Patent application number | Description | Published |
20090250795 | LEADFRAME FOR PACKAGED ELECTRONIC DEVICE WITH ENHANCED MOLD LOCKING CAPABILITY - A packaged electronic device ( | 10-08-2009 |
20100044811 | INTEGRATED CIRCUIT ENCAPSULATION AND METHOD THEREFOR | 02-25-2010 |
20100199777 | Exposed Pad Backside Pressure Sensor Package - A method and apparatus are described for fabricating an exposed backside pressure sensor ( | 08-12-2010 |
20110201288 | DEVICE INCLUDING AN ANTENNA AND METHOD OF USING AN ANTENNA - An integrated package is disclosed that includes a conductive structure that can be selectively configured to include a radiating element of a planar antenna or to include a radio-frequency shielding structure. Examples of a planar antenna include PIFA antennas, patch antennas, and the like. The planar antenna can be selectively configured to different tuning profiles, and operate as a diversity antenna by alternating its tuning profile configuration amongst different tuning profiles. | 08-18-2011 |
20120266684 | SENSOR DEVICE WITH SEALING STRUCTURE - Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure. | 10-25-2012 |
20120270354 | METHODS FOR FABRICATING SENSOR DEVICE PACKAGE USING A SEALING STRUCTURE - Fabrication methods are provided for a sensor device packages. An exemplary fabrication method involves bonding a sensor structure and another structure using a sealing structure. The sealing structure surrounds a diaphragm region of the sensor structure and provides an airtight seal between the sensor structure and the other structure to establish a fixed reference pressure on one side of the diaphragm region. | 10-25-2012 |
20120304452 | METHOD OF MAKING A DUAL PORT PRESSURE SENSOR - A method of forming a dual port pressure sensor includes forming a first opening and a second opening in a flag of a lead frame. An encapsulant is molded to hold the lead frame in which the encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag and a second opening in the encapsulant aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag to cover the first opening in the flag, wherein the pressure sensor transducer provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag. The integrated circuit is electrically coupled to the pressure sensor. A lid is attached to the encapsulant to form an enclosure around the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure. | 12-06-2012 |
20120304777 | DUAL PORT PRESSURE SENSOR - A dual port pressure sensor has a lead frame having a flag having a first opening and a second opening. The lead frame has a flag having a first opening and a second opening. An encapsulant holds the lead frame. The encapsulant is over a top of the flag and a bottom of the flag is uncovered by the encapsulant. A first opening in the encapsulant is aligned with and larger than the first opening in the flag, and a second opening in the encapsulant is aligned with the second opening in the flag. A pressure sensor transducer is attached to the bottom of the flag and covers the first opening in the flag and provides an electrically detectable correlation to a pressure differential based on a first pressure received on its top side and a second pressure received on its bottom side. An integrated circuit is attached to the bottom of the flag and is electrically coupled to the pressure sensor. A lid forming an enclosure with the bottom of the flag. The pressure sensor transducer receives the first pressure through the first opening in the encapsulant and the first opening in the flag and the second pressure through the second opening in the encapsulant, the second opening in the flag, and the enclosure. | 12-06-2012 |
20130207207 | METHOD AND APPARATUS FOR HIGH PRESSURE SENSOR DEVICE - A pressure sensor package is provided that reduces the occurrence of micro gaps between molding material and metal contacts that can store high-pressure air. The present invention provides this capability by reducing or eliminating interfaces between package molding material and metal contacts. In one embodiment, a control die is electrically coupled to a lead frame and then encapsulated in molding material, using a technique that forms a cavity over a portion of the control die. The cavity exposes contacts on the free surface of the control die that can be electrically coupled to a pressure sensor device using, for example, wire bonding techniques. In another embodiment, a region of a substrate can be encapsulated in molding material, using a technique that forms a cavity over a sub-portion of the substrate that includes contacts. A pressure sensor device can be electrically coupled to the exposed contacts. | 08-15-2013 |
20130264692 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME - An integrated circuit package includes an electronic sensor protected by a lid structure. The electronic sensor includes a transducer placed on a backside surface of a lead frame assembly. The lid structure is placed over the transducer and is attached to the lead frame assembly on the backside surface. The lid can define an air cavity around the transducer, such that mold compound, gel, or other protective chemical material is not placed in contact with the transducer. The transducer is therefore protected without a chemical protectant, lowering the cost of the integrated circuit package and maintaining the sensitivity and performance of the transducer. | 10-10-2013 |
20130297248 | TESTER AND METHOD FOR TESTING A STRIP OF DEVICES - A tester configured to test a strip of devices is provided. The tester may include a communications system, a plurality of communication lines, a plurality of multiplexors, each multiplexor having at least two outputs, wherein each multiplexor is configured to receive a signal generated by the communications system via one of the plurality of communication lines, and each multiplexor may be selectably coupled to at least two of the devices in the strip of devices. The tester may be configured to index the plurality of communication lines to a first subset of the devices, initiate at least one test, command the devices to generate data for each of the at least one tests, retrieve data from a first set of the devices, and retrieve data from a second set of the devices. | 11-07-2013 |
20130313700 | CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME | 11-28-2013 |
20140001616 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE | 01-02-2014 |
20140015123 | SENSOR PACKAGE AND METHOD OF FORMING SAME | 01-16-2014 |
20140061883 | LEADFRAMES, AIR-CAVITY PACKAGES, AND ELECTRONIC DEVICES WITH OFFSET VENT HOLES, AND METHODS OF THEIR MANUFACTURE - A leadframe (e.g., incorporated in a device package) includes a feature (e.g., a die pad or lead) with a vent hole formed between first and second opposed surfaces. The cross-sectional area of the vent hole varies substantially between the surfaces (e.g., the vent hole has a constricted portion). The vent hole may be formed from a first opening extending from the first surface toward the second surface to a first depth that is less than a thickness of the leadframe feature, and a second opening extending from the second surface toward the first surface to a second depth that is less than the thickness of the leadframe feature, but that is large enough for the second opening to intersect the first opening. Vertical central axes of the openings are horizontally offset from each other, and the constricted portion of the vent hole corresponds to the intersection of the openings. | 03-06-2014 |
20140061948 | SENSOR PACKAGING METHOD AND SENSOR PACKAGES | 03-06-2014 |
20140124958 | SENSOR PACKAGING METHOD AND SENSOR PACKAGES | 05-08-2014 |
20140146509 | ELECTRONIC DEVICES WITH CAVITY-TYPE, PERMEABLE MATERIAL FILLED PACKAGES, AND METHODS OF THEIR MANUFACTURE - Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor circuit), a first material, and a second material. The package housing includes a cavity that is partially defined by a cavity bottom surface, and the cavity bottom surface includes a mounting area and a non-mounting area. The at least one electronic circuit is attached to the cavity bottom surface over the mounting area. The first material has a relatively high, first modulus of elasticity, and covers the non-mounting area. The second material has a relatively low, second modulus of elasticity, and is disposed over the first material within the cavity. | 05-29-2014 |
20140338956 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE - A structure and method to improve saw singulation quality and wettability of integrated circuit packages ( | 11-20-2014 |
20150048462 | SENSOR PACKAGE AND METHOD OF FORMING SAME | 02-19-2015 |
20150061044 | SEQUENTIAL WAFER BONDING - Embodiments of methods of fabricating a sensor device includes attaching a first wafer to a sensor wafer with a first bond material, and attaching a second wafer to the sensor wafer with a second bond material, the second bond material having a lower bonding temperature than the first bond material. After attaching the second wafer, an opening (e.g., a trench cut) through the second wafer is formed, and an adhesive material is provided through the opening to further secure the second wafer to the sensor wafer. Embodiments of sensor devices formed using such methods include a first device cavity having a first pressure, and a second device cavity having a second pressure. | 03-05-2015 |
20150061106 | CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME | 03-05-2015 |