Syomin
Denis Syomin, Fremont, CA US
Patent application number | Description | Published |
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20110139183 | SYSTEM AND METHOD OF PREVENTING PATTERN COLLAPSE USING LOW SURFACE TENSION FLUID - A system for processing a wafer with a low surface tension liquid includes a low surface tension liquid source including a first heat source capable of heating the low surface tension liquid to not more than 25 degrees C. less than boiling point of the low surface tension liquid, a delivery mechanism for delivering the heated low surface tension liquid to an air/liquid interface region and a second heat source directed toward the air/liquid interface region, the second heat source capable of heating the air/liquid interface region to at least 2 degrees C. greater than the boiling point of the low surface tension liquid. A method for processing a wafer with a low surface tension liquid is also described. | 06-16-2011 |
Denis Syomin, San Jose, CA US
Patent application number | Description | Published |
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20110183522 | METHOD AND APPARATUS FOR PATTERN COLLAPSE FREE WET PROCESSING OF SEMICONDUCTOR DEVICES - A method is provided for processing a wafer used in fabricating semiconductor devices. The method can comprise forming high-aspect ratio features on the wafer, which is followed by wet processing and drying. During drying, pattern collapse can occur. This pattern collapse can be repaired to allow for additional processing of the wafer. In some instance, pattern collapse can be repaired via etching where the etching breaks bonds that can have formed during pattern collapse. | 07-28-2011 |
Denis Syomin, Villach AT
Patent application number | Description | Published |
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20110294299 | METHOD AND APPARATUS FOR SILICON OXIDE RESIDUE REMOVAL - A method for removing silicon oxide based residue from a stack with a doped silicon oxide layer with features with diameters less than 100 nm is provided. A wet clean solution of between 25% to 60% by weight of NH | 12-01-2011 |