Patent application number | Description | Published |
20080238550 | POWER AMPLIFIER AND TRANSMISSION AND RECEPTION SYSTEM - A power amplifier includes: a first multi-finger FET formed on a semiconductor substrate; a second multi-finger FET formed on the semiconductor substrate; a first temperature detector which detects a channel temperature of the first FET; a second temperature detector which detects a channel temperature of the second FET; a third temperature detector which detects a temperature of the semiconductor substrate; a first detection circuit detecting a difference between an output of the first temperature detector and an output of the third temperature detector and converting the difference to thermoelectromotive force; a second detection circuit detecting a difference between an output of the second temperature detector and the output of the third temperature detector and converting the difference to thermoelectromotive force; and a comparator comparing outputs of the first and second detection circuits with each other to turn on one of the first and second switches and turn off the other. | 10-02-2008 |
20080258815 | HIGH FREQUENCY POWER AMPLIFIER AND WIRELESS PORTABLE TERMINAL USING THE SAME - An object is to provide a high frequency power amplifier in which lowering of output power during operation is prevented, influence of thermal noise is suppressed, high frequency operation is stable, and long-term reliability is ensured. The high frequency power amplifier includes a plurality of transistors having gate electrodes, source regions and drain regions, the gate electrodes, source regions and drain regions being respectively connected in common, and a plurality of acoustic reflection layers being buried in portions of the semiconductor substrate, the portions being located between adjacent transistors, the acoustic reflection layers being disposed in a direction which is oblique to a length direction of the gate electrode. | 10-23-2008 |
20090134430 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate including an element region having a polygonal shape defined by a plurality of edges, and an isolation region surrounding the element region, and a plurality of gate electrodes provided on the substrate, crossing the element region, arranged in parallel with each other, and electrically connected with each other, wherein at least one of the edges does not cross any of the gate electrodes, and is not parallel to the gate electrodes. | 05-28-2009 |
20090243725 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first transistor unit including first field effect transistors with first gate electrodes electrically connected together, first sources electrically connected together, and first drains electrically connected together, the first gate electrodes being electrically connected to the first drains, a second transistor unit including second field effect transistors with second gate electrodes electrically connected together, second sources electrically connected together, and second drains electrically connected together, the second gate electrodes being electrically connected to the first gate electrodes, and dummy gate electrodes electrically isolated from the first gate electrodes and the second gate electrodes. The first gate electrodes, the second gate electrodes, and the dummy gate electrodes are arranged parallel to one another, and at least one dummy gate electrode is located between any one of the first gate electrodes and any one of the second gate electrodes. | 10-01-2009 |
20110220974 | SEMICONDUCTOR DEVICE - According to an embodiment, the present invention provides a semiconductor device that is easily integrated with other electronic circuits and functions as an oscillator with high frequency accuracy. The semiconductor device includes: a semiconductor substrate; an element region; an element isolation region that surrounds the element region; a field effect transistor including a gate electrode that is formed on the element region, source and drain regions, and a channel region that is interposed between the source region and the drain region; gate, source, and drain terminals that are used to apply a voltage to the gate electrode, the source region, and the drain region, respectively; and an output terminal that is electrically connected to the channel region. When the threshold voltage of the field effect transistor is V | 09-15-2011 |
20120061768 | POWER AMPLIFIER - According to an embodiment, a power amplifier is provided with at least one first growth ring gate structure and multiple second growth ring gate structures. The first growth ring gate structure is bounded by a semiconductor layer and performs a power amplification operation. The multiple second growth ring gate structures are bounded by the semiconductor layer and are arranged adjacently around the first growth ring gate structure in a surrounding manner. When the first growth ring gate structure performs a power amplification operation, the multiple second growth ring gate structures are depleted by applying a reverse bias to the multiple second growth ring gate structures whereby the depleted multiple second growth ring gate structures isolate the first growth ring gate structure from a surrounding portion. | 03-15-2012 |
20120200357 | POWER AMPLIFIER - A power amplifier according to the embodiments includes: a silicon substrate; an input terminal configured to receive an input of a RF signal; a power dividing unit configured to divide the RF signal into a first signal and a second signal; a phase modulating unit configured to modulate a phase of the second signal; an N well formed in the silicon substrate; a P well formed in the N well and configured to receive an input of the second signal of a modulated phase; a gate insulating film formed on the P well; a gate electrode formed on the gate insulating film and configured to receive an input of the first signal; source and drain electrodes formed on both sides of the gate electrode in the silicon substrate; and an output terminal configured to output a RF signal obtained from the drain electrode. | 08-09-2012 |
20120235246 | SEMICONDUCTOR DEVICE - One embodiment of a semiconductor device provided with a semiconductor substrate, a device region formed on the semiconductor substrate, a device isolation region, which encloses the device region, a plurality of first gate electrodes arranged so as to be parallel to each other on the device region and electrically connected to each other, and a plurality of second gate electrodes arranged so as to be parallel to a plurality of first gate electrodes on the device region and electrically connected to each other, wherein the first gate electrode is arranged so as to be interposed between the second gate electrodes, a gate width of the first gate electrode is smaller than the gate width of the second gate electrode, and a DC bias voltage higher than that of the second gate electrode is applied to the first gate electrode. | 09-20-2012 |
20120241877 | ACOUSTIC SEMICONDUCTOR DEVICE - According to one embodiment, an acoustic semiconductor device includes an element unit, and a first terminal. The element unit includes an acoustic resonance unit. The acoustic resonance unit includes a semiconductor crystal. An acoustic standing wave is excitable in the acoustic resonance unit and is configured to be synchronously coupled with electric charge density within at least one portion of the semiconductor crystal via deformation-potential coupling effect. The first terminal is electrically connected to the element unit. At least one selected from outputting and inputting an electrical signal is implementable via the first terminal. The electrical signal is coupled with the electric charge density. The outputting the electrical signal is from the acoustic resonance unit, and the inputting the electrical signal is into the acoustic resonance unit. | 09-27-2012 |
20130256009 | EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND PRINTED CIRCUIT BOARD - An EBG structure according to an embodiment includes an electrode unit made of a first conductor and provided with a space, a patch unit provided approximately parallel to the electrode unit and made of a second conductor, an insulating layer provided between the electrode unit and the patch unit, a first via provided between the patch unit and the electrode unit in the insulating layer and connected to the patch unit and the electrode unit, and a second via provided between the patch unit and the space in the insulating layer, connected to the patch unit, and not connected to the electrode unit. | 10-03-2013 |
20140028412 | EBG STRUCTURE AND CIRCUIT BOARD - An EBG (Electromagnetic Band Gap) structure according to an embodiment includes: an electrode that is made of a first conductor; a first insulating layer that is provided on the electrode; a patch unit that is provided in substantially parallel with the electrode on the first insulating layer, the patch unit including a first gap, the patch unit being made of a second conductor; a second insulating layer that is provided on the patch unit; a first via that is provided between the patch unit in the first insulating layer and the electrode and connected to the patch unit and the electrode; and a second via that is provided in the first and second insulating layers, the second via piercing the first gap and being connected to the electrode. | 01-30-2014 |
20140029227 | ELECTRONIC CIRCUIT AND SEMICONDUCTOR COMPONENT - A circuit board according to an embodiment is one in which a plurality of electronic components is mounted on a printed wiring board. The circuit board includes a semiconductor component that is mounted on the printed wiring board, and the semiconductor component includes a semiconductor device and a first EBG structure formed on or above the semiconductor device. An operating frequency of the semiconductor device exists outside a cutoff band of the first EBG structure, and the first EBG structure is connected to a ground or a power supply of the printed wiring board. | 01-30-2014 |
20140210066 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package of an embodiment includes: a semiconductor chip having a signal input terminal and a signal output terminal; and a cap unit that is formed on the semiconductor chip. The cap unit includes a concave portion forming a hollow structure between the semiconductor chip and the cap unit, a first through electrode electrically connected to the signal input terminal, and a second through electrode electrically connected to the signal output terminal. Of the inner side surfaces of the concave portion, a first inner side surface and a second inner side surface facing each other are not parallel to each other. | 07-31-2014 |
20140240055 | ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE - An electronic circuit according to an embodiment includes a power supply line having a first EBG pattern, the first EBG pattern including a plurality of first linear parts and a first slit, each of the first linear parts extending along a direction in which the power supply line extends and surrounded by the first slit except one end of the first linear part. | 08-28-2014 |