Patent application number | Description | Published |
20090127501 | Polishing Composition for Silicon Wafer - The present invention relates to a polishing composition for silicon wafer comprising silica, a basic compound, a polyaminopolycarboxylic acid compound having hydroxy group, and water. The polishing composition can prevent metal contamination by nickel, chromium, iron, copper or the like, particularly copper contamination in polishing of silicon wafer. | 05-21-2009 |
20100029845 | REACTIVE MONOMER-DISPERSED SILICA SOL AND PRODUCTION METHOD THEREOF, AND CURABLE COMPOSITION AND CURED ARTICLE THEREOF - Colloidal silica particles dispersed in a reactive monomer may cause the polymerization, degradation, or the like of the reactive monomer by an action of the solid acidity of the surfaces of the particles and a monomer may be polymerized during a process for producing a monomer-dispersed silica sol, or a stable silica sol may not be obtained. In addition, a polymer of a resin formed article etc. obtained by curing a monomer-dispersed silica sol may be deteriorated, degraded, or the like with time. Therefore, there are provided a reactive monomer-dispersed silica sol having high stability by reducing the solid acidity of the surfaces of the colloidal silica particles contained in the reactive monomer-dispersed silica sol, and a production method thereof, and a curable composition using the reactive monomer-dispersed silica sol, and a cured article in which the deterioration, the degradation, or the like of the polymer is suppressed. The present invention provides a reactive monomer-dispersed silica sol containing a colloidal silica particle in which an alkaline earth metal ion is bonded to a surface of the colloidal silica particle. | 02-04-2010 |
20100137475 | EPOXY RESIN-FORMING LIQUID PREPARATION CONTAINING INORGANIC PARTICLE - There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): | 06-03-2010 |
20100311871 | COLLOIDAL SILICA PARTICLES, PROCESS FOR PRODUCING THE SAME, AND ORGANIC SOLVENT-DISPERSED SILICA SOL, POLYMERIZABLE COMPOUND-DISPERSED SILICA SOL, AND DICARBOXYLIC ANHYDRIDE-DISPERSED SILICA SOL EACH OBTAINED FROM THE SAME - There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm | 12-09-2010 |
20110135939 | CONDUCTIVE COATING COMPOSITION - Disclosed is a conductive coating composition containing an organic solvent dispersion of an intrinsically conductive polymer such as a doped polyaniline or a doped polythiophene, and a binder. The conductive coating composition is characterized in that the binder contains a polymerizable monomer-dispersed silica sol, which is obtained by dispersing a colloidal silica into a polymerizable organic compound monomer. The composition provides a conductive thin film having high transparency and excellent strength. | 06-09-2011 |
20110172331 | Reactive monomer-dispersed silica sol and production method thereof, and curable composition and cured article thereof - A reactive monomer-dispersed silica sol having high stability by reducing the solid acidity of the surfaces of the colloidal silica particles contained in the reactive monomer-dispersed silica sol, and a production method thereof, and a curable composition using the reactive monomer-dispersed silica sol, and a cured article in which the deterioration, the degradation, or the like of the polymer is suppressed. A reactive monomer-dispersed silica sol containing a colloidal silica particle in which an alkaline earth metal ion is bonded to a surface of the colloidal silica particle. | 07-14-2011 |
20110281974 | PROCESS FOR PRODUCING COMPOSITION OF POLYMERIZABLE ORGANIC COMPOUND CONTAINING SILICA PARTICLES - A process for producing a composition of a polymerizable organic compound containing silica particles characterized by comprising: (a) a process of preparing an amine-added organic solvent-dispersed silica sol, in which an amine compound is added to an organic solvent-dispersed silica sol that contains colloidal silica particles having an average primary particle size of 5 to 100 nm and that has a pH of 2.5 to 4.0 at 20° C. as measured in a diluted solution obtained by a method in which the same mass of the organic solvent-dispersed silica sol, methanol, and pure water are mixed together, so that the diluted solution obtained by the mixing method has a pH of 4.5 to 11.0 at 20° C.; and (b) a process of mixing the amine-added organic solvent-dispersed silica sol obtained in the process (a) with a polymerizable organic compound. | 11-17-2011 |
Patent application number | Description | Published |
20080232385 | COMMUNICATION SYSTEM, NODE DEVICE AND METHOD FOR SETTING CLASSES OF SERVICE - A communication system comprises a plurality of packet rings, each composed of a plurality of node devices, the node devices each transmitting and receiving a packet and being interconnected in a ring; two of the packet rings being interconnected via a pair of node devices each in each of the packet rings; the communication system further comprising: a table having recorded therein the correspondence between inter-ring service classes set between the packet rings and intra-ring service classes set in each packet ring; wherein the packet transferred in the packet ring includes information on the intra-ring service classes, as intra-ring header information, and information on the inter-ring service class, as inter-ring header information, the inter-ring service class(es) being correlated with the intra-ring service class(es), and being determined based on the table; the intra-ring header information being deleted when the packet is transferred from one of the packet rings to another. | 09-25-2008 |
20090116392 | Communication network, path setting method, network management system and node - A hierarchized path setting system in a communication network efficiently contains lower order paths in higher order path. The communication network has a plurality of nodes capable to perform switching process and demultiplexing process not only for lower order paths in a predetermined hierarchical level among hierarchized paths but also for higher order paths in a hierarchical level higher than the predetermined hierarchical level, and a plurality of links connecting these nodes. The system is responsive to a new path setting demand for setting the lower order path, for setting the lower order path in the higher order path when a single higher order path is set from a predetermined transmitter node group, in which a transmitter node of the lower order path belongs, to a predetermined receiver node group including a receiver node. | 05-07-2009 |