Patent application number | Description | Published |
20090008765 | CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME - A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip. | 01-08-2009 |
20090145636 | ELECTRONIC COMPONENT MOUNTING PACKAGE - An electronic component mounting package includes a structure (coreless substrate) in which a plurality of wiring layers are stacked one on top of another with insulating layers interposed therebetween and are interconnected through via holes formed in the insulating layers. The entire surface of the coreless substrate, exclusive of pad portions defined at desired positions of the outermost wiring layers thereof, is covered with a molding resin. Further, an interposer is mounted on the side of the electronic component mounting surface of the coreless substrate, and the molding resin is partially filled into a gap between the coreless substrate and the interposer. | 06-11-2009 |
20090250803 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a chip, a laminated wiring structure formed integrally with the chip, a frame disposed to surround the chip and made of a material having stiffness, and a sealing resin formed to bury therein the frame and at least the periphery of the side surface of the chip. The laminated wiring structure includes a required number of wiring layers, which are formed by patterning in such a manner that a wiring pattern directly routed from an electrode terminal of the chip is electrically connected to pad portions for bonding external connection terminals, the pad portions being provided, at a position directly below a mounting area of the chip and at a position directly below an area outside the mounting area, on a surface to which the external connection terminals are bonded. | 10-08-2009 |
20100025081 | WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE - A wiring substrate includes a frame-shaped reinforcing plate in which an opening portion is provided in a center portion, an interposer arranged in the opening portion of the reinforcing plate and having such a structure that a wiring layer connected mutually via a through electrode is formed on both surface sides of a substrate respectively, a resin portion filled between a side surface of the interposer and a side surface of the opening portion of the reinforcing plate, and coupling the interposer and the reinforcing plate, and an n-layered (n is an integer of 1 or more) lower wiring layer connected the wiring layer on the lower surface side of the interposer to extend from the interposer to an outer area. | 02-04-2010 |
20110133342 | WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICONDUCTOR PACKAGE - A wiring board includes a ceramic substrate including a plurality of stacked ceramic layers, an internal wiring, and an electrode, the internal wiring being electrically connected to the electrode, the electrode being exposed from a first surface of the ceramic substrate; and a silicon substrate including a wiring layer, the wiring layer including a wiring pattern and a via-fill, the wiring pattern being formed on a main surface of the silicon substrate, an end of the via-fill being electrically connected to the wiring pattern, another end of the via-fill being exposed from a rear surface of the silicon substrate positioned opposite to the main surface, wherein the rear surface of the silicon substrate is anodically bonded to the first surface of the ceramic substrate; and the via-fill of the silicon substrate is directly connected to the electrode of the ceramic substrate. | 06-09-2011 |
20110169133 | WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING WIRING SUBSTRATE - A wiring substrate includes a ceramic substrate including plural ceramic layers, an inner wiring, and an electrode electrically connected to the inner wiring, the electrode exposed on a first surface of the ceramic substrate, and a silicon substrate body having a front surface and a back surface situated on an opposite side of the front surface and including a wiring pattern formed on the front surface and a via filling material having one end electrically connected to the wiring pattern and another end exposed at the back surface. The back surface is bonded to the first surface of the ceramic substrate via a polymer layer. The via filling material penetrates through the polymer layer and is directly bonded to the electrode. | 07-14-2011 |
20110180930 | WIRING BOARD, MANUFACTURING METHOD OF THE WIRING BOARD, AND SEMICONDUCTOR PACKAGE - A wiring board includes a ceramic substrate including a plurality of stacked ceramic layers, an internal wiring, and an electrode electrically connected to the internal wiring, the electrode being exposed from a first surface of the ceramic substrate; and a silicon substrate including a wiring layer, the wiring layer including a wiring pattern and a via-fill, the wiring pattern being formed on a main surface of the silicon substrate, an end of the via-fill being electrically connected to the wiring pattern, another end of the via-fill being exposed from a rear surface of the silicon substrate positioned opposite to the main surface, wherein the another end of the via-fill is bonded to the electrode of the ceramic substrate via a metal layer. | 07-28-2011 |
20120074578 | SEMICONDUCTOR ELEMENT, SEMICONDUCTOR ELEMENT MOUNTED BOARD, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT - A semiconductor element includes connection terminals. The connection terminals are each shaped in such a manner that the transverse cross-sectional area in a portion near the leading end thereof decreases toward the leading end. Specifically, the shape of each of the connection terminals is columnar except for the portion near the leading end, and the side surface in the portion near the leading end of the connection terminal is shaped in a tapered form. Furthermore, a metal layer for improving a solder wettability may be formed at least on the side surface shaped in the tapered form, of the connection terminal. | 03-29-2012 |
20120103663 | WIRING SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes a heat sink to dissipate heat generated in an electronic part mounted in an electronic part loading area on a principal surface of the wiring substrate, an encapsulation resin to cover the heat sink, an inner connection terminal having an end face electrically connected to an electrode of the electronic part, and an outer connection terminal electrically connected to the inner connection terminal via a wiring and having an end face for inputting and outputting of a signal with an external device. The encapsulation resin is arranged to cover a part of the wiring, the inner connection terminal except the end face, and the outer connection terminal except the end face. A surface of the heat sink, the end face of the inner connection terminal, and the end face of the outer connection terminal are flush with and exposed to the principal surface. | 05-03-2012 |
20130126916 | PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE PACKAGE - A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively. | 05-23-2013 |
20130153945 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PACKAGE, AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a light-emitting element mounting package including laminating a metallic layer on an insulating layer; forming a light-emitting element mounting area which includes a pair of electroplating films formed by electroplating using the metallic layer as a power supply layer on the metallic layer; forming a light-emitting element mounting portion in which a plurality of wiring portions are separated by predetermined gaps, by removing predetermined portions of the metallic layer, wherein, in the forming the light-emitting element mounting portion, the metallic layer is removed so that one of the pair of electroplating films belongs to one wiring portion of the plurality of wiring portions and another of the pair of electroplating films belongs to another wiring portion adjacent to the one wiring portion. | 06-20-2013 |