Tae Gon
Tae Gon Kang, Suwon-Si KR
Patent application number | Description | Published |
---|---|---|
20090253855 | Polycarbonate-Polysiloxane Copolymer Resin Composition with High Impact Strength at Low Temperature and Mechanical Strength and Method for Preparing the Same - Disclosed herein is a polycarbonate-polysiloxane copolymer resin composition comprising: (A) about 100 parts by weight of a thermoplastic polycarbonate resin; and (B) about 0.1 to about 30 parts by weight of an organic siloxane polymer having a primary amine group. The polycarbonate-polysiloxane copolymer resin composition has high impact strength at low temperature and high mechanical strength. | 10-08-2009 |
Tae Gon Kim, Incheon KR
Patent application number | Description | Published |
---|---|---|
20090152537 | COMPOSITION FOR ORGANIC POLYMER GATE INSULATING LAYER AND ORGANIC THIN FILM TRANSISTOR USING THE SAME - Provided are a composition for an organic polymer gate insulating layer and an Organic Thin Film Transistor (OTFT) using the same. The composition includes an insulating organic polymer including at least one selected from the group consisting of polymethylmethacrylate (PMMA), polyvinylalcohol (PVA), polyvinylpyrrolidone (PVP), poly(vinyl phenol) (PVPh) and a copolymer thereof, a crosslinking monomer having two or more double bonds, and a photoinitiator. The OTFT includes a gate insulating layer of a semi-interpenetrating polymer network formed of the composition. | 06-18-2009 |
Tae Gon Kim, Chungcheongnam-Do KR
Patent application number | Description | Published |
---|---|---|
20120165499 | POLYMER, METHOD FOR PRODUCING THE SAME, AND RESIST COMPOSITION CONTAINING THE SAME - Provided is a copolymer containing a repeating unit represented by the following formula (1): | 06-28-2012 |
20120203024 | PHOTOACID GENERATOR, METHOD FOR PRODUCING THE SAME, AND RESIST COMPOSITION COMPRISING THE SAME - A photoacid generator represented by the following formula (1), a method for producing the photoacid generator, and a resist composition containing the photoacid generator are provided. | 08-09-2012 |
Tae Gon Lee, Daejeon KR
Patent application number | Description | Published |
---|---|---|
20100261348 | Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad - A method for fabricating a semiconductor package substrate, including: preparing a copper clad laminate and half etching a copper foil on a wire bonding pad side of the copper clad laminate; depositing a first etching resist on the opposite sides of the copper clad laminate; forming circuit patterns on the first etching resist, constructing circuits including a wire bonding pad and a ball pad after the model of the circuit patterns, and removing the first etching resist; applying a solder resist to the copper clad laminate in such a way to expose the wire bonding pad and the ball pad; and plating the wire bonding pad with gold and subjecting the ball pad to surface treatment. | 10-14-2010 |
20150049445 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE AND ELECTRONIC COMPONENT EMBEDDING SUBSTRATE - Disclosed herein are a method for manufacturing an electronic component embedding substrate and an electronic component embedding substrate. The method for manufacturing an electronic component embedding substrate includes: inserting an electronic component into a cavity formed in a core substrate; stacking a first insulating layer on one side of the core substrate into which the electronic component is inserted; performing surface treatment on the other side of the core substrate opposite to a direction in which the first insulating layer is stacked to improve a surface roughness of at least an exposed surface of the first insulating layer; and stacking a second insulating layer on the other side of the core substrate so as to be bonded to the exposed surface of the first insulating layer of which the surface roughness is improved. In addition, disclosed herein is the electronic component embedding substrate. | 02-19-2015 |
Tae Gon Lee, Daejeon-Si KR
Patent application number | Description | Published |
---|---|---|
20150085455 | ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - Embodiments of the invention provide an electronic component-embedded substrate and a manufacturing method thereof. According to at least one embodiment, the electronic component-embedded substrate includes a cavity formed in a core substrate and including two or more embedding spaces which have a rectangular shape (when viewed on a plane) and are connected to each other by a connecting space, and two or more electronic components separately accommodated in the embedding spaces of the cavity, respectively. According to at least one embodiment, neighboring long sides of first and second embedding spaces are partially connected to each other by the connecting space, and one side (when viewed on the plane) forming a connecting width of the connecting space connecting the first and second embedding spaces to each other coincides with one short side of the first embedding space, and the other side (when viewed on the plane) coincides with the other short side of the second embedding space. | 03-26-2015 |