Sudesh
Sudesh Saroop, Beacon, NY US
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20110199817 | ROBUST LOCAL BIT SELECT CIRCUITRY TO OVERCOME TIMING MISMATCH - An integrated circuit can include an SRAM array having cells arranged in columns, each column being connected to true and complementary read local bitlines RLBLT and RLBLC. A local bit-select circuit can be connected to the cells of a column of the SRAM array, which can include first and second pull-down devices for pulling down a respective one of RLBLT and RLBLC at a timing controlled by a write control signal WRT. The circuit can include cross-coupled p-type field effect transistors (“PFETs”) including a first PFET having a gate connected to RLBLT and having a drain connected to RLBLC, and a second PFET of the pair having a gate connected to RLBLC and having a drain connected to RLBLT. A first device can control a strength of the cross-coupled PFETs. A pair of cross-coupled n-type field effect transistors (“NFETs”) can have gates connected to gates of the first and second pull-down devices. A second device can control a strength of the cross-coupled NFETs. The operation of the first and second devices can be controlled by applying first and second signals having programmed levels thereto. The levels of the first and second signals may selectively activate either the first device or the second device, so as to activate either the cross-coupled PFETs or the cross-coupled NFETs at one time. | 08-18-2011 |
Sudesh Saroop, Poughkeepsie, NY US
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20120323548 | METHOD, SYSTEM AND PROGRAM STORAGE DEVICE FOR SIMULATING ELECTRONIC DEVICE PERFORMANCE AS A FUNCTION OF PROCESS VARIATIONS - Disclosed are embodiments of a method, a system and a program storage device for simulating electronic device performance as a function of process variations. In these embodiments, functions of a primary model parameter for each of multiple secondary model parameters across multiple different process conditions can be determined based on a relatively small number of target sets of device characteristics. These functions can then be used to augment a simulator so that during subsequent simulations of the electronic device over a wide range of varying process conditions, a change in a value for the primary model parameter will automatically result in corresponding changes in values for the secondary model parameters. By augmenting the simulation environment in this manner, the disclosed embodiments efficiently provide more robust simulation results over prior art techniques. | 12-20-2012 |
20130069062 | LEAKAGE MEASUREMENT OF THROUGH SILICON VIAS - A leakage measurement structure for through substrate vias which includes a semiconductor substrate; a plurality of through substrate vias in the semiconductor substrate extending substantially through the semiconductor substrate; and a leakage measurement structure located in the semiconductor substrate. The leakage measurement structure includes a plurality of substrate contacts extending into the semiconductor substrate; a plurality of sensing circuits connected to the plurality of through substrate vias and to the plurality of the substrate contacts, the plurality of sensing circuits providing a plurality of outputs indicative of current leakage from the plurality of through substrate vias; a built-in self test (BIST) engine to step through testing of the plurality of through substrate vias; and a memory coupled to the BIST engine to receive the outputs from the plurality of sensing circuits. Also included is a method of testing a semiconductor substrate having a plurality of through substrate vias for current leakage. | 03-21-2013 |
20140065738 | LEAKAGE MEASUREMENT OF THROUGH SILICON VIAS - A method of testing a semiconductor substrate having through substrate vias for current leakage which includes: forming a current leakage measurement structure that includes substrate contacts, sensing circuits to sense current leakage from the through substrate vias, the sensing circuits connected to the through substrate vias and to the substrate contacts so that there is a one-to-one correspondence of a substrate contact and sensing circuit to each through substrate via, and a built-in self test (BIST) engine to sense one of the through substrate vias for current leakage. A reference current is applied to the sensing circuits to set a current leakage threshold for the through substrate vias. A through substrate via is selected for sensing for current leakage. The sensing circuit senses the selected through substrate via to determine whether there is current leakage from the selected through substrate via. | 03-06-2014 |
Sudesh Sivarasu, Cape Town ZA
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20150124942 | Anatomical Support Facilitating Medical Imaging of the Hip, Leg and Knee - An anatomical support is provided for facilitating the medical imaging of a patient's hip, leg or knee. The anatomical support has an operatively horizontal pelvis support panel to one edge of which is attached an edge of a thigh locating panel by a hinged attachment and that has attached to an opposite edge thereof by another hinged attachment, a calf or foot support panel. The pelvis support panel has anchorage attachments for a pelvis restraint, and the thigh locating panel has anchorage attachments for a thigh restraint. Locking means are provided for locking the calf or foot support panel in adjustable positions in which it is generally parallel to the pelvis support panel but horizontally displaced therefrom. At least appropriate areas of the calf or foot support panel, the thigh locating panel and the pelvis support panel are made of radiolucent material. | 05-07-2015 |
Sudesh Sundralingam, Milton CA
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20100108303 | HEAT EXCHANGER CONSTRUCTION - An improved heat exchanger is disclosed. The heat exchanger is of the type including a pair of headers and a plurality of tubes extending between and fluidly connecting the headers. The improvement comprises a tubular structure for and defining in part each of said headers. The tubular structure is defined by a pair of body elements and has opposed longitudinal joints defined by overlapping portions of the body elements. One of the body elements overlaps the other of the body elements to define one of the joints and is overlapped by the other of the body elements to define the other of the joints. | 05-06-2010 |
20150026982 | Heat Exchanger Construction - A method for constructing a heat exchanger having a pair of headers and a plurality of tubes extending between and fluidly connecting the headers is described. For each header, a pair of body elements is provided each formed of brazing clad material. A tubular assembly is formed of brazing clad material for each tube. The tubular assembly, for each tube, is fitted into apertures. The body elements and the tubular assemblies are brazed together to form the heat exchanger. | 01-29-2015 |