Patent application number | Description | Published |
20090127705 | Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device - There are provided a semiconductor device capable of accurately determining whether a semiconductor chip is bonded to a solid-state device such as the other semiconductor chip parallelly with each other, a semiconductor chip used for the semiconductor device, and a method of manufacturing the semiconductor chip. The semiconductor chip includes a functional bump projected with a first projection amount from the surface of the semiconductor chip and electrically connecting the semiconductor chip to the solid-state device, and a connection confirmation bump projected with a second projection amount, which is smaller than the first projection amount, from the surface of the semiconductor chip and used for confirming the state of the electrical connection by the functional bump. | 05-21-2009 |
20100187685 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion ( | 07-29-2010 |
20110074017 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MULTILAYER WAFER STRUCTURE - Grooves are formed on the front surfaces of first and second semiconductor wafers each including an aggregate of a plurality of semiconductor chips. The grooves each extend on a dicing line set between the semiconductor chips and to have a larger width than the dicing line. Thereafter the first and second semiconductor wafers are arranged so that the front surfaces thereof are opposed to each other, and the space between the first semiconductor wafer and the second semiconductor wafer is sealed with underfill. Thereafter the rear surfaces of the first and second semiconductor wafers are polished until at least the grooves are exposed, and a structure including the first and second semiconductor wafers and the underfill is cut on the dicing line. | 03-31-2011 |
20130256881 | Semiconductor Device - Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion ( | 10-03-2013 |
20140220740 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MULTILAYER WAFER STRUCTURE - Grooves are formed on the front surfaces of first and second semiconductor wafers each including an aggregate of a plurality of semiconductor chips. The grooves each extend on a dicing line set between the semiconductor chips and to have a larger width than the dicing line. Thereafter the first and second semiconductor wafers are arranged so that the front surfaces thereof are opposed to each other, and the space between the first semiconductor wafer and the second semiconductor wafer is sealed with underfill. Thereafter the rear surfaces of the first and second semiconductor wafers are polished until at least the grooves are exposed, and a structure including the first and second semiconductor wafers and the underfill is cut on the dicing line. | 08-07-2014 |
20140332954 | Semiconductor Device - Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion ( | 11-13-2014 |
20150021765 | Semiconductor Device - Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion ( | 01-22-2015 |
20150325541 | Semiconductor Device - Disclosed is a semiconductor device suppressed in decrease of reliability. The semiconductor device comprises an electrode pad portion ( | 11-12-2015 |