Patent application number | Description | Published |
20090321863 | Method and apparatus providing an imager module with a permanent carrier - Method and apparatus providing a wafer level fabrication of imager modules in which a permanent carrier protects imager devices on an imager wafer and is used to support a lens wafer. | 12-31-2009 |
20090323195 | Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same - A method and apparatus providing a lens master device and use of the same to form a lens template and/or a lens structure. The method includes obtaining a plurality of individual lens masters, each of which has a shaped portion defining at least a portion of a lens structure to be formed. The lens masters are affixed onto a supporting structure to form a lens master device. | 12-31-2009 |
20090323206 | IMAGING MODULE WITH SYMMETRICAL LENS SYSTEM AND METHOD OF MANUFACTURE - An imaging module and method of fabrication. The method comprises forming a first lens wafer with a plurality of outer negative lenses and forming a second lens wafer with a plurality of inner negative lenses The method further comprises bonding the first lens wafer and second lens wafer to create a bonded stack; forming a plurality of inner positive lenses on the second lens wafer and bonding a spacer wafer to the second lens wafer; and forming a plurality of outer positive lenses on the first lens wafer. | 12-31-2009 |
20090325107 | Thermal embossing of resist reflowed lenses to make aspheric lens master wafer - Methods of forming a lens master wafer having aspheric lens shapes. In one embodiment, a substrate is coated with a polymer material. Isolated sections are formed in the polymer material. The isolated sections are reflowed. The reflowed sections are formed into aspheric lens shapes using a lens stamp. | 12-31-2009 |
20100002312 | Over-molded glass lenses and method of forming the same - Accurate lens substrates on a waferscale are obtained by forming a polymer material on a lens surface formed on a lens wafer. The substrate may also be thinned by the glass lens surface forming process at the portion of the lens. The polymer material may have the same or different optical properties (refractive index and dispersion) as the lens wafer. | 01-07-2010 |
20100123260 | STAMP WITH MASK PATTERN FOR DISCRETE LENS REPLICATION - A method and stamp for forming lenses on a wafer. The stamp includes a mask arranged on a substrate and aligned with a plurality of lens-shaped cavities. The lens-shaped cavities are used to imprint a plurality of lenses into a curable material. The lenses are cured through the mask using radiation. The lenses are separated from the stamp and the uncured material is removed. | 05-20-2010 |
20110157455 | LENS MASTER DEVICES, LENS STRUCTURES, IMAGING DEVICES, AND METHODS AND APPARATUSES OF MAKING THE SAME - A method and apparatus providing a lens master device and use of the same to form a lens template and/or a lens structure. The method includes obtaining a plurality of individual lens masters, each of which has a shaped portion defining at least a portion of a lens structure to be formed. The lens masters are affixed onto a supporting structure to form a lens master device. | 06-30-2011 |
20110204462 | METHOD AND APPARATUS PROVIDING AN IMAGER MODULE WITH A PERMANENT CARRIER - Method and apparatus providing a wafer level fabrication of imager modules in which a permanent carrier protects imager devices on an imager wafer and is used to support a lens wafer. | 08-25-2011 |
20140191303 | SEMICONDUCTOR DEVICES INCLUDING BACK-SIDE INTEGRATED CIRCUITRY - Semiconductor devices may include a semiconductor substrate comprising at least one of transistors and capacitors may be located at an active surface of the semiconductor substrate. An imperforate dielectric material may be located on the active surface, the imperforate dielectric material covering the at least one of transistors and the capacitors. Electrically conductive material in contact openings may be electrically connected to the at least one of transistors and capacitors and extend to a back side surface of the semiconductor substrate. Laterally extending conductive elements may extend over the back side surface of the semiconductor substrate and may be electrically connected to the conductive material in the contact openings. At least one laterally extending conductive element may be electrically connected to a first transistor or capacitor and may extend laterally underneath a second, different transistor or capacitor to which the laterally extending conductive element is not electrically connected. | 07-10-2014 |