Patent application number | Description | Published |
20100276184 | MULTILAYER PRINTED BOARD AND METHOD FOR MANUFACTURING THE SAME - Provided is a multilayer printed board | 11-04-2010 |
20100323217 | MATERIAL FOR AN ELECTRICAL/ELECTRONIC PART AND ELECTRICAL/ELECTRONIC PART - A material for an electrical/electronic part, which has a resin coating directly formed on at least a part of a metal substrate or at least a part of a metal layer provided on the metal substrate, with the resin coating being formed with a resin composition containing at least one selected from the group consisting of a polyamideimide resin and a polyimide resin, each having a structure represented by formula (I) or (II) in the molecular structure: | 12-23-2010 |
20110059326 | COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT, ELECTRICAL/ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC COMPONENT - Disclosed is a composite material for electrical/electronic component, having a resin coating film formed on at least a part of a metal base, and the residual solvent quantity in the resin coating film being controlled to be 1-30% by mass. The resin coating film is preferably composed of a polyimide or a polyamide-imide. | 03-10-2011 |
20110091738 | COMPOSITE MATERIAL FOR ELECTRIC/ELECTRONIC PART, PRODUCTION METHOD THEREOF, AND ELECTRIC/ELECTRONIC PART - A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass. | 04-21-2011 |
20110091739 | COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC PART AND ELECTRICAL/ELECTRONIC PART USING THE SAME - A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 μm. | 04-21-2011 |
20110091740 | COMPOSITE MATERIAL FOR ELECTRICAL/ELECTRONIC PART AND ELECTRICAL/ELECTRONIC PART USING THE SAME - A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part, containing:
| 04-21-2011 |
20130099270 | LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE - A lead frame for an optical semiconductor device, having a reflection layer at least on one side or each side of the outermost surface of a substrate, partially or entirely, in which the reflection layer has, on the outermost surface at least in a region where light emitted by an optical semiconductor element is reflected, a microstructure with at least the surface thereof having been mechanically deformed, which is converted from a plating microstructure formed of a metal or an alloy thereof; a method of producing the same, and an optical semiconductor device having the same. | 04-25-2013 |
20140273667 | Terminal, Method of Manufacturing Terminal, and Termination Connection Structure of Electric Wire - A terminal includes a tubular crimp portion that crimp connects with an electric wire. The tubular crimp portion is composed of a metal member. The tubular crimp portion includes a non-weld portion and a weld portion, the weld portion being formed by welding. A metal base material constituting the metal member of the non-weld portion includes a normal portion and an annealed portion. | 09-18-2014 |
20140374155 | METHOD OF MANUFACTURING ELECTRICAL WIRE CONNECTING STRUCTURE AND ELECTRICAL WIRE CONNECTING STRUCTURE - In an electrical wire connecting structure and a method of manufacturing the electrical wire connecting structure, a terminal having a tube-shaped portion of 2.0 mm in inner diameter is prepared for an electrical wire having a conductor cross-sectional area of 0.72 to 1.37 mm | 12-25-2014 |
20150333416 | CRIMP TERMINAL, CONNECTION STRUCTURAL BODY, AND METHOD OF MANUFACTURING CONNECTION STRUCTURAL BODY - A barrel portion which allows the pressure-bonding connection of an aluminum core wire exposed on a distal end of an insulated wire covered with an insulating cover is formed into a cylindrical shape by bending barrel portion corresponding portions of a terminal base material in a terminal developed state about a terminal axis. In abutting end portions where the barrel portion corresponding portions abut each other, a welded part which welds the end portions is formed along a long length direction of the insulated wire. The welded part is formed on an upper surface concave portion and a projecting portion where an amount of plastic deformation of a conductor pressure-bonding section generated along with the pressure-bonding of the conductor pressure-bonding section becomes larger compared to other portions in a circumferential direction of the conductor pressure-bonding section. | 11-19-2015 |
20150357723 | Metal Member, A Terminal, A Wire Connecting Structure and A Method of Manufacturing A Terminal - A metal member includes a base material composed of one of copper and a copper alloy, a white metal layer provided on the base material at a part or an entirety thereof, and an oil film provided on the white metal layer. The white metal layer has a thickness of 0.01 μm to 0.80 μm. A surface of the white metal layer has an arithmetic mean roughness of 0.6 μm to 1.2 μm. The oil film has an electric double-layer capacitance of 1.5 μF/cm | 12-10-2015 |
20150357724 | Terminal, A Wire Connecting Structure and A Method of Manufacturing the Terminal - A terminal includes a connector portion, a tubular crimp portion that crimps/joins with a wire, and a transition portion joining the two portions. The tubular crimp portion is composed of a metal member including a base material of copper or copper alloy with 0.20-1.40 mm thickness and a coating layer of tin, tin alloy, nickel, nickel alloy, silver or silver alloy with 0.2-3.0 μm thickness formed on the base material. The tubular crimp portion has a weld portion formed by butt-welding and having, in its cross-section perpendicular to a terminal longitudinal direction, a phase existing therein of tin, tin alloy, nickel, nickel alloy, silver or silver alloy greater than 0.01 μm | 12-10-2015 |
20150357725 | Terminal, Wire Connecting Structure and Method of Manufacturing A Terminal - A terminal includes a connector portion electrically connectable to an external terminal, a tubular crimp portion formed integrally or separate from the connector portion and crimps with a wire, and a transition portion coupling the two. The tubular crimp portion of a copper or copper alloy metal base material or a metal member having the same is a tubular member closed on transition portion side and reduces in diameter towards the transition portion side such that a conductor-end portion of the electric wire is un-exposed. The tubular crimp portion has a belt-shaped weld portion along a longitudinal direction of the tubular crimp portion. A circumferential direction of the tubular crimp portion matches the RD-direction of the base material. A sum of area ratios R1, R2 and R3 in a rolling plane of the base material, of Cube-, RDW-, and Goss-oriented crystal grains, respectively, is greater than or equal to 15%. | 12-10-2015 |
20150364835 | METHOD OF MANUFACTURING CONNECTION STRUCTURAL BODY, CONNECTION STRUCTURAL BODY, WIRE HARNESS, CRIMPING MEMBER AND CRIMPING DEVICE - In a method of manufacturing a connection structural body where an insulated wire and a crimp terminal are connected by crimping to each other by the crimping section, the crimping section is configured to have a hollow cross-sectional shape, and is formed by arranging a conductor crimping section which crimps a conductor tip and a cover crimping section which crimps a cover tip in this order from a distal end side to a proximal end side in a long length direction, a portion on the distal end side of the crimping section is sealed, and the crimping of the conductor crimping section is started prior to the crimping of the cover crimping section at the time of connecting the crimping section to the wire tip by crimping. | 12-17-2015 |
20150364837 | Method for Manufacturing Crimp Terminal, Crimp Terminal, and Wire Harness - A method for manufacturing a crimp terminal having a crimp portion that allows crimp connection to a conductor part of a coated wire includes forming a tubular body by bringing together side edges of a plate material made of metal composed of a copper alloy having a copper content ratio of greater than or equal to 70%, irradiating a periphery of the sides edges, which are brought together, with laser light from a laser irradiation unit to weld the side edges which are brought together, and setting a power density of the laser light and a sweep rate of the laser light in such a manner that a weld bead formed at the side edge portion after the welding has a width of 80 μm to 390 μm. | 12-17-2015 |
20160099507 | Terminal, Method of Manufacturing Terminal, and Termination Connection Structure of Electric Wire - A terminal includes a tubular crimp portion that crimp connects with an electric wire. The tubular crimp portion is composed of a metal member. The tubular crimp portion includes a non-weld portion and a weld portion, the weld portion being formed by welding. A metal base material constituting the metal member of the non-weld portion includes a normal portion and an annealed portion. | 04-07-2016 |
Patent application number | Description | Published |
20090265031 | AUTOMATIC WAREHOUSE - An automatic warehouse | 10-22-2009 |
20100196126 | COMPONENT TRANSFER APPARATUS AND METHOD - A component transfer apparatus and method according to the present invention includes: a mounting member ( | 08-05-2010 |
20100202865 | COMPONENT TRANSFER DEVICE AND METHOD - A component transfer device according to the present invention includes a holding mechanism ( | 08-12-2010 |
20100290870 | TRANSFER DEVICE - A transfer device according to the present invention includes a carrying-in area (A | 11-18-2010 |
20140083818 | COMPONENT TRANSFER DEVICE AND METHOD - A component transfer device according to the present invention includes a holding mechanism that positions and holds a component on a carrying surface located at a predetermined height and a pull-out unit that pulls out the component held on the carrying surface by the holding mechanism in a horizontal direction. The pull-out unit includes a grasping member that can separably grasp the component from a vertical direction, a cam member that causes the grasping member to perform a component grasping operation and a component releasing operation at predetermined timings by exercising a cam function to the grasping member, a driving mechanism that drives the cam member and the grasping member, and a restraint mechanism that restrains a relative movement of the cam member with respect to the movable holder upon grasping operation. | 03-27-2014 |
20150374122 | ACCOMMODATING DEVICE, SEGMENT, AND METHOD FOR FORMING MULTIPLE-STAGE ACCOMMODATING PORTIONS - This invention provides an accommodating device provided with a plurality of accommodating portions configured to accommodate plate-shaped members to be accommodated by being separated away in a thickness direction thereof, having: at least one wall body constructing the accommodating device; and a plurality of segments having the accommodating portions respectively and arranged adjacently each other along a wall surface of the wall body, wherein each of the plurality of segments has an engagement portion to be engaged with an adjacent segment, and the plurality of segments are connected to each other through engagement between the engagement portions of each segments and are detachably mounted on the wall body. | 12-31-2015 |
Patent application number | Description | Published |
20140061287 | Lead-Free Solder Ball - A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %. | 03-06-2014 |
20150037087 | Lead-Free Solder Alloy - A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. It can form solder joints with high reliability even when used for soldering to electrodes having a Ni coating which contains P, since the growth of a P-rich layer is suppressed so that the shear strength of the joints is improved and the alloy has a high ductility and a high tensile strength. | 02-05-2015 |
20150037088 | Lead-Free Solder Alloy - A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors. | 02-05-2015 |
20150221606 | Lead-Free Solder Ball - A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. The composition may include at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total emount of 0.003-0.1 mass %. | 08-06-2015 |
20150282332 | SOLDERING METHOD USING A LOW-TEMPERATURE SOLDER PASTE - Even if the strength of a solder composition close to a SnBi eutectic composition was improved, it was brittle, so when it was used for small electronic devices such as mobile phones or notebook computers, the resistance to drop impacts when the small electronic equipment was dropped was low. Therefore, interface peeling often took place between the soldered surface and a printed circuit board, resulting in the devices being destroyed. As disclosed, when soldering using a solder paste containing a SnBi-based low-temperature solder, at least one type of solder composition selected from a Sn—Ag, a Sn—Cu, and a Sn—Ag—Cu solder composition is diffused into the solder paste by simultaneously supplying at least one type of preform selected from a Sn—Ag, a Sn—Cu, and a Sn—Ag—Cu solder composition, whereby resistance to drop impacts is improved. | 10-01-2015 |
20150328722 | LEAD-FREE SOLDER ALLOY - Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn. | 11-19-2015 |
20160056570 | LEAD-FREE SOLDER ALLOY AND IN-VEHICLE ELECTRONIC CIRCUIT - With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass % Ag, 0.6-0.8 mass % Cu, 1-5 mass % Sb, 0.01-0.2 mass % Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of −40° C. to high temperatures of 125° C. but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using the solder alloy can thereby be obtained. | 02-25-2016 |
20160074971 | Lead-Free Solder Alloy - Disclosed is a Sn—Bi—Cu—Ni series lead-free solder alloy which has a low melting point, good ductility and high tensile strength, suppresses strain in the substrate by suppressing generation of P-rich layer on a joining interface to have high shear strength and is superior in joining reliability. In order to suppress diffusion of Cu and Ni in an electrode and to maintain elongation and wettability of the solder alloy, a solder alloy has an alloy composition containing 31 to 59 mass % of Bi, 0.3 to 1.0 mass % of Cu, 0.01 to 0.06 mass % of Ni and balance of Sn. | 03-17-2016 |
Patent application number | Description | Published |
20090267212 | Semiconductor Device - The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of thermal expansion is used in the multilayer substrate, and the coefficient of thermal expansion and glass transition point of the underfill are appropriately designed in accordance with the thickness and coefficient of thermal expansion of the core. By doing so, it is possible to relieve stresses inside the semiconductor package caused by deformation of the multilayer substrate due to temperature changes, and thereby to suppress damage to the semiconductor package due to temperature changes. | 10-29-2009 |
20100032826 | SEMICONDUCTOR PACKAGE, CORE LAYER MATERIAL, BUILDUP LAYER MATERIAL, AND SEALING RESIN COMPOSITION - A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75° C. of the cured member is 15 to 35 ppm/° C., the glass transition temperature of at least one buildup layer is 170° C. or more, and the coefficient of linear expansion of at 25 to 75° C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination. | 02-11-2010 |
20110051387 | METHOD FOR ELECTROLESS NICKEL-PALLADIUM-GOLD PLATING, PLATED PRODUCT, PRINTED WIRING BOARD, INTERPOSER AND SEMICONDUCTOR APPARATUS - An object of the present invention is to provide an electroless nickel-palladium-gold plating method which is able, when performed on a plating target surface such as terminals of a printed wiring board, terminals of other electronic components, and other resin substrates with a fine metal pattern, to prevent abnormal metal deposition on a resin surface which is an undercoat and to provide a high-quality plated surface. Another object of the present invention is to provide a plated product with a high-quality plated surface, particularly such as an interposer and motherboard, and a semiconductor apparatus using the same. These objects were achieved by the electroless nickel-palladium-gold plating method of the present invention, which is a method for plating target objects such as terminals of a printed wiring board and in which at least one surface treatment selected from a treatment with a solution of pH 10 to 14 and a plasma treatment is performed at an optional step after the step of providing a palladium catalyst and before the step of performing electroless palladium plating. | 03-03-2011 |
20110180208 | METHOD FOR LAMINATING PREPREG, METHOD FOR PRODUCING PRINTED WIRING BOARD AND PREPREG ROLL - A method for laminating a prepreg contributing to decrease in layer thickness and having high productivity, a method for producing a printed wiring board by the method for laminating the prepreg, and a prepreg roll used for the method for laminating the prepreg are provided. The method involves: 1) preparing a prepreg roll comprising a prepreg comprising at least a core layer, a first resin layer, a second resin layer, being thicker than the first resin layer, and a supporting base film which covers the first resin layer, wherein the prepreg with the supporting base film is rolled up into a roll; 2) unreeling the prepreg with the supporting base film from the prepreg roll, peeling off the peelable film if the second resin layer is covered with the peelable film, and layering the prepreg with the supporting base film on a circuit board so that the second resin layer side of the prepreg with the supporting base film faces a circuit of the circuit board; 3) vacuum laminating the prepreg; and 4) smoothing a surface of the first resin layer contacting the supporting base film by hot press. | 07-28-2011 |
Patent application number | Description | Published |
20080311060 | Organopolysiloxane, a method of preparing the same and a cosmetic comprising the same - An organopolysiloxane having a main chain composed of the following repeating units (I), 2 to 199 side chain units (II) and 1 to 50 crosslinkage units (III) per 100 SiO units in the main chain, provided that the organopolysiloxane has at least 2, on average, crosslinkage units (III): | 12-18-2008 |
20090203802 | POWDER COMPOSITION, A DISPERSION OF POWDER IN OIL, AND A COSMETIC COMPRISING THE SAME - The present invention is a powder composition comprising a silicone according to the following formula (1) | 08-13-2009 |
20090232859 | COSMETIC - A cosmetic, comprising a polymer (A) which comprises a repeating unit represented by the following formula (1), a repeating unit represented by the following formula (2) and a repeating unit represented by the following formula (3), said polymer (A) containing the repeating unit represented by the formula (3) in an amount of from 30 to 90 mass %, based on a total mass of the polymer (A), and being soluble in decamethylcyclopentasiloxane, | 09-17-2009 |
20110015337 | ORGANOPOLYSILOXANE, A METHOD OF PREPARING THE SAME AND A COSMETIC COMPRISING THE SAME - An organopolysiloxane having a main chain composed of the following repeating units (I), 2 to 199 side chain units (II) and 1 to 50 crosslinkage units (III) per 100 SiO units in the main chain, provided that the organopolysiloxane has at least 2, on average, crosslinkage units (III): | 01-20-2011 |
Patent application number | Description | Published |
20090125303 | AUDIO SIGNAL PROCESSING APPARATUS, AUDIO SIGNAL PROCESSING METHOD, AND COMMUNICATION TERMINAL - An audio signal processing apparatus, includes an environmental ambient noise level detection unit for detecting an environmental ambient noise level contained in an audio signal inputted through sound collection means for collecting a transmission sound at the time of a voice call, a signal level adjustment unit which has a level adjustment function to adjust an output signal level with respect to an input signal level, and an input/output characteristic change function to change an input/output characteristic when adjusting a level in the level adjustment function by means of a control signal, and in which a received sound signal in the case of the telephone call voice is arranged to be an input signal, and a control signal generation unit for generating the control signal for changing the input/output characteristic of the signal level adjustment unit from the environmental ambient noise level detected by the environmental ambient noise level detection unit. | 05-14-2009 |
20100056198 | AUDIO SIGNAL PROCESSING APPARATUS, AUDIO SIGNAL PROCESSING METHOD, AND COMMUNICATION TERMINAL - An audio signal processing apparatus includes a band signal component extraction unit for extracting signal components in a predetermined frequency band from an audio signal input by an audio collection unit for collecting at least an outgoing call audio upon an audio phone call, a stationary signal component extraction unit for extracting a stationary signal component from the signal components, a signal adjustment unit having a level adjustment function of adjusting an output signal level with respect to an input signal level and an input and output characteristics change function of changing input and output characteristics upon level adjustment in the level adjustment function through a control signal and configured to set an incoming call audio signal upon the audio phone call as the input signal, and a control signal generation unit for generating the control signal for changing the input and output characteristics by using the stationary signal component. | 03-04-2010 |
20110047550 | SOFTWARE PROGRAM EXECUTION DEVICE, SOFTWARE PROGRAM EXECUTION METHOD, AND PROGRAM - The present invention provides a software program execution device which can accept a processing request even during a setting change of a software program without interrupting the processing in-execution. An execution monitoring unit monitors, in processing units and based on an instruction of a software program control unit, the operation of a server application unit which executes a software program in a process, and notifies a software program control unit that the processing being executed in a first process is completed. Upon receiving the notification, the software program control unit stops and then restarts the first process, and the first process is restarted while reflecting the setting change recorded in a setting storage unit during the restart step. | 02-24-2011 |
20110203362 | TIRE INFLATION METHOD FOR TIRE TESTING MACHINE - In a tire testing machine, a test tire transported onto a belt conveyor is entrusted to a lower rim by lowering the belt conveyor. In this state, an upper rim is lowered to the position of the lower rim, whereby the upper and lower rims are fitted to the test tire, and then the test tire is inflated. An inflation method for the tire testing machine comprises stopping the belt conveyor at an intermediate position, without lowering the belt conveyor to a descent limit, when entrusting the test tire to the lower rim by lowering the belt conveyor; and inflating the test tire, with the weight of the test tire being shouldered by the belt conveyor as well. | 08-25-2011 |
20140058662 | ACOUSTIC NAVIGATION METHOD - An information processing apparatus that detects a current location of the information processing apparatus; obtains a direction of a destination from the detected current location as a target direction; detects a facial orientation of a user wearing a headphone unit connected to the information processing apparatus via a wired or wireless connection in relation to a reference orientation based on outputs of a geomagnetic sensor and an acceleration sensor connected to the headphone unit; obtains a relative target angle based on a difference between the target direction and the user's facial orientation; and generates sound to be output by the headphone unit based on the obtained relative target angle. | 02-27-2014 |
20140062842 | DISPLAY DEVICE - An information processing apparatus including a communication interface configured to be connected to an external posture detecting device to be worn by a user; a display configured to rotatably display a display image; and circuitry configured to control a rotation angle of the image displayed by the display based on posture information received from the external posture detecting device. | 03-06-2014 |
20140072154 | AUDIO REPRODUCING METHOD AND APPARATUS - An information processing apparatus that reproduces left and right audio signals based on data acquired from a sound source; acquires left and right surrounding sounds collected by left and right microphones included in a headphone unit connected to the information processing apparatus; combines a sound corresponding to at least one of the left and right surrounding sounds with at least one of the left and right audio signals; and outputs the left and right audio signals combined with the sound corresponding to the at least one of the left and right surrounding sounds to left and right earphones of the headphone unit. | 03-13-2014 |
20140086438 | CONTROL METHOD OF MOBILE TERMINAL APPARATUS - A mobile device system that includes left and right earphones, and a mobile device connectable to the left and right earphones. Each of the left and right earphones includes at least one of an acceleration sensor and a geomagnetic sensor. The mobile device includes a controller that monitors a wearing state of the individual left and right earphones by a user on a basis of output from the least one of the acceleration sensors and the geomagnetic sensors, and controls a behavior of the mobile device connected to the left and right earphones according to the monitored wearing state of the left and right earphones by the user. | 03-27-2014 |
20140093088 | Method of checking earphone wearing state - An information processing apparatus that detects an output from a 3-axis acceleration sensor included in an earphone unit worn by a user while the user is in a still state; monitors the output of the 3-axis acceleration sensor while a nodding gesture is performed by the user; detects a time when an angle of the nodding gesture reaches a maximum; and determines an earphone wearing state based on the output from the 3-axis acceleration sensor in the still state and the output from the 3-axis acceleration sensor at the time of detecting the maximum nodding angle. | 04-03-2014 |
20150185113 | RIM ASSEMBLY AND TIRE TESTING MACHINE - A rim assembly includes a first rim on which a first reference surface is formed, a second rim on which a second reference surface is formed, a through-hole that extends to intersect the first reference surface of the first rim and into which an inserting part is inserted, pins erected on one of the first and second reference surfaces, protruding portions formed on the other of the first and second reference surfaces, first supporting members provided for the first reference surface, and second supporting members provided for the second reference surface. Groove portions with which the protruding portions are engaged are formed around the outer peripheral surfaces of the pins. The first and second supporting members come into contact with each other when the protruding portions are separated from the groove portions, and are separated from each other when the protruding portions are engaged to the groove portions. | 07-02-2015 |
20150234467 | METHOD AND APPARATUS FOR GESTURE DETECTION AND DISPLAY CONTROL - A device includes a display and one or more motion sensors configured to track positions of two or more feature points of an object when the object is used to perform a gesture at a position remote from the display, and generate, based on the tracked positions of the feature points, sequential position data that indicates a relative position of the feature points with respect to each other and to the display. The device includes circuitry configured to determine, based on the sequential position data, whether the gesture corresponds to one of a plurality of predetermined input operations, and execute processing related to the predetermined input operation when a correspondence is determined. The circuitry is configured to determine whether the gesture corresponds to the predetermined input operation based on variations in the relative positions of the feature points with respect to each other and to the display. | 08-20-2015 |
20150285623 | DISTANCE DETECTION DEVICE AND METHOD INCLUDING DYNAMICALLY ADJUSTED FRAME RATE - A device including an emitter that transmits light in a series of frames, wherein each frame in the series includes at least one pulse. The device includes a receiver that receives, for each frame in the series, the at least one pulse reflected from a target, and generates, in response to receiving the at least one pulse in a current frame, an output for calculating a distance between the target and the device for the current frame. The device includes circuitry that calculates, for each frame in the series, the distance between the target and the device based on the receiver output. The circuitry dynamically controls a frame rate for each frame in the series based on the distance calculated in a frame immediately preceding the current frame, and controls the emitter such that the at least one pulse is emitted in the current frame at the calculated frame rate. | 10-08-2015 |
Patent application number | Description | Published |
20120267141 | COMPOSITE ELECTRIC CABLE AND PROCESS FOR PRODUCING SAME - A composite electric cable including a plurality of element wires twisted together. The element wires include a material wire formed of a composite material containing an aluminum material and carbon nanotubes dispersed in the aluminum material; the material wire has a cellulation structure including a wall portion containing the carbon nanotubes and an inside portion of the wall which is surrounded by the wall portion and which comprises the aluminum material and unavoidable impurities; the material wire has a ratio of carbon nanotube content to aluminum material content of 0.2 wt. % to 5 wt. %; and each of all the element wires forming the composite electric cable is the material wire, or the composite electric cable includes in a center portion thereof one or a plurality of steel wires. | 10-25-2012 |
20130251619 | AGGREGATED THREAD STRUCTURE, PRODUCTION METHOD THEREOF, AND ELECTRIC WIRE USING THE SAME - A method for producing an aggregated thread structure includes (a) a process of dispersing carbon nanotube to a first solvent, which is water or a mixed solvent containing organic solvent and water, with a surfactant, to create a dispersion and (b) a process of injecting the dispersion, in which carbon nanotube is dispersed, to a condensing liquid, which is a second solvent that differs from the first solvent, to thereby aggregate and spin carbon nanotube. The aggregated thread structure containing carbon nanotube has: a bulk density of 0.5 g/cm | 09-26-2013 |
20140346697 | AGGREGATED THREAD STRUCTURE, PRODUCTION METHOD THEREOF, AND ELECTRIC WIRE USING THE SAME - A method for producing an aggregated thread structure includes (a) a process of dispersing carbon nanotube to a first solvent, which is water or a mixed solvent containing organic solvent and water, with a surfactant, to create a dispersion and (b) a process of injecting the dispersion, in which carbon nanotube is dispersed, to a condensing liquid, which is a second solvent that differs from the first solvent, to thereby aggregate and spin carbon nanotube. The aggregated thread structure containing carbon nanotube has: a bulk density of 0.5 g/cm | 11-27-2014 |
Patent application number | Description | Published |
20100181167 | TRACKING APPARATUS - A tracking apparatus which can ensure good-accuracy coincidence between a conveyed material and a tracked position thereof, even when slip occurs in the conveyed material moving across conveyance tables. A sensor is located at a boundary position of a conveyance table, of conveyance tables arranged adjacent to each other, to detect the presence or absence of a conveyed material. Head and tail end tracking data of the conveyed material is generated, and positions of head and tail ends are calculated using conveyance speed of a selected conveyance table as a speed standard. Then, occurrence or nonoccurrence of slip of the conveyed material is determined from the detection signal of the sensor and the positions of head and tail ends. When slip has occurred, head and tail end tracking data generation is stopped. Head and tail end tracking data generation is restarted considering a time delay due to removal of chattering from the detection signal. | 07-22-2010 |
20100192654 | GAUGE CONTROL APPARATUS - A gauge control apparatus reduces deviation of an actual plate thickness from a target plate thickness on the delivery side of a rolling mill, in all speed ranges, and produces good products by controlling plate thickness considering changes in the oil film thickness of oil film bearings of backup rolls and the deformation resistance of a rolled material with respect to rolling speeds. The gauge control apparatus computes an oil film thickness compensation value to compensate for increase and decrease of the gap resulting from a change in thickness of the oil film bearing attributable to rolling speeds, an acceleration compensation value to compensate for increase and decrease of plate thickness on the delivery side of the rolling mill resulting from a change in deformation resistance of the rolled material attributable to rolling speeds, and deviation of the predicted plate thickness from the target plate thickness, in consideration of the computed compensation values. | 08-05-2010 |
20100218578 | TEMPERATURE CONTROL DEVICE FOR HOT ROLLING MILL - A temperature control device for a hot rolling mill, preventing a sudden change in temperature of a rolled material near the delivery side of the rolling mill and realizing precise gauge control. The hot rolling mill has rolling stands arranged in a row and cooling devices for cooling the rolled material. The hot rolling mill is operated so that the cooling devices are preferentially used, in order, from one closest to the entry side until the upper limit pressure is reached. The cooling water pressure of each of the cooling devices is computed based on the target temperature of the rolled material and the actual temperature on the entry side. The cooling water pressure of the cooling device closest to the delivery side of the rolling mill is computed based on the target temperature of the rolled material and the actual temperature on the delivery side so the difference between the target temperature and the actual temperature on the delivery side is minimized. | 09-02-2010 |
20120173025 | CONTROLLER AND CONTROLLER OF ROLLING MILL - A controller restraining overcorrections which occur upon manual intervention in operation of an equipment controller. The controller includes a driving device which drives equipment to perform mechanical work, a computation element which computes a target value related to an action of the equipment, an automatic controller which outputs an automatic control signal for the driving device based on the target value so that the equipment becomes stable. The controller also includes a manual intervention control unit which outputs a manual correction signal for the driving device in response to a manual intervention. A manual correction unit makes a determination as to whether there is an overcorrection based on the automatic control signal and the manual correction signal, and outputs to the driving device a product obtained by multiplying the manual correction signal output from the manual intervention unit by a prescribed gain regulation value. | 07-05-2012 |
20150266072 | TAKE-UP DEVICE FOR STRIP - A take-up device includes a fluid-pressure device, a pressure detection device, a pressure calculation mechanism, and a controller. The fluid-pressure device is a device for expanding and contracting a mandrel. The pressure detection device detects a pressure of a hydraulic fluid in the fluid-pressure device. The pressure calculation mechanism calculates a tightening pressure acting on the mandrel, based on the pressure detected by the pressure detection device. The controller controls the fluid-pressure device. Also, the controller performs position control until the number of turns of a strip reaches a value. The controller performs constant-pressure control after the number of turns of the strip reaches the value. | 09-24-2015 |