Patent application number | Description | Published |
20080268571 | Apparatus for heating chip, flip chip bonder having the apparatus, and method for bonding flip chip using the same - An apparatus for heating a chip includes: a laser generator for emitting a laser beam to a semiconductor chip to heat the semiconductor chip; and a beam intensity adjuster disposed on a laser emission path between the semiconductor chip and the laser generator to equalize the intensity of the laser beam to be emitted to the semiconductor chip. A flip chip bonder having the chip heating apparatus, and a method for bonding a flip chip using the same are also provided. | 10-30-2008 |
20090129412 | Apparatus for bonding camera module, equipment for assembling camera module having the apparatus, and method of assembling camera module using the equipment - An apparatus for bonding a camera module, equipment for assembling the camera module having the apparatus, and a method of assembling the camera module using the equipment. The apparatus include: a laser generator, which generates a laser beam, and a bonding head, which is connected to the laser generator through an optical fiber and applies the laser beam propagating through the optical fiber to contact portions of a camera unit having an image sensor and lenses and a flexible printed circuit board (FPCB) electrically connected to the image sensor, so that the contact portions can be heated and bonded to each other such that the camera unit and the FPCB are bonded to each other. Thus, a process of bonding the camera module can be performed within a relatively short time, compared to the case where a hot-bar or an oven is used. | 05-21-2009 |
20100206602 | Bump Structure With Multiple Layers And Method Of Manufacture - A bump structure with multiple layers may include a first layer electrically connected to a protective substrate hermetically packaging a base substrate, the first layer allowing the base substrate and the protective substrate to be spaced apart from each other at a predetermined distance; and a second layer electrically connected to the first layer, the second layer being eutectically bonded on a surface of the base substrate. The first layer may have a melting point higher than a eutectic temperature of the second layer and the base substrate. When using a bump structure with multiple layers, it is possible to secure a space in which a micro-structure such as a microelectromechanical systems (MEMS) device on a base substrate may be driven. Further, it is possible to prevent a contact between adjacent structures or electrodes from being generated due to diffusion of a bonding material in a hermetical packaging process. | 08-19-2010 |
20100327443 | JOINING STRUCTURE AND A SUBSTRATE-JOINING METHOD USING THE SAME - The present invention concerns a joining structure and a substrate-joining method using the same. The joining structure comprises a substrate, and comprises a plurality of joining patterns which are located on the said substrate and which are spaced apart from each other. The substrate-joining method using the joining structure can comprise: a stage involving the formation of a plurality of joining patterns which are spaced apart from each other on a first substrate; and a stage of joining a second substrate on the plurality of joining patterns. When the said joining structure is employed, it is possible to reduce or prevent damage due to spreading of the joining substance during joining of the two substrates. | 12-30-2010 |
Patent application number | Description | Published |
20100090583 | Green phosphor for plasma display panel, green phosphor composition including the same, and plasma display panel including the same - A green phosphor for a plasma display panel (PDP), a green phosphor composition including the same, and a PDP including the same, the green phosphor including a green phosphor represented by Formula 1: (Lu | 04-15-2010 |
20100182359 | INK JET HEAD AND INK SUPPLYING METHOD THEREOF - An Inkjet head according to an exemplary embodiment of the present invention includes an ink storage unit including an inner storage space, a head unit connected to the ink storage unit, and a plurality of nozzles discharging the ink, wherein the floors of the inner storage space of the ink storage unit form a step. Accordingly, in the Inkjet head of an exemplary embodiment of the present invention, the floors of the inner storage space of the ink storage unit form a step, and the ceiling of the inner flow space of the head unit is inclined, thereby preventing the ink vapor from being confined inside the head unit. Therefore, the ink to be discharged through the nozzle flows in a predetermined direction and does not include ink vapor, thereby preventing discharge deterioration. | 07-22-2010 |
20110170215 | ASYMMETRIC DISK CLAMP AND SPINDLE MOTOR ASSEMBLY INCLUDING ASYMMETRIC DISK CLAMP - A spindle motor assembly includes a spindle motor, a disk for storing data, the disk being installed on the spindle motor, and a disk clamp for fixing the disk to the spindle motor. The disk clamp includes a hollow formed in a central portion thereof, a coupling portion formed around an external circumference of the hollow and including a plurality of screw insertion holes into which clamp fastening screws to be coupled to the spindle motor are inserted, and a pressing portion formed around an external circumference of the coupling portion to press the disk. The coupling portion includes a first region and a second region that are asymmetrical with respect to each other, the plurality of screw insertion holes are formed in the first region only, and a thickness extension portion or a through hole is formed in at least a portion of the second region. | 07-14-2011 |
20110194212 | BASE MEMBER INCLUDING TWO-STEP RECESSES AND HARD DISK DRIVE INCLUDING THE SAME - A base member including two-step recesses and a hard disk drive (HDD) including the same. The HDD includes a base member; a spindle motor installed in the base member; a data storage disk assembled to the spindle motor; and an actuator rotatably installed in the base member and for moving a read/write head to a desired position on the disk, wherein the base member includes: a first floor surface disposed in a region facing the disk and having a center portion in which the spindle motor is installed; a shroud formed on a circumference of the first floor surface and extending the exterior circumference of the disk; and two-step recesses formed in an operating region of the actuator, wherein the two-step recesses comprise a first step recess formed on the first floor surface and a second step recess formed on a floor surface of the first step recess. An extended shroud is formed in an upstream side of an operating region of the actuator of the base member, protrudes from the shroud, and extends along the exterior circumference of the disk. An air block is installed in a downstream side of the operating region of the actuator. | 08-11-2011 |
Patent application number | Description | Published |
20110261305 | TRANSFLECTIVE LIQUID CRYSTAL DISPLAY DEVICE HAVING A THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF - There are provided a thin film transistor substrate for transflective liquid crystal display device (LCD) and a manufacturing method thereof, which can reduce manufacturing cost and simplifying manufacturing processes. In the method, a thin film transistor is formed on a reflection region of a device substrate defined by the reflection region and a transmission region. A passivation layer is formed on the thin film transistor so as to expose a drain electrode of the thin film transistor and to cover the thin film transistor. A pixel electrode is formed on the transmission and reflection regions. The pixel electrode has a structure of a first pixel electrode electrically connected to the drain electrode and a second pixel electrode formed to have an embossed pattern on the first pixel electrode. A reflective layer is formed on the second electrode pixel having the embossed pattern on the reflection region. | 10-27-2011 |
20140183468 | PYRENE-BASED COMPOUND AND ORGANIC LIGHT-EMITTING DIODE COMPRISING THE SAME - A pyrene-based compound and an organic light-emitting diode including the pyrene-based compound are provided. The pyrene-based compound of Formula 1 above may emit blue light having high color purity. For example, an organic light-emitting diode including the pyrene-based compounds of the invention may emit blue light having a y coordinate with a color purity of 0.1 or less, for example, a color purity of 0.09 or less, which is near to the NTSC or sRGB specification. A thin film including the pyrene-based compounds of the invention may be highly amorphous, and thus may have improved electrical stability. Accordingly, an organic light-emitting diode including the pyrene-based compounds of the invention may have improved lifetime characteristics. | 07-03-2014 |
20140326960 | ORGANIC LIGHT-EMITTING DIODE - An organic light-emitting diode (OLED) includes a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode. The organic layer includes a compound represented by one of Formula 1 or Formula 2, and a metallic complex. | 11-06-2014 |
20150034915 | ORGANIC LIGHT-EMITTING DEVICE - An organic light-emitting device includes a first electrode, a second electrode, and an organic layer interposed between the first electrode and the second electrode, wherein the organic layer includes an emission layer, the emission layer includes a compound represented by Formula 2 below, and a second layer including a heterocyclic compound represented by Formula 1 below either between the emission layer and the first electrode or between the emission layer and the second electrode. | 02-05-2015 |
20150053937 | ORGANIC LIGHT-EMITTING DEVICE - An organic light-emitting device including a first electrode; a second electrode; and an organic layer between the first electrode and the second electrode, wherein the organic layer includes an emission layer and any one of a hole injection layer, a hole transport layer, or a functional layer having hole injection and hole transport abilities, wherein the emission layer includes an organic metal complex represented by Formula 1 herein, and wherein the hole injection layer, the hole transport layer, or the functional layer having hole injection and hole transport abilities includes a compound represented by Formula 2 or 3 herein. | 02-26-2015 |