Patent application number | Description | Published |
20080212230 | WAVEGUIDE STRUCTURE, MANUFACTURING METHOD THEREOF AND HAMR USING THE SAME - A manufacturing method of a waveguide structure includes forming a metal layer of a predetermined size on a substrate to form a structure, forming a lower clad layer on the structure in order to completely cover the metal layer, forming a core layer of a predetermined size on the lower clad layer at the location corresponding to the metal layer, and forming an upper clad layer thereon in order to completely cover the core layer. | 09-04-2008 |
20080232225 | 90°-BENT METALLIC WAVEGUIDE HAVING TAPERED C-SHAPED APERTURE, METHOD OF FABRICATING THE WAVEGUIDE, LIGHT DELIVERY MODULE INCLUDING THE WAVEGUIDE, AND HEAT ASSISTED MAGNETIC RECORDING HEAD HAVING THE WAVEGUIDE - A metallic wave guide and a light delivery module are provided. The metallic waveguide includes a metal body formed of a conductive metal and having an aperture formed therethrough, the aperture having input and output ends. The aperture has a bent portion for changing a light traveling direction between the input and output ends, and a tapered portion between the bent portion and the output end. The tapered portion has a width that is gradually reduced toward the output end, and the aperture is formed in a C-shape by a ridge formed on an inner surface of the metal body. | 09-25-2008 |
20080261081 | PERPENDICULAR MAGNETIC RECORDING MEDIUM AND METHOD OF MANUFACTURING THE SAME - Provided is a perpendicular magnetic recording medium and a method of manufacturing the same. The perpendicular magnetic recording medium includes a substrate, a buffer layer formed on the substrate, a soft magnetic underlayer formed on the buffer layer, and a recording layer formed on the soft magnetic underlayer. | 10-23-2008 |
20090114927 | Multi-chips with an optical interconnection unit - A multi-chip having an optical interconnection unit is provided. The multi-chip having an optical interconnection unit includes a plurality of silicon chips sequentially stacked, a plurality of optical device arrays on a side of each of the plurality of the silicon chips such that the optical device arrays correspond to each other and a wiring electrically connecting the silicon chip and the optical device array attached to a side of the silicon chip, wherein the corresponding optical device arrays forms an optical connection unit by transmitting and receiving an optical signal between the corresponding optical device arrays in different layers. Each of the optical device arrays includes at least one of a light emitting device and a light receiving device | 05-07-2009 |
20090136235 | Probe card with optical transmitting unit and memory tester having the same - Example embodiments provide a probe card having an optical transmitting unit and a memory tester having the probe card. The probe card may include a plurality of needles connected to test terminals formed in a memory, a plurality of first terminals connected to the needles, a plurality of second terminals connected to the outside and corresponding to the first terminals, and an optical transmitting unit. The optical transmitting unit may connect the first terminals and the second terminals. | 05-28-2009 |
20090175630 | Optical interconnection system for transmitting and receiving a three-level signal and method of operating the same - Provided is an optical interconnection system that transmits and receives a three-level signal. The optical interconnection system includes a first and a second optical interconnection device that transmits and receives a two-level signal, and a synthesizer that outputs a three-level signal by synthesizing signals from the first and second optical interconnection devices. The optical interconnection system may transmit and receive a three-level signal while using an optical interconnection device that interconnects a two-level signal. | 07-09-2009 |
20090252023 | INTEGRATED OPTICAL SYSTEM AND METHOD OF MANUFACTURING THE SAME AND INFORMATION RECORDING AND/OR REPRODUCING APPARATUS USING THE INTEGRATED OPTICAL SYSTEM - An optical system and an information apparatus using the optical system are provided. The optical system includes an optical bench on which a light source and a photodetector including a main photodetector receiving the light are mounted. A lens unit is coupled to the optical bench, and an optical path separating member separates an optical path of light emitted from the light source and propagating toward the lens unit and an optical path of light incident from the lens unit. The optical system may include a monitor photodetector and/or an optical path forming unit coupled to the optical bench. The monitor photodetector receives a portion of the light emitted from the light source. The optical path forming unit includes a first mirror reflecting the light emitted from the light source and a second mirror reflecting the light incident from the lens unit and reflected by the first mirror. | 10-08-2009 |
20090323224 | HEAD GIMBALS ASSEMBLY OF HARD DISK AND METHOD OF ASSEMBLING THEREOF - Disclosed is a head gimbals assembly for a hard disk for use in a thermally assisted magnetic disk recording medium, in which a laser diode is applied so as to record information with high density, and a method of assembling such a head gimbals assembly. The head gimbals assembly for a hard disk comprises: a plurality of suspensions, each of which is provided with a magnetic head positioned adjacent to a corresponding disk surface among the disks so as to record/reproduce information; a head gimbals body having a centrally formed pivot hole which allows the head gimbals body to be fitted in such a manner as to be rotatable in relation to the disks, the suspensions extending from one end of the head gimbals body; a coil rotator provided at the other end of the head gimbals body so as to rotate the head gimbals body about the pivot hole; and a laser assembly having one or more laser diodes and one or more wave guides, the light emitted from any of the laser diodes is guided to a corresponding magnetic head by the wave guides. According to the present invention, because the head gimbals assembly having a laser diode used for increasing a data recording density of a magnetic disk is not fixed to a suspension but fixed to a head gimbals body which serves as a support for the head gimbals assembly, the heat produced from the head gimbals assembly can be efficiently lowered. Furthermore, because the number of peripheral optical components of the suspension is reduced, the flight of a magnetic head can be smoothly performed, so that the recording/reproducing of high density data can be efficiently performed. | 12-31-2009 |
20100194399 | MEMORY SYSTEM, MEMORY TEST SYSTEM AND METHOD OF TESTING MEMORY SYSTEM AND MEMORY TEST SYSTEM - A memory test system is disclosed. The memory system includes a memory device, a tester generating a clock signal and a test signal for testing the memory device, and an optical splitting module. The optical splitting module comprises an electrical-optical signal converting unit which converts each of the clock signal and the test signal into an optical signal to output the clock signal and the test signal as an optical clock signal and an optical test signal. The optical splitting unit further comprises an optical signal splitting unit which splits each of the optical clock signal and the optical test signal into n signals (n being at least two), and an optical-electrical signal converting unit which receives the split optical clock signal and the split optical test signal to convert the split optical clock signal and the split optical test signal into electrical signals used in the memory device. | 08-05-2010 |
20100195420 | SEMICONDUCTOR MEMORY DEVICE AND SYSTEM - A semiconductor memory system includes a memory controller and a memory. The memory controller includes a control signal converting unit converting a control signal into a converted control signal including n sequential clock pulses and a target clock pulse activated after a time period has elapsed from a start point of the n sequential clock pulses, and output the converted clock signal, and a controller transmitting unit converting the converted control signal into an optical signal, and transmitting the optical signal to the memory. The memory includes a memory receiving unit converting the optical signal into an electrical signal, and a control signal re-converting unit detecting the time period from the electrical signal, and converting the control signal into a control signal corresponding to the time period. | 08-05-2010 |
20110038221 | SEMICONDUCTOR MEMORY DEVICES, CONTROLLERS, AND SEMICONDUCTOR MEMORY SYSTEMS - A semiconductor memory system includes a controller and a memory device that are optical-interconnected. The controller includes a control logic configured to generate a control signal for controlling the memory device and a transmitter configured to convert the control signal into an optical signal, and output the optical signal. The memory device includes a receiving unit filter configured to convert the optical signal into an electric signal, and the electric signal based on a supply voltage corresponding to a period of the optical signal or the electric signal. | 02-17-2011 |
20110069464 | Memory module, memory system having the memory module, and method for manufacturing the memory module - Provided is a memory module, a system using the memory module, and a method of fabricating the memory module. The memory module may include a printed circuit board and a memory package on the printed circuit board. The printed circuit board may include an embedded optical waveguide and a first optical window extending from the optical waveguide to a first surface of the printed circuit board. The memory package may also include a memory die having an optical input/output section and a second optical window. The optical input/output section, the second optical window, and the first optical window may be arranged in a line and the first optical window and the second optical window may be configured to at least one of transmit an optical signal from the optical waveguide to the optical input/output section and transmit an optical signal from the optical input/output section to the optical waveguide. | 03-24-2011 |
20110133063 | Optical waveguide and coupler apparatus and method of manufacturing the same - Optical waveguide and coupler devices and methods include a trench formed in a bulk semiconductor substrate, for example, a bulk silicon substrate. A bottom cladding layer is formed in the trench, and a core region is formed on the bottom cladding layer. A reflective element, such as a distributed Bragg reflector can be formed under the coupler device and/or the waveguide device. Because the optical devices are integrated in a bulk substrate, they can be readily integrated with other devices on a chip or die in accordance with silicon photonics technology. Specifically, for example, the optical devices can be integrated in a DRAM memory circuit chip die. | 06-09-2011 |
20110134679 | MEMORY MODULE HAVING OPTICAL BEAM PATH, APPARATUS INCLUDING THE MODULE, AND METHOD OF FABRICATING THE MODULE - A memory module may include at least one memory package including an optical signal input/output (I/O) unit and a first optical beam path and a printed circuit board (PCB) on which the memory package is mounted. The PCB may have a second optical beam path configured to transmit an optical signal to the optical signal I/O unit. The memory module may further include a connecting body configured to mount the memory package on the PCB and match a refractive index of the first optical beam path with a refractive index of the second optical beam path. | 06-09-2011 |
20110194803 | OPTICAL MODULATOR FORMED ON BULK-SILICON SUBSTRATE - An optical modulator comprises a bulk-silicon substrate comprising a trench having a predetermined width and a predetermined depth. A bottom cladding layer is formed in the trench, and a plurality of waveguides and a phase modulation unit are formed on the bottom cladding layer. A top cladding layer is formed on the plurality of waveguides and the phase modulation unit. | 08-11-2011 |
20110206381 | OPTICAL SERIALIZING/DESERIALIZING APPARATUS AND METHOD AND METHOD OF MANUFACTURING SAME - An optical serializer/deserializer (SERDES) includes serializing circuitry which includes a source of a plurality of unmodulated optical signals, a modulation unit for generating a plurality of modulated optical signals using a plurality of electrical signals to modulate the plurality of unmodulated optical signals, and a coupling unit for delaying the plurality of modulated optical signs to generate a plurality of delayed modulated optical signals and combines the delayed modulated optical signals to generate a serialized modulated optical signal. Deserializing circuitry of the SERDES includes an optical splitter for splitting a serialized modulated optical signal into a plurality of modulated split optical signals, a demodulation unit for demodulating the modulated split optical signals and generating a respective plurality of demodulated split optical signals, and a delay unit for delaying each of the plurality of demodulated split optical signals by a respective delay amount such that the serialized modulated optical signal is converted into a respective plurality of parallel demodulated split optical signals. | 08-25-2011 |
20110243492 | SILICON BASED OPTICAL MODULATORS AND METHODS OF FABRICATING THE SAME - A silicon based optical modulator apparatus can include a lateral slab on an optical waveguide, the lateral slab protruding beyond side walls of the optical waveguide so that a portion of the optical waveguide protrudes from the lateral slab towards a substrate. | 10-06-2011 |
20120002495 | MEMORY SYSTEM, MEMORY TEST SYSTEM AND METHOD OF TESTING MEMORY SYSTEM AND MEMORY TEST SYSTEM - A memory test system is disclosed. The memory system includes a memory device, a tester generating a clock signal and a test signal for testing the memory device, and an optical splitting module. The optical splitting module comprises an electrical-optical signal converting unit which converts each of the clock signal and the test signal into an optical signal to output the clock signal and the test signal as an optical clock signal and an optical test signal. The optical splitting unit further comprises an optical signal splitting unit which splits each of the optical clock signal and the optical test signal into n signals (n being at least two), and an optical-electrical signal converting unit which receives the split optical clock signal and the split optical test signal to convert the split optical clock signal and the split optical test signal into electrical signals used in the memory device. | 01-05-2012 |
20120087673 | OPTICAL INTERCONNECTION SYSTEM FOR TRANSMITTING AND RECEIVING A THREE-LEVEL SIGNAL AND METHOD OF OPERATING THE SAME - Provided is an optical interconnection system that transmits and receives a three-level signal. The optical interconnection system includes a first and a second optical interconnection device that transmits and receives a two-level signal, and a synthesizer that outputs a three-level signal by synthesizing signals from the first and second optical interconnection devices. The optical interconnection system may transmit and receive a three-level signal while using an optical interconnection device that interconnects a two-level signal. | 04-12-2012 |
20130015546 | MULTI-LAYER PHOTOELECTRIC INTEGRATED CIRCUIT DEVICE WITH OVERLAPPING DEVICESAANM Joe; In-sungAACI SeoulAACO KRAAGP Joe; In-sung Seoul KRAANM Suh; Sung-dongAACI SeoulAACO KRAAGP Suh; Sung-dong Seoul KRAANM Na; Kyoung-wonAACI SeoulAACO KRAAGP Na; Kyoung-won Seoul KRAANM Ha; Kyoung-hoAACI SeoulAACO KRAAGP Ha; Kyoung-ho Seoul KRAANM Kim; Seong-guAACI Pyeongtaek-siAACO KRAAGP Kim; Seong-gu Pyeongtaek-si KRAANM Shin; Young-hwackAACI Yeonsu-guAACO KRAAGP Shin; Young-hwack Yeonsu-gu KR - An integrated circuit device includes a plurality of device layers disposed on a substrate. A first one of the device layers includes at least one photo device and/or at least one electronic device and a second one of the device layers includes at least one photo device overlying the at least one photo device and/or the at least one electronic device of the first one of the device layers. | 01-17-2013 |
20130022327 | Manufacturing Method of Waveguide Having a Metal Alignment Mark - A waveguide structure includes a metal layer of a predetermined size on a substrate, a lower clad layer on the structure completely covering the metal layer, a core layer of a predetermined size on the lower clad layer at the location corresponding to the metal layer, and an upper clad layer thereon completely covering the core layer. | 01-24-2013 |
20130064496 | OPTICAL LINKS, MANUFACTURING METHODS THEREOF, AND MEMORY SYSTEMS HAVING THE SAME - An optical link may include a main optical waveguide; N sub-optical waveguides, where N is a natural number; N mode couplers, each configured to perform a mode coupling operation between the main optical waveguide and a respective one of the N sub-optical waveguide; and an optical wavelength filter connected to an output terminal of the main optical waveguide and an output terminal of each of the N sub-optical waveguides. A memory system may include a memory device, a memory controller, and the optical link. A data processing system may include the memory system and a central processing unit connected to the memory system through a bus. | 03-14-2013 |
20130119270 | WAVELENGTH DIVISION DEVICES, MULTI-WAVELENGTH LIGHT GENERATORS AND OPTICAL BIOSENSOR SYSTEMS USING THE SAME - A multi-wavelength light generator includes a broadband light source and a wavelength division device. The multi-wavelength light generator is configured to generate a first output light having a first line width. The wavelength division device is configured to divide a wavelength of the first output light to provide a plurality of second output lights. Each of the second output lights has a second line width narrower than the first line width, and each of the second output lights is used as a light source of each channel of an optical sensor. | 05-16-2013 |
20130224847 | OPTICAL HEADS AND SEQUENCING APPARATUSES INCLUDING THE SAME - A sequencing apparatus may include a bio-disk having reaction regions in which nucleic acids are polymerized; a stage configured to revolve around an axis, the stage including optical heads for detecting lights emitted from the plurality of reaction regions due to the polymerization of the nucleic acids; and/or a control unit configured to generate data regarding base sequences of the nucleic acids in the reaction regions based on wavelengths of the lights detected by the plurality of optical heads. An optical head may include a light emitting unit configured to emit light toward a reaction region in which nucleic acids are polymerized; a light receiving unit configured to receive the light emitted by the light emitting unit; a de-multiplexing unit configured to de-multiplex the light received by the light receiving unit; and/or a plurality of photoelectric converting units configured to convert the de-multiplexed light to electrical signals. | 08-29-2013 |
20130259747 | Optical Biosensor - An optical biosensor includes a sensing block that receives a first optical signal and outputs a second optical signal through at least one channel of a plurality of channels that correspond to a sensed concentration of a biomaterial; and a detecting block that detects the second optical signal, converts the second optical signal into an electrical signal, and outputs the electrical signal. | 10-03-2013 |
20130309135 | OPTICAL BIOSENSOR, BIO-SENSING SYSTEM INCLUDING THE SAME, AND METHOD OF FABRICATING THE OPTICAL BIOSENSOR - An optical biosensor including a bio-sensing unit configured to receive an optical signal and generating a sensed optical signal, the wavelength of which varies according to a result of sensing a biomaterial; and a spectrometer including a plurality of ring resonators for dividing the sensed optical signal according to a wavelength and generating a plurality of output optical signals, respectively. | 11-21-2013 |
20140134712 | OPTICAL BIOSENSOR AND MANUFACTURING METHOD THEREOF - An optical biosensor, and a method of manufacturing the same, includes a first layer, a second layer stacked on the first layer, a first grating coupler within the first layer and the second layer, and a second grating coupler within the first layer. The first grating coupler is configured to couple a light pattern provided to a front side of the optical biosensor. The second grating coupler is configured to output the light pattern coupled by the first grating coupler to a photoelectric conversion element on a rear side of the optical biosensor. | 05-15-2014 |
20140209929 | OPTICAL COUPLING SYSTEM AND OPTICAL SENSOR INCLUDING THE SAME - An optical coupling system is provided which includes a first layer structure and a second layer structure. The first layer structure includes a plurality of layers sequentially stacked on a substrate, and is configured to compresses a beam emitted from a light source along a direction substantially perpendicular to a top surface of the substrate. The second layer structure is formed on the substrate, and is configured to compresses the beam, having passed through the first layer structure, along a direction substantially parallel to the top surface of the substrate. | 07-31-2014 |
20140268165 | OPTICAL BIOSENSOR AND METHOD OF OPERATING THE SAME - An optical biosensor may include a biosensing unit, detection unit, and signal processing unit. The biosensing unit may be configured for receiving first and second optical signals (which are generated from a phase-modulated optical signal), outputting a sensing signal by transmitting the first optical signal via a first optical path that includes a sensing resonator, and outputting a reference signal by transmitting the second optical signal via a second optical path that includes a reference resonator. The detection unit may be configured for receiving the sensing signal and the reference signal, detecting a phase element of each of the sensing signal and the reference signal through a signal demodulation operation, and detecting a phase difference between the sensing signal and the reference signal according to the detected phase elements. The signal processing unit may be configured for calculating the concentration of a bio-material based on the detected phase difference. | 09-18-2014 |
20140376859 | MULTI-LAYER PHOTOELECTRIC INTEGRATED CIRCUIT DEVICE WITH OVERLAPPING DEVICES - An integrated circuit device includes a plurality of device layers disposed on a substrate. A first one of the device layers includes at least one photo device and/or at least one electronic device and a second one of the device layers includes at least one photo device overlying the at least one photo device and/or the at least one electronic device of the first one of the device layers. | 12-25-2014 |