer formed on the first semiconductor layer and configured to generate first light having a first wavelength; a second semiconductor layer, formed on the active layer; and a plurality of semiconductor nano-structures arranged apart from each other and formed on the second semiconductor layer. The nano-structures may be configured to at least partially absorb the first light and emit second light having a second wavelength different from the first wavelength. | 10-21-2010 |
20110095260 | Light emitting device - A light emitting device may include a semiconductor light emitting diode which may include a first nitride semiconductor layer doped as an n-type, a second nitride semiconductor layer doped as a p-type, and a first active layer provided between the first and second nitride semiconductor layers, and a nano light emitting diode array in which a plurality of nano light emitting diodes may be arranged on the semiconductor light emitting diode so as to be separated from each other. | 04-28-2011 |
20110291069 | Light-emitting devices and methods of manufacturing the same - Light-emitting devices (LED) and methods of manufacturing the same. A LED includes a first type semiconductor layer, a nano array layer that includes a plurality of nano structures each including a first type semiconductor nano core selectively grown from the first type semiconductor layer, and an active layer and a second type semiconductor layer sequentially grown from a side surface of the first type semiconductor nano core, and that is formed in a selective growth region formed in a surface of the first type semiconductor layer, a first electrode layer that is formed to be used when a voltage is applied to the first type semiconductor layer and formed in a predetermined pattern connecting regions that do not correspond to the selective growth region in the first type semiconductor layer, a second electrode layer formed to be used when a voltage is applied to the second type semiconductor layer on the plurality of nano structures, and an insulating layer formed between the first electrode layer and the second electrode layer so that the first electrode layer is insulated from the second electrode layer. | 12-01-2011 |
20110291072 | SEMICONDUCTOR DIES, LIGHT-EMITTING DEVICES, METHODS OF MANUFACTURING AND METHODS OF GENERATING MULTI-WAVELENGTH LIGHT - A semiconductor die includes at least one first region and at least one second region. The at least one first region is configured to emit light having at least a first wavelength. The at least one second region is configured to emit light having at least a second wavelength, which is different from the first wavelength. | 12-01-2011 |
20120153252 | Nano-Structured Light-Emitting Devices - A nano-structured light-emitting device (LED) includes: a plurality of nanostructures on a first type semiconductor layer. Each of the plurality of nanostructures includes: a first type semiconductor nanocore on a portion of the first type semiconductor layer; a current spreading layer formed to cover a surface of the first type semiconductor nanocore and formed of an Al | 06-21-2012 |
20130015477 | NANOSTRUCTURED LIGHT-EMITTING DEVICEAANM KIM; Joo-sungAACI Seongnam-siAACO KRAAGP KIM; Joo-sung Seongnam-si KRAANM KIM; TaekAACI Seongnam-siAACO KRAAGP KIM; Taek Seongnam-si KRAANM YANG; Moon-seungAACI Hwaseong-siAACO KRAAGP YANG; Moon-seung Hwaseong-si KR - A nanostructured light-emitting device including: a first type semiconductor layer; a plurality of nanostructures each including a first type semiconductor nano-core grown in a three-dimensional (3D) shape on the first type semiconductor layer, an active layer formed to surround a surface of the first type semiconductor nano-core, and a second type semiconductor layer formed to surround a surface of the active layer and including indium (In); and at least one flat structure layer including a flat-active layer and a flat-second type semiconductor layer that are sequentially formed on the first type semiconductor layer parallel to the first type semiconductor layer. | 01-17-2013 |
20130105795 | WAVEGUIDE-INTEGRATED GRAPHENE PHOTODETECTORS | 05-02-2013 |
20130105840 | MULTI-PORT LIGHT SOURCES OF PHOTONIC INTEGRATED CIRCUITS | 05-02-2013 |
20130188904 | HYBRID LASER LIGHT SOURCES FOR PHOTONIC INTEGRATED CIRCUITS - A light source for a photonic integrated circuit may comprise a reflection coupling layer formed on a substrate in which an optical waveguide is provided, at least one side of the reflection coupling layer being optically connected to the optical waveguide; an optical mode alignment layer provided on the reflection coupling layer; and/or an upper structure provided on the optical mode alignment layer and including an active layer for generating light and a reflection layer provided on the active layer. A light source for a photonic integrated circuit may comprise a lower reflection layer; an optical waveguide optically connected to the lower reflection layer; an optical mode alignment layer on the lower reflection layer; an active layer on the optical mode alignment layer; and/or an upper reflection layer on the active layer. | 07-25-2013 |
20130248817 | WHITE LIGHT EMITTING DIODE - According to example embodiments, a white light-emitting diode may be configured to emit white light without a phosphor. According to example embodiments, a white light-emitting diode may include a first semiconductor layer that includes a plurality of hexagonal-pyramid shape nanostructures that protrude upwards from an upper surface of the first semiconductor layer, at least two multi-quantum well layers that are sequentially stacked on the hexagonal-pyramid shape nanostructures; and a second semiconductor layer on the multi-quantum well layers. The at least two multi-quantum well layers may be configured to generate lights having different wavelengths, and white light may be generated by mixing the lights having different wavelengths. | 09-26-2013 |
20140098833 | HYBRID VERTICAL CAVITY LASER FOR PHOTONIC INTEGRATED CIRCUIT - According to example embodiments, a hybrid vertical cavity laser for a photonic integrated circuit (PIC) includes: a grating mirror between first and second low refractive index layers, an optical waveguide optically coupled to one side of the grating mirror, a III-V semiconductor layer including an active layer on an upper one of the first and second low refractive index layers, and a top mirror on the III-V semiconductor layer. The grating mirror includes a plurality of bar-shaped low refractive index material portions arranged parallel to each other. The low refractive index material portions include a plurality of first portions having a first width and a plurality of second portions having second width in a width direction. The first and second widths are different. | 04-10-2014 |
20140269803 | HYBRID VERTICAL CAVITY LASER AND METHOD OF MANUFACTURING THE SAME - A hybrid vertical cavity laser includes an optical circuit substrate including a grating having refractive index units having a lower refractive index and a higher refractive index with respect to each other that are alternately arranged in a first direction, and a waveguide guiding light in the first direction, a mesa structure on the optical circuit substrate, the mesa structure including a first-type semiconductor layer including an exposed portion, an active layer, a second-type semiconductor layer, and an upper reflective layer sequentially stacked in a second direction perpendicular to the first direction, a first electrode on the exposed portion, and a second electrode on the upper reflective layer. An overlapped length between the waveguide and a mesa aperture forming an opening through which light produced from the active layer enters the grating is D, a pitch of the grating is p, and 009-18-2014 | |