Patent application number | Description | Published |
20090267427 | STRUCTURE FOR MOUNTING VEHICLE DRIVING APPARATUS - A mounting structure for a vehicle driving apparatus includes a housing fixed to a vehicle body and including a first internal space and a second internal space formed below the first internal space in the state of being separated from the first internal space; a motor generator provided in the first internal space of the housing; an inverter provided in the second internal space of the housing; and a terminal electrically connecting the motor generator and the inverter. Oil used for cooling the motor generator is stored in the bottom of the first internal space. The portion in the terminal located in the first internal space is located above the highest liquid level of the oil stored in the first internal space. | 10-29-2009 |
20090289583 | MOTOR DRIVE DEVICE AND VEHICLE PROVIDED WITH THE SAME - A control device converts a torque instruction value of an AC motor into a current instruction of AC motor, and employs current control in which feedback is performed by PI control to match an actual current value with the current instruction. Further, the control device sets a target flow rate of cooling water flowing through a coolant passage based on the converted current instruction, produces a signal for driving a water pump to circulate the cooling water at the target flow rate thus set and provides the signal to the water pump. A revolution speed of the water pump is restricted according to a signal of the control device such that the cooling water circulates through the coolant passage at the flow rate matching with the target flow rate. | 11-26-2009 |
20100013331 | COOLING STRUCTURE FOR INVERTER AND CAPACITOR ACCOMMODATED INTEGRALLY WITH MOTOR IN HOUSING OF MOTOR, MOTOR UNIT WITH COOLING STRUCTURE, AND HOUSING - Inside a housing, there are provided a motor generator (MG), an IPM, and a smoothing capacitor. Between the MG and the IPM, there is provided a cooler through which a coolant liquid flows, provided in an inclined manner to form contact with the top face of the IPM. Between the MG and the smoothing capacitor, there are provided a first communication channel through which an LLC flows from a region outside the housing into the cooler, brought into contact with a lateral face of the smoothing capacitor, and a second communication channel through which the LLC flows from the interior of the cooler to the region outside the housing. | 01-21-2010 |
20100072865 | VEHICLE DRIVE DEVICE - A vehicle drive device includes a motor generator (MG | 03-25-2010 |
20100090336 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE - A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the semiconductor elements flows; and a protruded portion provided at a position opposite to the mounting surface of the heat sink, extending in a direction intersecting flow direction of the cooling medium (direction of arrow DR | 04-15-2010 |
20100101878 | SEMICONDUCTOR DEVICE AND ELECTRICALLY POWERED VEHICLE - A Peltier element is provided so that an electrically conductive plate forming a heat absorbing portion is in close proximity to an insulating layer and an electrically conductive plate forming a heat radiating portion is provided in close proximity to an insulating layer. The Peltier element has one end connected to a branch line branched from a power line, and has the other end electrically connected to an electrode plate. Further, the Peltier element receives from the branch line a portion of electric power supplied to a power transistor, and outputs it to the electrode plate. In other words, the Peltier element uses the portion of the electric power supplied to the power transistor, to absorb heat generated by the power transistor and radiate it toward a heat radiating plate. | 04-29-2010 |
20100155027 | COOLING DEVICE - A cooling device includes a case including a mount surface having a power transistor mounted thereon, a coolant accommodating chamber formed in the case located above the mount surface, for accommodating a coolant capable of evaporating by heat from the power transistor, a cooling pipe provided in the case and being capable of cooling the coolant in a gaseous state, and a defining member provided in the coolant accommodating chamber and being capable of defining in the coolant accommodating chamber a first region capable of guiding the coolant in a gaseous state evaporated by the heat from the power transistor toward the cooling pipe, and a second region located downstream in a flow direction of the coolant with respect to the first region and being capable of guiding the coolant cooled by the cooling pipe toward a bottom of the coolant accommodating chamber. | 06-24-2010 |
20100182747 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE - A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein. | 07-22-2010 |
20100319876 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE - A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material. | 12-23-2010 |