Patent application number | Description | Published |
20100043212 | PRINTED CIRCUIT BOARD BONDING DEVICE - The present invention relates to a bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The bonding device includes a support structure assembly and a first heater assembly arranged on the support structure assembly to be movable along a first path and configured to bond the flexible PCB to the printhead. A bending mechanism is arranged on the support structure and is configured to bend the bonded PCB. A second heater assembly is arranged on the support structure assembly to be movable along a second path and is configured to bond the bent PCB to the printhead carrier. A control system controls operation of the heater assemblies and the bending mechanism. | 02-25-2010 |
20100043217 | FASTENING APPARATUS WITH AUTHENTICATION SYSTEM - The present invention relates to a fastening apparatus for fastening a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The fastening apparatus includes a support assembly. An authentication system is arranged on the support assembly and is confinctionfigured to authenticate the printhead assembly. At least one bonding assembly is configured to bond the PCB to the printhead assembly. A controller is configured to control the bonding assembly to bond the PCB to the printhead assembly subsequent to the authentication of the printhead assembly. | 02-25-2010 |
20100043218 | ASSEMBLER FOR ASSEMBLING A CARRIER FOR PRINTHEAD INTEGRATED CIRCUITS - Provided is an assembler for assembling a carrier for supporting printhead integrated circuits. The carrier has upper and lower parts that are operatively fastened together. The assembler includes a support structure configured to support the lower part in a pre-fastened position, and a holding mechanism arranged on the support structure for holding the upper part in a pre-fastened position. The assembler also includes a displacement mechanism arranged on the support structure for displacing the holding mechanisms to bring the parts into operative registration with each other, and a fastening apparatus for fastening the parts together. | 02-25-2010 |
20100043220 | METHOD FOR CONNECTING A FLEXIBLE PRINTED CIRCUIT BOARD (PCB) TO A PRINTHEAD ASSEMBLY - The present invention relates to a method for connecting a flexible printed circuit board (PCB) to a printhead assembly. The printhead assembly includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the step of connecting the flexible PCB to the printhead using a first heater assembly movable along a first path. In turn, the connected PCB is then bent. The method further includes the step of connecting the bent PCB to the printhead carrier using a second heater assembly movable along a second path. | 02-25-2010 |
20100043533 | PNEUMATIC ASSEMBLY FOR A PRESSURE DECAY TESTER - A pneumatic assembly for a pressure decay tester of printhead integrated circuits includes a pressurized air supply. A pneumatic clamping arrangement is in fluid communication with the pressurized air supply for clamping a carrier for the printhead integrated circuits such that the carrier is in fluid communication with the printhead integrated circuits. A valve arrangement applies a predetermined pressure to the carrier. A sensing arrangement senses a static pressure in the carrier. A control system is in communication with the clamping, valve and sensing arrangements to control operation thereof and to generate a discernible signal representing said static pressure such that a decay in said static pressure can be determined. | 02-25-2010 |
20100043534 | PRESSURE-BASED TESTER FOR A PLATFORM ASSEMBLY - The invention provides for a pressure-based tester for testing integrity of a platform assembly. The platform assembly includes a pair of assembled platform components fastened together and a fluid path extending into both components, the platform assembly suitable for supporting printhead integrated circuits to be tested. The tester includes a housing assembly, a regulated gas supply arranged in the housing assembly, and a retaining mechanism in fluid communication with the gas supply and configured to retain the platform assembly in fluid communication with the gas supply during testing of the platform assembly. The tester also includes a pressure measuring apparatus operatively connected to the gas supply and configured to generate a signal corresponding to a pressure value applied to the retaining mechanism, and a control system configured to control operation of the regulated gas supply, the retaining mechanism and configured to receive the signal from the pressure measuring apparatus and to detect decay in the pressure value. | 02-25-2010 |
20100043535 | LEAK TESTER FOR A CARRIER FOR PRINTHEAD INTEGRATED CIRCUITRY - Provided is a leak tester for a carrier for printhead integrated circuits. The carrier has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The tester includes a support assembly that includes at least one receptacle shaped and configured to receive at least one respective carrier, and a pressurized fluid supply arranged on the support assembly and configured to supply pressurized fluid to the fluid inlets, the pressurized fluid supply incorporating a sealing mechanism configured to engage the fluid inlets in a sealing manner. The tester also includes a pressure measurement arrangement operatively arranged with respect to the pressurized fluid supply to measure pressure applied at the fluid inlets, and a controller operatively connected to the pressure measurement arrangement and pressurized fluid supply, the controller being configured to control the fluid supply to charge the carrier with pressurized fluid until a predetermined pressure is reached, and to monitor the pressure for a predetermined period of time. | 02-25-2010 |
20100043536 | CRADLE ASSEMBLY FOR A PRESSURE DECAY LEAK TESTER - A cradle assembly for a pressure decay leak tester is provided. The assembly operatively receives a printhead integrated circuit carrier having a plurality of printing fluid paths defined therein, respective fluid inlets in fluid communication with respective fluid paths and a locating formation to facilitate correct location of the carrier on the tester. The assembly includes at least one complementary locating formation for engaging the locating formation of the carrier, and at least one fluid outlet for charging the carrier with fluid via a respective fluid inlet of the carrier. Also included is a clamping device for clamping the carrier to the fluid outlet, so that the integrity of the fluid paths is observable via pressure decay testing, and a control system operatively connected to the clamping device for controlling operation of the clamping device. | 02-25-2010 |
20100043978 | ADHESIVE APPLICATION APPARATUS FOR USE WITH AN ASSEMBLING MACHINE - The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms. | 02-25-2010 |
20100044527 | CARRIAGE ASSEMBLY FOR AN ASSEMBLING APPARATUS - A carriage assembly for use with an assembling apparatus is provided. The assembling apparatus is used to assemble operatively upper and lower portions of an integrated circuit carrier with co-operative upper and lower clamping members. The carriage assembly includes a linear carriageway in a working zone of the assembling apparatus and spaced from a support surface of the apparatus. Also included is a first holding mechanism movable along the linear carriageway and configured to hold the upper carrier portion and to displace said upper portion substantially orthogonally with respect to said linear carriageway towards and away from a support surface of the assembling apparatus, and a second holding mechanism movable along the linear carriage and configured to hold the upper clamping member and to displace the upper clamping member towards and away from the support surface. The carriage assembly also features a linear actuator configured to displace the holding mechanisms along the carriageway, and a control system to control operation of the holding mechanisms and the linear actuator. | 02-25-2010 |
20100045730 | METHOD FOR TESTING INTEGRITY OF A BASE FOR PRINTHEAD INTEGRATED CIRCUITRY - Provided is a method for testing integrity of a base for printhead integrated circuits. The base has at least one fluid inlet in fluid communication with a plurality of fluid outlets via discrete fluid paths. The method includes the steps of engaging the, or each, fluid inlet of the base to a fluid supply in a sealing manner, charging the base with pressurized fluid until a predetermined pressure is reached, and monitoring the pressure in the base for a predetermined period of time, wherein a rate of pressure decay is indicative of an integrity of the base. | 02-25-2010 |
20100045741 | METHOD FOR ASSEMBLING A CARRIER FOR INTEGRATED CIRCUITS - The invention relates to a method for assembling a carrier for integrated circuits. The carrier has upper and lower parts. The method includes the steps of positioning the lower part in a bottom clamp portion retained in a bottom clamp receptacle, positioning a top clamp portion in a top clamp receptacle, the clamp portions being configured to engage each other in a locking manner, and positioning the upper part in a first gripper. The method also features the steps of applying adhesive to at least one of the parts, pressing said upper part onto the bottom part retained by the bottom clamp receptacle with the first gripper, whilst retrieving the top clamp portion with a second gripper, and locking the top clamp portion to the bottom clamp portion with the second gripper to clamp the parts together. | 02-25-2010 |
20110232371 | PRESSURE TESTER FOR PRINTHEAD INTEGRATED CIRCUIT CARRIER - A pressure-based tester for testing an integrity of a printhead integrated circuit (IC) carrier includes a housing assembly; a cradle assembly coupled to the housing assembly and adapted to receive the printhead IC carrier, the cradle assembly further defining spouts adapted to engage with the printhead IC carrier; a regulated gas supply arranged in the housing assembly; a first gas supply line in fluid communication with the regulated gas supply; a pneumatic retaining mechanism in fluid communication with the gas supply via the first gas supply line, the pneumatic retaining mechanism for retaining the carrier in fluid communication with the spouts during testing of the platform assembly; a second gas supply line in fluid communication with the regulated gas supply, the second gas supply line being separated from the first gas supply line by a pressure regulator, the second gas supply line for supplying gas to the spouts; a pressure sensor for measuring a gas pressure at each spout and generating a signal indicative of the measured gas pressure; and a control system for controlling the regulated gas supply and the pneumatic retaining mechanism. The control system is further configured to receive the signal generated by the pressure sensor to determine the presence of any decay in the gas pressure at each spout. | 09-29-2011 |
20120006494 | PRINTED CIRCUIT BOARD BONDING DEVICE - A bonding device for bonding a flexible printed circuit board (PCB) to a printhead assembly includes an enclosed work area; a first heater assembly provided within the enclosed work area and movable along a first path; a bending mechanism provided within the enclosed work area and adapted to bend the bonded PCB; a second heater assembly provided within the enclosed work area and movable along a second path; a nest structure for receiving the printhead assembly, the nest structure movable along a third path; and a control system to control operation of the heater assemblies, bending mechanism, and nest structure. The first path and the second path are constrained to an area within the enclosed work area, and the third path crosses a boundary of the enclosed work area. | 01-12-2012 |