Patent application number | Description | Published |
20080211076 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device capable of elevating a yield rate of products to improve the productivity and also ensuring high reliability in production and a manufacturing method of the semiconductor device are provided. The semiconductor device includes a semiconductor substrate | 09-04-2008 |
20080297992 | HOLLOW SEALING STRUCTURE AND MANUFACTURING METHOD FOR HOLLOW SEALING STRUCTURE - A hollow sealing structure includes, a substrate, a functional element portion disposed on a principal surface of the substrate, and a covering portion disposed over the principal surface of the substrate to form a hollow portion in which the covering portion covers the functional element portion, the covering portion including a first covering structure portion having a plurality of openings, second covering structure portions disposed individually on imaginary straight lines which connect the functional element portion and the openings, and a sealing structure portion which seals gaps defined between the first covering structure portion and the second covering structure portions. | 12-04-2008 |
20080308919 | HOLLOW SEALING STRUCTURE AND MANUFACTURING METHOD FOR HOLLOW SEALING STRUCTURE - A manufacturing method for a hollow sealing structure, includes, a process for filling a recessed portion in a principal surface of a substrate with a first sacrificial layer, a process for forming a functional element portion on the principal surface of the substrate, a process for forming a second sacrificial layer on the functional element portion so as to be connected to a part of the first sacrificial layer, a process for forming a covering portion over respective surfaces of the first and second sacrificial layers, a process for circulating a fluid for sacrificial layer removal through an opening in the covering portion in contact with the first sacrificial layer, thereby removing the first and second sacrificial layers, and a process for closing the opening. | 12-18-2008 |
20090025976 | ELECTRIC COMPONENT - An electric component includes a substrate, a function element provided on the substrate, a first sealing body provided on the substrate to cover the function element at a certain distance, the first sealing body including multiple apertures communicating with an internal space formed between the first sealing body and the substrate, and a second sealing body provided on the first sealing body and configured to occlude the multiple apertures. Here, a boundary between the first sealing body and the substrate is curved in a direction to narrow the internal space. | 01-29-2009 |
20090101383 | MICROMECHANICAL DEVICE AND METHOD OF MANUFACTURING MICROMECHANICAL DEVICE - A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics concomitantly with the deformation, an inner inorganic sealing film which contains an inorganic material, is provided on a principal surface of the substrate, covers the micromachine through a hollow section containing a gaseous body therein, and is provided with opening shape sections allowing the hollow section to communicate with the outside, an organic sealing film which contains an organic material, is formed on the inner inorganic sealing film, and blocks up the opening shape sections, and an outer inorganic sealing film which contains an inorganic material with lower moisture permeability than the organic material, is formed on the organic sealing film, and covers the organic sealing film. | 04-23-2009 |
20090236114 | MICROMECHANICAL DEVICE AND METHOD OF MANUFACTURING MICROMECHANICAL DEVICE - An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween. | 09-24-2009 |
20110148045 | HOLLOW SEALING STRUCTURE AND MANUFACTURING METHOD FOR HOLLOW SEALING STRUCTURE - A manufacturing method for a hollow sealing structure, includes, a process for filling a recessed portion in a principal surface of a substrate with a first sacrificial layer, a process for forming a functional element portion on the principal surface of the substrate, a process for forming a second sacrificial layer on the functional element portion so as to be connected to a part of the first sacrificial layer, a process for forming a covering portion over respective surfaces of the first and second sacrificial layers, a process for circulating a fluid for sacrificial layer removal through an opening in the covering portion in contact with the first sacrificial layer, thereby removing the first and second sacrificial layers, and a process for closing the opening. | 06-23-2011 |
20110215427 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole. | 09-08-2011 |