| Patent application number | Description | Published |
|---|
| 20080308304 | Multilayer Wiring Board and Its Manufacturing Method - A multilayer wiring board employs a thin insulating substrate having substantially only resin flow as the compression property effect, and has an any-layer IVH structure where at least one core layer is formed without burying wiring. For sufficiently securing an effective compression amount of the crush-allowance of a conductor, the ratio of the thickness of a cover film to that of the electrical insulating substrate is increased, and a via can be formed in the core layer without burying the wiring in the insulating substrate. Thus, a multilayer wiring board having an any-layer IVH structure that can achieve high-density component mountability and wiring storability in an extremely small thickness can be provided. | 12-18-2008 |
| 20090139761 | MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A multilayer printed wiring board is characterized in that the interlayer connection material in the via holes has a lower coefficient of thermal expansion in the thickness direction than the electrically insulating substrate made of insulating material; the interlayer connection is formed at a temperature higher than the operating temperature; and the interlayer connection material is larger in thickness than the interlayer connection material of the same wiring layer at normal temperature. This causes a difference in the coefficient of thermal expansion between the different materials in the thickness direction of the printed wiring board in the environment in which it is used resulting in high connection reliability. | 06-04-2009 |
| 20090152781 | Vibration-Isolating Device for Steering Wheel of Traveling Working Vehicle with Wheel Steering Mechanism - A vibration-isolating device for a steering wheel of a travelling working vehicle equipped with a wheel steering mechanism includes a first steering shaft ( | 06-18-2009 |
| 20090175017 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured. | 07-09-2009 |
| 20090229862 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A plurality of double-sided boards using a film are attached to each other with a paste coupling layer sandwiched therebetween. In the paste coupling layer, a conductive paste is filled into a through hole formed in provisionally hardened resin, which is hardened. At the same time, second wirings are electrically coupled to each other by using the hardened conductive paste filled in the through holes that have been previously formed in the paste coupling layer. Thus, it is possible to provide a thinned multilayer printed wiring board without using an adhesive. | 09-17-2009 |
| 20100051337 | CIRCUIT BOARD - A lower sub-board of a circuit board includes a first base layer having an upper surface, and a first wiring pattern provided on the upper surface of the first base layer. An upper sub-board of a circuit board includes a second base layer having a lower surface, and a second wiring pattern provided on the lower surface of the second base layer. A connection layer between lower and upper sub-boards includes an insulating layer having a lower surface and an upper surface, the lower surface of connection layer being situated on the upper surface of the first base layer, the upper surface of connection layer being situated on the lower surface of the second base layer, and a via-conductor passing through the insulating layer and connected to the first and second wiring patterns. This circuit board connects the sub-boards to each other via a via-conductor densely. | 03-04-2010 |
| 20100170700 | SOLID PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure. | 07-08-2010 |
| 20100276187 | MULTILAYER PRINTED WIRING BOARD AND MOUNTING BODY USING THE SAME - A multilayer printed wiring board ( | 11-04-2010 |
| 20100288540 | THREE-DIMENSIONAL WIRING BOARD - A three-dimensional circuit board includes a lower substrate, a connection layer provided on an upper surface of the lower substrate, and an upper substrate provided on an upper surface of the connection layer. The connection layer exposes a portion of the upper surface of the lower substrate. The connection layer includes an insulating layer having a through-hole, and a via-conductor made of conductive material filling the through-hole. A recess is provided directly above the portion of the upper surface of the lower substrate and is surrounded by a side surface of the upper substrate and a side surface of the connection layer. A portion of the upper surface of the connection layer connected to the side surface of the connection layer inclines in a direction toward the portion of the upper surface of the lower substrate. The portion of the upper surface of the connection layer is provided from the side surface of the connection layer to the via-conductor. A portion of an upper substrate of the upper substrate connected to the side surface of the upper substrate inclines in a direction toward the portion of the upper surface of the lower substrate. The circuit board allows a component to be mounted in the recess efficiently. | 11-18-2010 |
| 20110030207 | MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A multilayer printed wiring board is characterized in that the interlayer connection material in the via holes has a lower coefficient of thermal expansion in the thickness direction than the electrically insulating substrate made of insulating material; the interlayer connection is formed at a temperature higher than the operating temperature; and the interlayer connection material is larger in thickness than the interlayer connection material of the same wiring layer at normal temperature. This causes a difference in the coefficient of thermal expansion between the different materials in the thickness direction of the printed wiring board in the environment in which it is used resulting in high connection reliability. | 02-10-2011 |
| 20110090772 | DRIVE APPARATUS FOR PERFORMING A SEQUENTIAL RECORDING AND REPRODUCTION ON A WRITE-ONCE RECORDING MEDIUM, AND METHOD OF REPRODUCING SAME - The drive apparatus of the present invention includes a recording/reproduction section and a drive control section. The drive control section determines a physical address indicating a location at which data can be recorded next in the determined track of a write-once recording medium as a next writable address, based on the last recorded address in the track; compares the physical address corresponding to the logical address included in the recording instruction with the next writable address; when the physical address corresponding to the logical address is smaller than the next writable address, controls the recording/reproduction section to record the data at a specific location in the user data area other than the location indicated by the physical address corresponding to the logical address in the recording instruction; generates new disc management information; and controls the recording/reproduction section to record the new disc management information in the disc management information area. | 04-21-2011 |
