Patent application number | Description | Published |
20100078424 | TEMPERATURE CONTROLLED SUBSTRATE HOLDER WITH NON-UNIFORM INSULATION LAYER FOR A SUBSTRATE PROCESSING SYSTEM - A substrate holder for supporting a substrate in a processing system includes a temperature controlled support base having a first temperature, and a substrate support opposing the temperature controlled support base and configured to support the substrate. Also included is one or more heating elements coupled to the substrate support and configured to heat the substrate support to a second temperature above the first temperature, and a thermal insulator disposed between the temperature controlled support base and the substrate support. The thermal insulator includes a non-uniform spatial variation of the heat transfer coefficient (W/m | 04-01-2010 |
20100193471 | METHOD AND SYSTEM FOR CONTROLLING RADICAL DISTRIBUTION - A plasma processing system includes a processing chamber, a substrate holder configured to hold a substrate for plasma processing, and a gas injection assembly. The gas injection assembly includes a first evacuation port located substantially in a center of the gas injection assembly and configured to evacuate gases from a central region of the substrate, and a gas injection system configured to inject gases in the process chamber. The plasma processing system also includes a second evacuation port configured to evacuate gases from a peripheral region surrounding the central region of the substrate. | 08-05-2010 |
20110203523 | METHOD AND APPARATUS FOR ATOMIC LAYER DEPOSITION - A high pressure processing system including a chamber configured to house a substrate. A fluid introduction system includes at least one composition supply system configured to supply a first composition and a second composition, and at least one fluid supply system configured to supply a fluid. The fluid supply system is configured to alternately and discontinuously introduce the first composition and the second composition to the chamber within the fluid. | 08-25-2011 |
20120067866 | THERMALLY ZONED SUBSTRATE HOLDER ASSEMBLY - A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas- or vacuum-filled chamber). | 03-22-2012 |
Patent application number | Description | Published |
20100237046 | DRY NON-PLASMA TREATMENT SYSTEM AND METHOD OF USING - A dry non-plasma treatment system and method for removing oxide material is described. The treatment system is configured to provide chemical treatment of one or more substrates, wherein each substrate is exposed to a gaseous chemistry under controlled conditions including surface temperature and gas pressure. Furthermore, the treatment system is configured to provide thermal treatment of each substrate, wherein each substrate is thermally treated to remove the chemically treated surfaces on each substrate. | 09-23-2010 |
20110303145 | Apparatus for chemical vapor deposition control - A gas heating device and a processing system for use therein are described for depositing a thin film on a substrate using a vapor deposition process. The gas heating device includes a heating element array having a plurality of heating element zones configured to receive a flow of a film forming composition across or through said plurality of heating element zones in order to cause pyrolysis of one or more constituents of the film forming composition when heated. Additionally, the processing system may include a substrate holder configured to support a substrate. The substrate holder may include a backside gas supply system configured to supply a heat transfer gas to a backside of said substrate, wherein the backside gas supply system is configured to independently supply the heat transfer gas to multiple zones at the backside of the substrate. | 12-15-2011 |
20110305831 | Method for chemical vapor deposition control - A method of depositing a thin film on a substrate in a deposition system is described. The method includes disposing a gas heating device comprising a plurality of heating element zones in a deposition system, and independently controlling a temperature of each of the plurality of heating element zones, wherein each of the plurality of heating element zones having one or more resistive heating elements. Additionally, the method includes providing a substrate on a substrate holder in the deposition system, wherein the substrate holder has one or more temperature control zones. The method further includes providing a film forming composition to the gas heating device coupled to the deposition system, pyrolyzing one or more constituents of the film forming composition using the gas heating device, and introducing the film forming composition to the substrate in the deposition system to deposit a thin film on the substrate. | 12-15-2011 |
20120083127 | METHOD FOR FORMING A PATTERN AND A SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A method for forming a fine pattern on a substrate includes providing a substrate including a material with an initial pattern formed thereon and having a first line width, performing a self-limiting oxidation and/or nitridation process on a surface of the material and thereby forming an oxide, a nitride, or an oxynitride film on a surface of the initial pattern, and removing the oxide, nitride, or oxynitride film. The method further includes repeating the formation and removal of the oxide, nitride, or oxynitride film to form a second pattern having a second line width that is smaller than the first line width of the initial pattern. The patterned material can contain silicon, a silicon-containing material, a metal, or a metal-nitride, and the self-limiting oxidation process can include exposure to vapor phase ozone, atomic oxygen generated by non-ionizing electromagnetic (EM) radiation, atomic nitrogen generated by ionizing or non-ionizing EM radiation, or a combination thereof. | 04-05-2012 |
Patent application number | Description | Published |
20120130231 | MAGNETIC NAVIGATION ENABLED DELIVERY TOOLS AND METHODS OF MAKING AND USING SUCH TOOLS - Disclosed herein is a magnetic navigation enabled tool configured for the delivery of an implantable medical lead. The tool includes a tubular body, a sensor and a conductor. The tubular body includes a distal end, a proximal end, an inner layer including an outer circumferential surface, a lumen inward of the inner layer, and an outer layer over the outer circumferential surface of the inner layer. The sensor is on the tubular body near the distal end. The conductor extends from the sensor coil towards the proximal end imbedded in the inner layer. | 05-24-2012 |
20130021040 | CONNECTOR SLEEVE FOR A LEAD OF AN INTERNAL PULSE GENERATOR - Implementations of the present disclosure involve an internal pulse generator for administering electrotherapy via an implantable medical lead having a lead connector end on a proximal end of the lead. In addition, implementations involve testing of the medical lead at the proximal lead connector end to ensure proper placement of the lead, and an interface device for facilitating the connection of the proximal lead connector end to a testing device. The interface device may provide for one or more electrical connection points disposed on a connector sleeve. The connection points provide electrical communication between the lead connector end of the lead and one or more leads of a testing device in such a manner as to minimize potential damage to the lead connector end. | 01-24-2013 |
20140094889 | IMPLANTABLE THERAPY LEAD WITH CONDUCTOR CONFIGURATION ENHANCING ABRASION RESISTANCE - An implantable therapy lead employs electrical conductors configured to enhance the abrasion resistance of the lead. Specifically, conductors are configured to create a surface contact area with walls of a wall lumen of a tubular body that is greater than would otherwise be possible with traditional conductors that have a circular transverse cross-section. As a result, the abrasion pressure of the conductors against the lumen walls is decreased for the conductors disclosed herein as compared to that of traditional conductors. | 04-03-2014 |
20140094890 | IMPLANTABLE THERAPY LEAD WITH CONDUCTOR CONFIGURATION ENHANCING ABRASION RESISTANCE - An implantable therapy lead employs electrical conductors configured to enhance the abrasion resistance of the lead. Specifically, conductors are configured to create a surface contact area with walls of a wall lumen of a tubular body that is greater than would otherwise be possible with traditional conductors that have a circular transverse cross-section. As a result, the abrasion pressure of the conductors against the lumen walls is decreased for the conductors disclosed herein as compared to that of traditional conductors. | 04-03-2014 |
20150112414 | MEDICAL DEVICE LEAD ASSEMBLY HAVING INTEGRATED PRESSURE-RESISTING MEMBER - A medical device configured to be secured to an individual may include a housing containing one or more electrical components, and one or more leads electrically connected to the housing. Each lead may include an insulating jacket that surrounds a central core including one or more conductors, and at least one pressure-resisting member integrally formed with one or both of the insulating jacket or the central core. The pressure-resisting member is configured to resist one or more forces exerted into the central core. For example, the pressure-resisting member may include one or more of a suture-anchoring member or a lead-strengthening member. | 04-23-2015 |
Patent application number | Description | Published |
20110046542 | APPARATUS AND METHODS FOR CLOT DISSOLUTION - Clot disruption and dissolution are achieved using a catheter having the ability to infuse a thrombolytic agent, aspirate clot and fluid, and allow passage of a guidewire. Optionally, the catheter may also include a mechanical agitator for further disrupt clot in the presence of the thrombolytic agent. A flow resistor in the catheter provides for infusion and/or aspiration to be concentrated primarily at a clot treatment area in a blood vessel while also providing optional infusion and/or aspiration distal to the treatment area. In some embodiments, infusion, aspiration and guidewire passage occur through a common lumen. The thrombolytic agent, such as tPA, streptokinase, or urokinase, is directly released into the clot at the point where the agitator is engaging the clot. In this way, the thrombolytic activity of the agent is enhanced and the dissolution of the clot is improved. | 02-24-2011 |
20120283699 | APPARATUS AND METHODS FOR CLOT DISSOLUTION - Clot disruption and dissolution are achieved using a catheter having the ability to infuse a thrombolytic agent, aspirate clot and fluid, and allow passage of a guidewire. Optionally, the catheter may also include a mechanical agitator for further disrupt clot in the presence of the thrombolytic agent. A flow resistor in the catheter provides for infusion and/or aspiration to be concentrated primarily at a clot treatment area in a blood vessel while also providing optional infusion and/or aspiration distal to the treatment area. In some embodiments, infusion, aspiration and guidewire passage occur through a common lumen. The thrombolytic agent, such as tPA, streptokinase, or urokinase, is directly released into the clot at the point where the agitator is engaging the clot. In this way, the thrombolytic activity of the agent is enhanced and the dissolution of the clot is improved. | 11-08-2012 |
20140171911 | APPARATUS AND METHODS FOR CLOT DISSOLUTION - Clot disruption and dissolution are achieved using a catheter having the ability to infuse a thrombolytic agent, aspirate clot and fluid, and allow passage of a guidewire. Optionally, the catheter may also include a mechanical agitator for further disrupt clot in the presence of the thrombolytic agent. A flow resistor in the catheter provides for infusion and/or aspiration to be concentrated primarily at a clot treatment area in a blood vessel while also providing optional infusion and/or aspiration distal to the treatment area. In some embodiments, infusion, aspiration and guidewire passage occur through a common lumen. The thrombolytic agent, such as tPA, streptokinase, or urokinase, is directly released into the clot at the point where the agitator is engaging the clot. In this way, the thrombolytic activity of the agent is enhanced and the dissolution of the clot is improved. | 06-19-2014 |