Patent application number | Description | Published |
20130083489 | ELECTRONIC SYSTEM FOR REFLOW SOLDERING - An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering. | 04-04-2013 |
20130083490 | ELECTRONIC SYSTEM FOR WAVE SOLDERING - An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces. | 04-04-2013 |
20130154155 | MANUFACTURING OF DSC TYPE ELECTRONIC DEVICES BY MEANS OF SPACER INSERT - A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed. | 06-20-2013 |
20130173865 | REGISTER FILE ORGANIZATION TO SHARE PROCESS CONTEXT FOR HETEROGENEOUS MULTIPLE PROCESSORS OR JOINT PROCESSOR - A register file organization is used to support multiple accesses from more than one processor or pipeline. This shared register file is organized for a multiple processor device that includes a high performance (HP) and a low power (LP) core. The shared register file includes separate HP and LP storage units coupled to separate HP and LP write and read ports. | 07-04-2013 |
20130188793 | EMBEDDED SPEAKER PROTECTION FOR AUTOMOTIVE AUDIO POWER AMPLIFIER - A method of operating a speaker system including a speaker coupled to an amplifier, and a dedicated digital speaker protection circuit includes turning on the amplifier in a mute mode, after a first delay period, issuing a play command to the amplifier to place the amplifier in a play mode, but without an input signal during a second delay period, and performing a speaker offset detection during the second delay period, wherein, if there is an offset, then the amplifier is forced back into the mute mode, and if there is no offset, then the amplifier is allowed to continue to operate in the play mode. The method also includes issuing a speaker protection control signal or command if an offset is detected. | 07-25-2013 |
Patent application number | Description | Published |
20130207569 | METHOD OF CONTROLLING AN ELECTROLUMINESCENT DISPLAY AND RELATED CONTROL CIRCUIT - A control circuit is for generating upper and lower voltages that define a range of a data voltage for controlling a driving transistor of an electroluminescent component coupled to a supply line through the driving transistor. The control circuit may include a first input terminal configured to have a common voltage, and a pair of amplifiers coupled together at the first input terminal and configured to generate the upper voltage and the lower voltage to correspond to a difference between the common voltage and, respectively, first and second analog intermediate voltages representing respective threshold values of the upper voltage and of the lower voltage. The control circuit may include an auxiliary amplifier configured to adjust the upper voltage and the lower voltage based upon fluctuations of an input voltage, and generate the common voltage to correspond to the difference between the input voltage and a reference voltage. | 08-15-2013 |
20130207781 | SECURITY SYSTEM FOR AT LEAST AN INTEGRATED CIRCUIT, SECURE INTEGRATED CIRCUIT CARD, AND METHOD OF SECURE WIRELESS COMMUNICATIONS - A security system includes an integrated circuit and a transceiver/transponder circuit. The integrated circuit includes an antenna for communicating with the transceiver/transponder circuit. An inhibiting element is associated with the integrated circuit for inhibiting communications with the transceiver/transponder circuit and for securing the data contained in the integrated circuit. The inhibiting element is an electromagnetic inhibiting element. The security system further includes a coupling element associated with the antenna of the integrated circuit for temporarily deactivating the electromagnetic inhibiting element to allow communications between the integrated circuit and the transceiver/transponder circuit. | 08-15-2013 |
20130210218 | METHOD FOR TRANSFERRING A GRAPHENE LAYER - A method transfers a graphene layer from a donor substrate onto a final substrate. The method includes: providing a metal layer on the donor substrate; and growing a graphene layer on the metal layer. The method also includes: laminating a dry film photo-resist on the graphene layer; laminating a tape on the dry film photo-resist; chemically. etching the metal layer, obtaining an initial structure that includes the tape, the dry film photo-resist and the graphene layer; laminating the initial structure on the final substrate; thermally realizing the tape, so as to obtain an intermediate structure that includes the dry film photo-resist, the graphene layer and the final substrate; removing the dry film photo-resist; and obtaining a final structure that includes the final substrate with a transferred graphene layer. | 08-15-2013 |
20130211694 | METHOD AND SYSTEM FOR CONTROL OF AN INTERNALCOMBUSTION ENGINE BASED ON ENGINE CRANK ANGLE - A method for control of an internal combustion engine includes generating, with a microelectromechanical system (MEMS) accelerometer, an acceleration signal representing vibrations of the internal combustion engine. An engine crank angle signal is generated based on the acceleration signal. The engine crank angle signal is compared with a target value. The internal combustion engine is adjusted based upon the comparing. | 08-15-2013 |
20130214368 | SEMICONDUCTOR INTEGRATED DEVICE ASSEMBLY PROCESS - A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second body of semiconductor material integrating at least one microelectromechanical structure and having a bottom surface; and stacking the second body on the first body with the interposition, between the top surface of the first body and the bottom surface of the second body, of an elastic spacer material. Prior to the stacking step, the step is envisaged of providing, in an integrated manner, at the top surface of the first body a confinement and spacing structure that confines inside it the elastic spacer material and supports the second body at a distance from the first body during the stacking step. | 08-22-2013 |
20130215931 | INTEGRATED TRANSDUCER PROVIDED WITH A TEMPERATURE SENSOR AND METHOD FOR SENSING A TEMPERATURE OF THE TRANSDUCER - A pressure sensor includes a body made of semiconductor material having a first type of conductivity and a pressure-sensitive structure having the first type of conductivity defining a suspended membrane. One or more piezoresistive elements having a second type of conductivity (P) are formed in the suspended membrane. The piezoresistive elements form, with the pressure-sensitive structure, respective junction diodes. A temperature sensing method includes: generating a first current between conduction terminals common to the junction diodes; detecting a first voltage value between the common conduction terminals when the first current is supplied; and correlating the detected first voltage value to a value of temperature of the diodes. The temperature value thus calculated can be used for correcting the voltage signal generated at output by the pressure sensor when the latter is operated for sensing an applied outside pressure which deforms the suspended membrane. | 08-22-2013 |
20130215955 | APPARATUS AND METHOD FOR DETECTING COMMUNICATIONS FROM MULTIPLE SOURCES - A method, apparatus, and computer program for detecting sequences of digitally modulated symbols transmitted by multiple sources are provided. A real-domain representation that separately treats in-phase and quadrature components of a received vector, channel gains, and a transmitted vector transmitted by the multiple sources is determined. The real-domain representation is processed to obtain a triangular matrix. In addition, at least one of the following is performed: (i) hard decision detection of a transmitted sequence and demapping of corresponding bits based on a reduced complexity search of a number of transmit sequences, and (ii) generation of bit soft-output values based on the reduced complexity search of the number of transmit sequences. The reduced complexity search is based on the triangular matrix. | 08-22-2013 |
20130216135 | VISUAL SEARCH SYSTEM ARCHITECTURES BASED ON COMPRESSED OR COMPACT DESCRIPTORS - An embodiment of a visual search system includes at least one imaging device, each imaging device operable to capture a corresponding image, a feature extraction device coupled to each imaging device, each feature extraction device operable to generate feature descriptors from the image received from the corresponding imaging device. A descriptor encoding device is coupled to each feature extraction device and operable to generate compressed feature descriptors from the received feature descriptors. An application processor is coupled to each descriptor encoding device. The application processor is operable to process the received compressed feature descriptors to generate output information as a function of the processed compressed feature descriptors. | 08-22-2013 |
20130216143 | SYSTEMS, CIRCUITS, AND METHODS FOR EFFICIENT HIERARCHICAL OBJECT RECOGNITION BASED ON CLUSTERED INVARIANT FEATURES - One embodiment is a method for selecting and grouping key points extracted by applying a feature detector on a scene being analyzed. The method includes grouping the extracted key points into clusters that enforce a geometric relation between members of a cluster, scoring and sorting the clusters, identifying and discarding clusters that are comprised of points which represent the background noise of the image, and sub-sampling the remaining clusters to provide a smaller number of key points for the scene. | 08-22-2013 |
20130220016 | MICROELECTROMECHANICAL SENSOR WITH OUT-OF-PLANE SENSING AND PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL SENSOR - A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate. | 08-29-2013 |
20130221938 | VOLTAGE REGULATOR FOR CONTACT-LESS ELECTRONIC DEVICES - A voltage regulator has an input terminal for receiving a supply voltage and an output terminal for providing a regulated voltage and a regulated current. Furthermore, the voltage regulator includes a regulator for generating the regulated voltage and the regulated current according to a regulation of the supply voltage. The regulator includes a plurality of regulation branches arranged between the input terminal and the output terminal, each one for providing an output voltage used for obtaining the regulated voltage and for providing an output current contributing to define the regulated current. The regulation branches are partitioned into a plurality of subsets each one including components adapted to operate within a corresponding maximum voltage different from the maximum voltage of the other subsets. In addition, the regulator includes a selector for selectively enabling the regulation branches according to an indicator of the supply voltage. | 08-29-2013 |
20130221945 | METHOD AND DEVICE FOR MONITORING AT LEAST A CHARACTERISTIC OF A BLOCK MADE OF A BUILDING MATERIAL - A monitoring device includes an electric supply line to be buried in the block of building material, to convey signals and to be AC supplied so as to generate voltage and current stationary waveforms. The device also includes primary inductors coupled to the electric supply line at positions corresponding to peaks of at least one of the voltage and current stationary waveforms. The device also includes integrated monitoring circuits to be buried in the block of building material, with each integrated monitoring circuit including an integrated sensor to sense at least one physical characteristic, and a secondary inductor magnetically coupled to a respective primary inductor to supply the integrated sensor, and communicate through the electric supply line. | 08-29-2013 |
20130225944 | FLEXIBLE SENSOR ASSEMBLY - A sensor assembly includes: an electrically insulating and flexible body ( | 08-29-2013 |
20130272462 | METHOD AND APPARATUS FOR MULTIPLE ANTENNA COMMUNICATIONS, AND RELATED SYSTEMS AND COMPUTER PROGRAM - An embodiment of an arrangement detects sequences of digitally modulated symbols from multiple sources. The arrangement identifies a suitable set of candidate values for at least one transmitted sequence of symbols and determines for each candidate value a set of sequences of transmitted symbols. The arrangement estimates at least one further set of sequences of transmitted symbols, calculates a metric for each sequence of transmitted symbols, and selects the sequence that maximizes the metric. At the end, a-posteriori bit soft output information for the selected sequence is calculated from the metrics for said sequences. Generally, these calculations are based on the information coming from a channel-state-information matrix and a-priori information on the modulated symbols from a second module, such as a forward error-correction-code (ECC) decoder. | 10-17-2013 |
20130294032 | THROUGH-HOLE MOUNTING SYSTEM WITH HEAT SINKING ELEMENTS CLAMPED TO ONE ANOTHER AGAINST INSULATING BODY - An electronic system includes an electronic device of through-hole mounting type comprising an insulating body for embedding at least a chip on which electronic components are integrated, a plurality of conductive leads projecting from the insulating body for said mounting, and a dissipation plate exposed from the insulating body for transferring heat from said electronic component in operation towards the outside of the insulating body. The electronic system includes a heat sink in contact with said dissipation plate for dissipating said heat. The heat sink comprises a first dissipation element, a second dissipation element, and clamping means for clamping the first dissipation element and the second dissipation element together against the insulating body of said electronic device. | 11-07-2013 |
20130335121 | ELECTRONIC SWITCH FOR LOW-VOLTAGE AND HIGH SWITCHING SPEED APPLICATIONS - An electronic switch may include transfer transistor having a first conduction terminal for receiving an input signal, a second conduction terminal, and a control terminal. The transfer transistor may enable/disable a transfer of the input signal from the first conduction terminal to the second conduction terminal according to a control signal. The control signal may take a first value and a second value different from the first value, a difference between the first value and the second value defining, in absolute value, an operative value of the control signal. The electronic switch may further comprise a driving circuit for receiving the input signal and the control signal, and for providing a driving signal equal to the sum between the input signal and the operative value of the control signal to the control terminal of the transfer transistor. | 12-19-2013 |
20140292375 | ANALOG ACCUMULATOR - Accumulators that operate to fully or partially remove noise from a signal, including removing noise inserted into the signal by the accumulator itself. In some embodiments, an accumulator may be operated in a sampling phase and a transfer phase each time the accumulator samples an input signal. In some such embodiments, an op-amp of an accumulation circuit of the accumulator may be auto-zeroed during some or all of the sampling phases of an accumulation period. In some embodiments in which the op-amp is auto-zeroed during some or all of the sampling phases, the accumulation circuit may include a holding capacitor that, during an auto-zeroing process, holds a value output by the op-amp during a prior transfer phase. Including such a holding capacitor in an accumulator may reduce a voltage that the op-amp output rises following the auto-zero process, which may reduce a bandwidth and noise of the accumulation circuit. | 10-02-2014 |