Patent application number | Description | Published |
20110058306 | Chip-type electric double layer capacitor and package structure thereof - Disclosed is a package structure of a chip-type electric double layer capacitor which includes a lower package, which houses an electric double layer element and has a package terminal formed thereon to be electrically connected to the electric double layer element, and an upper package which is disposed on a top part of the lower package and seals the electric double layer element from the outside, wherein the package terminals are formed to be protruded from an internal bottom surface and an external bottom surface of the lower package, and the external bottom surface of the lower package has at least two pairs of protrusions formed thereon. | 03-10-2011 |
20110058307 | Chip-type electric double layer capacitor and method for manufacturing the same - The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively. | 03-10-2011 |
20110085283 | Chip type electric double layer capacitor and method for manufacturing the same - The present invention provides a chip type electric double layer capacitor including: a lower case having an internal space of which an upper surface is opened and an external terminal of which portions exposed to a bottom of the internal space and the outside are connected to each other; an electric double layer capacitor cell disposed in the internal space of the lower case to be electrically connected to the portion of the external terminal, which is exposed to the bottom of the internal space; and an upper cap mounted on the lower case to cover the internal space, and a method for manufacturing the same. | 04-14-2011 |
20110252814 | Thermal insulator for construction using thermoelectric module - The present invention provides a thermal insulator for construction including: a thermoelectric module inserted in a wall or floor of a building and including a plurality of thermoelectric elements; a power supply module for supplying power to the thermoelectric module; and a power control module for controlling size and polarity of the power supplied to the thermoelectric module from the power supply module. This thermal insulator for construction can provide much better thermal insulation performance in comparison with a conventional thermal insulator, and it is possible to reduce thickness of the wall or floor in comparison with when using the conventional thermal insulator since the thermoelectric element has very small size. Further, it is possible to implement a cooling or heating effect only by changing polarity and size of applied current. | 10-20-2011 |
20110259018 | Thermoelectric module and method for manufacturing the same - Disclosed herein are a thermoelectric module including a first substrate and a second substrate that are opposite to each other and spaced from each other; first and second electrodes that are disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric element that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes, wherein at least any one of the first and second substrates has an insulating layer disposed on one surface and a fluid flowing line for moving a fluid transferring heat therein, and a method for manufacturing the same. | 10-27-2011 |
20110290293 | Thermoelectric module and method for manufacturing the same - Disclosed herein is a thermoelectric module. The thermoelectric module includes: first and second substrates that are disposed to be separated from each other, facing each other and includes first and second grooves each formed on inner sides thereof; first and second electrodes that are received in the first and second grooves, respectively; and a thermoelectric device that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes. As a result, the present invention provide a thermoelectric module and a method for manufacturing the same capable of improving the figure of merit and reliability of the thermoelectric module. | 12-01-2011 |
20120042921 | Method for manufacturing thermoelectric module and thermoelectric module manufactured from the same - The present invention provides a method for manufacturing a thermoelectric module and a thermoelectric module manufactured from the same. The method includes the steps of: forming each of first and second green laminates; forming first and second preliminary electrodes by printing a conductive paste on each of the first and second green laminates; disposing thermoelectric elements on any one of the first and second preliminary electrodes; stacking the first and second green laminates in such a manner that the thermoelectric elements are interposed between the first and second preliminary electrodes; and firing the stacked first and second green sheet laminates, thereby forming the first and second electrodes, and first and second ceramic substrates, and simultaneously bonding the first ceramic substrate to the first electrode, the first and second electrodes to the thermoelectric elements, and the second ceramic substrate to the second electrode. | 02-23-2012 |
20140178784 | ACTIVE THERMAL MANAGEMENT SYSTEM FOR FUEL CELL STACK - An active thermal management system for a fuel cell stack controls the distribution of coolant flow for each unit cell of the fuel cell stack based on the temperature distribution measured at unit cells of the fuel cell stack. A coolant distribution means is capable of controlling the distribution of coolant flow for different sets of unit cells. The coolant distribution means is disposed in a coolant inlet manifold, and controls the coolant flow based on the temperature distribution measured at different unit cells of the fuel cell stack so as to reduce temperature variation in the unit cells, thus improving the performance and durability of the fuel cell stack. | 06-26-2014 |
20140356749 | APPARATUS FOR PREVENTING OVER-COOLING OF FUEL CELL - An apparatus preventing over-cooling of a fuel cell is provided that includes a cooling fluid manifold which is mounted to a stack of the fuel cell and through which cooling fluid flows therethrough. End plates are arranged on both ends of the stack of a fuel cell, and at least one protrusion is provided on one surface of each of the end plates. The at least one protrusion is disposed inside a cooling fluid manifold to reduce the flow amount of the cooling fluid which flows in and out between the separating plates through the cooling fluid manifold. | 12-04-2014 |