Patent application number | Description | Published |
20130048943 | ORGANIC LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF - There are provided an organic light emitting diode and a fabrication method thereof. The organic light emitting diode includes: an anode formed on a substrate; a thin film layer formed on the anode and including graphene; a light emitting polymer layer formed on the thin film layer; and a cathode formed on the light emitting polymer layer. Heat generated from the device can be effectively dissipated, stability of the device can be enhanced, and a life span of the device can be extended. | 02-28-2013 |
20130099149 | INSULATING LAYER COMPOSITION FOR SUBSTRATE, AND PREPEG AND SUBSTRATE USING THE SAME - Disclosed herein are an insulating layer composition for a substrate, including a soluble type liquid crystal thermosetting oligomer, a metal alkoxide compound, and graphene oxide, and an insulating film and a substrate using the same. | 04-25-2013 |
20130281575 | INSULATING COMPOSITION FOR SUBSTRATE, AND PREPREG AND SUBSTRATE USING THE SAME - The present invention relates to an insulating composition for a substrate including a soluble liquid crystal thermosetting oligomer, a metal alkoxide, a graphene oxide, and a short fiber, and an insulating material and a substrate using the same. The insulating composition in accordance with the present invention can effectively reduce the coefficient of thermal expansion by the addition of the metal alkoxide and the graphene oxide. Therefore, it is possible to provide a substrate material with greatly increased strength and rigidity by the addition of the short fiber as well as to manufacture a substrate with improved thermal stability by using the insulating composition in accordance with the present invention as an insulating material of the substrate to minimize dimensional deformation due to heat. | 10-24-2013 |
20140061891 | SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - Disclosed herein are a semiconductor chip package and a manufacturing method thereof. The manufacturing method of the semiconductor chip package includes: a) mounting a semiconductor chip on a printed circuit board (PCB); b) inserting a warpage suppressing reinforcement member into an inner ceiling of a mold manufactured in order to package the PCB having the semiconductor chip mounted thereon; c) combining the mold having the warpage suppressing reinforcement member inserted into the ceiling thereof with the upper surface of the PCB so as to surround the PCB having the semiconductor chip mounted thereon; d) injection-molding and filling a molding material in the mold, and hardening the molding material by applying heat, and e) hardening the molding material and then removing the mold to complete the semiconductor chip package. | 03-06-2014 |
20140106278 | DRY FILM RESIST SHEET AND METHOD OF MANUFACTURING THE SAME - There is provided a dry film resist sheet, including: a base film; a first dry film resist layer formed on the base film, the first dry film resist layer containing a binder polymer, a multi-functional monomer, and a photoinitiator; and a second dry film resist layer formed on the first dry film resist layer, the second dry film resist layer containing a binder polymer, a multi-functional monomer, a photoinitiator, and a thermal initiator. | 04-17-2014 |
20140111790 | PRETREATMENT METHOD AND APPARATUS - There is provided a method for performing a pretreatment on an unknown sample including: preparing a plurality of different types of first solutions; adding an unknown sample to the plurality of first solutions and determining whether or not the unknown sample is dissolved; selecting one among the plurality of first solutions in which the unknown sample is dissolved; preparing a plurality of second solution by differentiating concentrations of the selected solution; adding an unknown sample to the second solution and determining whether or not the unknown sample is dissolved; selecting a solution having the lowest concentration in which the unknown sample can be dissolved from among the second solutions; and dissolving the unknown sample by using the solution having the lowest concentration. | 04-24-2014 |
20140130347 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component. | 05-15-2014 |
20140131081 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate on which a connection pad is formed; a dam spaced apart from one side of the connection pad; and a protective layer formed to surround the dam. | 05-15-2014 |
20140131083 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a mounting substrate having a cavity formed therein; an electronic component inserted into the cavity; and a base substrate formed at least one of an upper part and a lower part of the electronic component, inserted into the cavity, and having an upper substrate pad and a lower substrate pad extended outwardly thereof and connected to each other. | 05-15-2014 |
20140138138 | PRINTED CIRCUIT BOARD HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN - Disclosed herein is a printed circuit board having an electronic component embedded therein, the printed circuit board including: the electronic component having an external electrode formed on one side surface or both side surfaces thereof; a base substrate having a cavity into which the electronic component is inserted; and at least one connection member inserted between the external electrode of the electronic component and an inner wall of the cavity to electrically connect the electronic component and the base substrate to each other. | 05-22-2014 |
20140140373 | APPARATUS AND METHOD OF TESTING SEMICONDUCTOR MODULE - There are provided an apparatus and a method of testing a semiconductor module capable of easily testing a power semiconductor module including a plurality of switching devices. The apparatus for testing a semiconductor module includes: a main substrate disposed within a case; a jig substrate detachably coupled to the main substrate; and a socket substrate detachably coupled to the jig substrate and having the semiconductor module mounted thereon. | 05-22-2014 |
20140147926 | METHOD OF ANALYZING ALDEHYDE COMPOUND IN METAL PLATING SOLUTION - This invention relates to a method of analyzing an aldehyde compound in a metal plating solution, including adding a pH control solution to an aldehyde derivative, thus preparing an oversaturated aldehyde derivative solution in which the aldehyde derivative is dissolved to be oversaturated while the pH of the aldehyde derivative solution is adjusted to be the same as that of the metal plating solution; adding the oversaturated aldehyde derivative solution to the metal plating solution, so that the aldehyde compound which is present in the metal plating solution undergoes derivation, thus obtaining an aldehyde derivative compound; extracting the aldehyde derivative compound; and analyzing the aldehyde compound from the extracted aldehyde derivative compound. | 05-29-2014 |
20140152980 | INSPECTION DEVICE FOR SUBSTRATE DEFORMATION AT HIGH TEMPERATURES AND INSPECTION METHOD FOR SUBSTRATE DEFORMATION AT HIGH TEMPERATURES USING THE SAME - There are provided an inspection device for substrate deformation at high temperatures and an inspection method for substrate deformation at high temperatures, the inspection device for substrate deformation at high temperatures, including a crucible including an internal space, an inspection hole disposed in an upper portion thereof so as to inspect the internal space, and a heating unit heating the internal space, an indenter tip disposed in the crucible such that a substrate fixed to the internal space is warped, and an inspection unit disposed above the crucible so as to inspect a cross-section of the substrate. | 06-05-2014 |
20140158507 | TOUCH PANEL - The touch panel according to a preferred embodiment of the present invention includes: a transparent substrate having one surface on which a first groove portion is formed and the other surface on which a second groove portion is formed; a first electrode formed on one surface of the transparent substrate so as to cross the first groove portion; and a second electrode formed on the other surface of the transparent substrate so as to cross the second groove portion. | 06-12-2014 |
20140170412 | INSULATING COMPOSITION, SUBSTRATE INCLUDING INSULATING LAYER USING THE SAME, AND METHOD FOR MANUFACTURING THE SUBSTRATE - An insulating composition including a graphene oxide and an insulating material including the same; and a polar solvent having a solvent polarity index (P) of greater than 5.5, a substrate including an insulating layer using the same, and a method for manufacturing the substrate. It is possible to provide an insulating composition including a specific solvent that can secure dispersibility of the graphene oxide while including the graphene oxide having excellent insulating and mechanical properties as an insulating material. Further, it is possible to provide a substrate including a fine insulating layer pattern as well as a bulk insulating layer pattern by using the insulating composition to overcome an aggregation problem in a conventional inkjet printing method. | 06-19-2014 |
20140174193 | METHOD, APPARATUS AND SAMPLE FOR EVALUATING BONDING STRENGTH - There are provided a method, an apparatus and a sample for evaluating bonding strength, the method including setting a micro-region including a bonded interface in an evaculated sample, forming a first groove in a circumferential portion of the micro-region to have a predetermined depth, processing a side of the micro-region to form a second groove connected to the bonded interface, and applying pressure on the micro-region to measure a critical point at which a delamination of the micro-region is generated. | 06-26-2014 |
20140176180 | APPARATUS FOR TESTING SWITCHING OF POWER SEMICONDUCTOR MODULE - Disclosed herein is an apparatus for testing switching of a power semiconductor module, including: a power semiconductor module including a plurality of power semiconductor devices corresponding to a plurality of phases to test a switching operation of a corresponding power semiconductor device; a power supply unit supplying power to the power semiconductor module; a relay switching unit including a plurality of relay switch devices that connects or disconnects between the power semiconductor module and the power supply unit according to a relay control signal; and a control unit controlling the relay switching unit to test on/off characteristics of at least one of the plurality of power semiconductor devices individually or simultaneously, By this configuration, the on/off operations of the plurality of power semiconductor devices are tested individually or simultaneously by the control of the plurality of relay switch devices, thereby improving the user convenience and reducing the test time. | 06-26-2014 |
20140176506 | TOUCH SENSOR - Disclosed herein is a touch sensor, including: a window; a transparent substrate having a first electrode part formed on one surface thereof; and a first adhesive layer allowing the window and one surface of the transparent substrate to adhere to each other, wherein a first protrusion part is formed on an edge of one surface of the transparent substrate. | 06-26-2014 |
20140176828 | TOUCH PANEL - Disclosed herein is a touch panel including a transparent substrate, a plurality of magnets positioned in both sides of the transparent substrate, ferromagnetic cores formed in one surface of the transparent substrate, and electrodes formed in one surface of the transparent substrate such that the electrodes are positioned in an outer side of the ferromagnetic cores, respectively. | 06-26-2014 |
20140178814 | DRY FILM PHOTORESIST HAVING OXYGEN PERMEABLE BARRIER LAYER AND MANUFACTURING METHOD THEREOF - There is provided a dry film photoresist including: a base film having an oxygen permeable barrier layer formed thereon; a photosensitive resin layer formed on the oxygen permeable barrier layer; and a protective film formed on the photosensitive resin layer. According to the present invention, the dry film photoresist includes the oxygen permeable barrier layer formed on the base film to prevent a curing reaction from being deteriorated by oxygen permeation in the dry film photoresist, such that residue that is not peeled off may be decreased, thereby significantly decreasing process defects. | 06-26-2014 |
20140184933 | TOUCH PANEL AND PRODUCING METHOD FOR VIA ELECTRODE - Disclosed herein a touch panel and a producing method for a via electrode. Touch sensitivity may be improved by forming a via hole in a cover glass and then filling a via electrode into the via hole to thereby narrow an interval between a touch point of a user and an electrode layer. | 07-03-2014 |
20140185244 | THERMALLY CONDUCTIVE FILM AND CIRCUIT BOARD MODULE - There is provided a circuit board module including a heat radiation member, a thermally conductive film that is disposed on the heat radiation member and includes a thermally conductive filler, a circuit board formed on the thermally conductive film, and a heat generation device disposed on the circuit board, wherein the thermally conductive filler is distributed in an area of the thermally conductive film corresponding to the heat generation device and another area that is extended from the area corresponding to the heat generation device by a predetermined distance on a plane. | 07-03-2014 |