Patent application number | Description | Published |
20080289862 | Electronic component package - An electronic component package includes a film board where an electronic component is mounted, and a lid part mounted on the film board so as to cover a surface of the film board. The electronic component is provided in a cavity formed by the film board and the lid part, and the electronic component is connected to a signal wiring conductor formed at the film board. | 11-27-2008 |
20090000809 | Flexible substrate - According to an aspect of an embodiment, a flexible circuit board for connecting a first device and a second device, the flexible circuit board comprises: a base material comprising a flexible material having a first end adapted to connect with the first apparatus, a second end adapted to connect with the second apparatus and a hollow arranged between the first end and the second end; a signal line arranged on a surface of the base material, the signal line capable of electrically connecting the first apparatus and the second apparatus, the signal line having a constant characteristic impedance along the signal line in association with the base material; and a line arranged on the base material and over the hollow, the line capable of electrically connecting the first apparatus and the second apparatus. | 01-01-2009 |
20090029570 | Relay substrate and substrate assembly - According to an aspect of an embodiment, a substrate for connecting circuit boards comprises: a substrate member having a first surface and a second surface facing each other and a first end and a second end facing each other; a first signal line formed on the first surface of the first end; a second signal line formed on the second surface of the second end; a third signal line connecting the first signal line with the second signal line; a first ground plane arranged on the first surface and surrounding the first signal line; and a portion of the second signal line formed over the first ground, the portion comprising narrower than an other portion of the second signal line. | 01-29-2009 |
20100003036 | Communication apparatus and signal reception method - A communication apparatus in accordance with an embodiment comprises a reception unit configured to demodulate a received signal to output a first demodulated signal in dependence on a reception condition. The communication apparatus further comprises a pattern detection unit configured to detect a characteristic pattern in the first demodulated signal to output a pattern detection signal, and a pitch detection unit configured to detect a pitch of the characteristic pattern based on the pattern detection signal to output a first signal detection signal indicating that the first demodulated signal is one of an in-phase signal and a quadrature signal, or an inverted version of the one of the in-phase signal and the quadrature signal. | 01-07-2010 |
20100285676 | CONNECTION TERMINAL AND TRANSMISSION LINE - A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure. | 11-11-2010 |
20110182591 | OPTICAL RECEIVER - An optical receiver includes: an optical amplifier amplifying an optical signal fed thereinto according to an operating current fed thereinto, the optical signal being a wavelength-multiplexed optical signal, a demultiplexer demultiplexing an optical signal output from the optical amplifier; and an operating-current control circuit selecting a monitoring target from a plurality of wavelength signals output from the demultiplexer and controlling the operating current of the optical amplifier so that optical power of the monitoring target is controlled to be a predetermined value. | 07-28-2011 |
20110294308 | SUBSTRATE AND IC SOCKET - There is provided a substrate that includes a base substrate, a socket that has a step where the step has a first surface and a second surface, the socket being electrically coupled with the base substrate at the first surface; and a connection substrate that is disposed between the second surface and the base substrate, where the connection substrate is electrically coupled with the socket at the second surface. | 12-01-2011 |
20120170944 | OPTICAL RECEIVER AND OPTICAL TRANSMITTER - There is provided an optical receiver. The optical receiver includes a board to be coupled with an optical transmission line array, an optical diode array disposed on the board, and the optical diode array including a plurality of photo diodes each of which receives light from a corresponding optical transmission line in the optical transmission array. Further bias suppliers, conversion circuits, and capacitors are provided on the board or a real side of the board. Each of the photo diodes includes a first electrode and second electrodes, the first electrode receives a bias voltage supplied by a bias supplier, a current signal flowing through the second electrode is converted by a conversion circuit into a voltage signal, and one end of a capacitor is coupled to the first electrode and the other is grounded. | 07-05-2012 |
20120286904 | CONNECTION TERMINAL AND TRANSMISSION LINE - A lead terminal includes signal lead pins and GND lead pins. The signal lead pin connects one signal pattern on a flexible substrate and another signal pattern on a rigid substrate. The GND lead pin connects one GND pattern on the flexible substrate and another GND pattern in the rigid substrate. A holding member has an insulating property and holds pairs of the signal lead pins and the GND lead pins at a distance. One main part of the signal lead pin and another main part of the GND lead pin form a microstrip line structure. | 11-15-2012 |
20130183032 | OPTICAL TRANSMISSION APPARATUS AND OPTICAL TRANSMISSION METHOD - An optical transmission apparatus includes an optical transmitter that includes a light emitting element and a driver circuit for the light emitting element, a temperature sensor that detects a temperature of the optical transmitter, and a controller that switches an operation mode of the optical transmitter from a normal mode to a low-power mode so as to reduce a heating effect to the light emitting element and allow an operation of the light emitting element to continue when the temperature detected by the temperature sensor is equal to or higher than a given temperature. | 07-18-2013 |