Patent application number | Description | Published |
20090189016 | SYSTEMS AND METHODS FOR RECOVERING AND CONTROLLING POST-RECOVERY MOTION OF UNMANNED AIRCRAFT - Systems and methods for recovering unmanned aircraft and controlling post-recovery motion of the aircraft are disclosed herein. An aircraft recovery system for recovering an unmanned aircraft in flight in accordance with one embodiment of the disclosure, for example, can include an inflatable aircraft recovery system having an inflatable portion with a generally vertical orientation. The inflatable portion can also include a landing pocket extending at least partially therethrough. The landing pocket is sized to receive at least a portion of a fuselage of the aircraft. The aircraft recovery system can also include a guidance system at least proximate to the landing pocket and positioned to guide the aircraft toward the landing pocket. | 07-30-2009 |
20090216394 | TURRET ASSEMBLIES FOR SMALL AERIAL PLATFORMS, INCLUDING UNMANNED AIRCRAFT, AND ASSOCIATED METHODS - Turret assemblies for small aerial platforms, including unmanned aircraft, and associated methods are disclosed herein. In one embodiment, an aircraft system can include a turret assembly having a payload with a line of sight to a target and a gimbal system carrying the payload. The gimbal system can include (a) a first support coupled to a first actuator to rotate about a first axis, and (b) a second support carried by the first support and coupled to a second actuator to rotate about a second axis generally transverse to the first axis. The payload can be carried by the second support. A housing at least partially surrounds the payload and the gimbal system. The turret assembly can also include a controller configured to direct movement of at least one of the first actuator and the second actuator such that the line of sight is pointed away from a point of impact before the turret assembly contacts the ground or another external structure during landing or capture operations. | 08-27-2009 |
20130037650 | Systems and Methods for Long Endurance Airship Operations - In one example, a long endurance airship system includes a payload airship and a first logistics airship mechanically joined to the payload airship to form a first combined airship, the payload airship and the logistics airship having design capabilities differing by at least a factor of two with regard to at least one of: power generation capability, propulsion capability, endurance capability, and lift capability, in which the first combined airship is free flying, lighter-than-air, and configured to maintain aloft for greater than 30 days without physical connection to the ground. Illustrative methods for long endurance airship operations are also provided. | 02-14-2013 |
20130126675 | DURABLE AIRSHIP HULL AND IN SITU AIRSHIP HULL REPAIR - A system for airship hull reinforcement and in-situ repair includes a sensor for detecting a leak in the airship hull of a lighter-than-air airship and a repair mechanism inside lighter-than-air airship for dispensing repair material to seal the leak. A durable airship hull includes an inner gas barrier, an outer gas barrier, and a microlattice layer sandwiched between the inner gas barrier and the outer gas barrier. | 05-23-2013 |
20140097289 | ADDITIONAL SYSTEMS AND METHODS FOR LONG ENDURANCE AIRSHIP OPERATIONS USING A FREE-FLYING TETHERED AIRSHIP SYSTEM - In one example, a free-flying tethered airship system includes an upper airship adapted to tailor its lift and drag, a lower airship adapted to tailor its lift and drag, and a tether connecting the upper airship to the lower airship such that the upper airship is at least one kilometer above the lower airship. The upper airship is configured to be equiliberally buoyant, while carrying the tether, in a first altitude range. The lower airship is configured to be equiliberally buoyant in a second altitude range, the first altitude range being higher than the second altitude range. A method for stationkeeping of a free-flying tethered airship system is also provided. | 04-10-2014 |
20140156996 | Promoting Learned Discourse In Online Media - In one example, a method for promoting learned discourse in online forums includes posting forum content on a forum server and providing access to users to the content through an I/O module. The method further includes receiving a comment from a user and analyzing the comment from the user to produce an a priori score for the comment. A portable certificate of status is accepted from the user and used to produce a posteriori score for the comment. A system for promoting learned discourse in online forms is also disclosed. | 06-05-2014 |
20150021427 | AIRSHIP LAUNCH FROM A CARGO AIRSHIP - A method for launch of an airship includes connecting a cargo airship to a second airship that is not positively buoyant at the launch site, launching the cargo airship, transferring lifting gas from the cargo airship to the second airship where said lifting gas is carried by the cargo airship while aloft; and releasing the second airship from the cargo airship. A high-altitude airship launch system is also provided. | 01-22-2015 |
20160083067 | DURABLE AIRSHIP HULL AND IN SITU AIRSHIP HULL REPAIR - A system for airship hull reinforcement and in-situ repair includes a sensor for detecting a leak in the airship hull of a lighter-than-air airship and a repair mechanism inside lighter-than-air airship for dispensing repair material to seal the leak. A durable airship hull includes an inner gas barrier, an outer gas barrier, and a microlattice layer sandwiched between the inner gas barrier and the outer gas barrier. | 03-24-2016 |
Patent application number | Description | Published |
20110085572 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER - A tunable laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable laser also includes a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The tunable laser further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 04-14-2011 |
20110085577 | METHOD AND SYSTEM OF HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION - A hybrid integrated optical device includes a substrate comprising a silicon layer and a compound semiconductor device bonded to the silicon layer. The device also includes a bonding region disposed between the silicon layer and the compound semiconductor device. The bonding region includes a metal-semiconductor bond at a first portion of the bonding region. The metal-semiconductor bond includes a first pad bonded to the silicon layer, a bonding metal bonded to the first pad, and a second pad bonded to the bonding metal and the compound semiconductor device. The bonding region also includes an interface assisted bond at a second portion of the bonding region. The interface assisted bond includes an interface layer positioned between the silicon layer and the compound semiconductor device, wherein the interface assisted bond provides an ohmic contact between the silicon layer and the compound semiconductor device. | 04-14-2011 |
20110267676 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF AN OPTO-ELECTRONIC INTEGRATED CIRCUIT - An opto-electronic integrated circuit (OEIC) includes an SOI substrate, a set of composite optical transmitters, a set of composite optical receivers, and control electronics disposed in the substrate and electrically coupled to the set of composite optical transmitters and receivers. Each of the composite optical transmitters includes a gain medium including a compound semiconductor material and an optical modulator. Each of the composite optical receivers includes a waveguide disposed in the SOI substrate, an optical detector bonded to the SOI substrate, and a bonding region disposed between the SOI substrate and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region and a direct semiconductor-semiconductor bond at a second portion of the bonding region. The OEIC also includes control electronics disposed in the SOI substrate and electrically coupled to the set of composite optical transmitters and the set of composite optical receivers. | 11-03-2011 |
20120057079 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER FOR A CABLE TV TRANSMITTER - A cable television transmitter includes a substrate including a silicon material, control electronics disposed in the substrate, and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The cable television transmitter also includes an optical modulator optically coupled to the gain medium and electrically coupled to the control electronics, a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The cable television transmitter further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 03-08-2012 |
20120057609 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER AND A MACH ZEHNDER MODULATOR - A tunable pulsed laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable pulsed laser also includes a waveguide disposed in the substrate and optically coupled to the gain medium, an optical modulator optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The tunable pulsed laser further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 03-08-2012 |
20120057610 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER AND A PHASE MODULATOR - A tunable laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable laser also includes an optical modulator optically coupled to the gain medium, a phase modulator optically coupled to the optical modulator, and a waveguide disposed in the substrate and optically coupled to the gain medium. The tunable laser further includes a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate, an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide, and an output mirror. | 03-08-2012 |
20120057816 | METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING OF WAVEGUIDE RECEIVERS - A composite integrated optical device includes a substrate including a silicon layer and a waveguide disposed in the silicon layer. The composite integrated optical device also includes an optical detector bonded to the silicon layer and a bonding region disposed between the silicon layer and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region. The metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector. The bonding region also includes a direct semiconductor-semiconductor bond at a second portion of the bonding region. | 03-08-2012 |
20120149148 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING - A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the SOI substrate and the assembly substrate, joining the SOI substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure. | 06-14-2012 |
20120264256 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING - A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure. | 10-18-2012 |
20130142474 | SYSTEMS AND METHODS FOR PHOTONIC POLARIZATION BEAM SPLITTERS - An integrated photonic polarization beam splitter includes an optical coupler having an input port, a first output port, and a second output port. The optical coupler is operable to couple a portion of an input light beam at the input port into the first output port and another portion of the input light beam into the second output port. The integrated photonic polarization beam splitter also includes a first waveguide having a first linear polarizer embedded therein and coupled to the first output port of the optical coupler and a second waveguide having a second linear polarizer embedded therein and coupled to the second output port of the optical coupler. | 06-06-2013 |
20130142475 | SYSTEMS AND METHODS FOR PHOTONIC POLARIZATION ROTATORS - A waveguide polarization rotator includes a substrate having a surface and a waveguide coupled to the surface of the substrate and operable to support a light beam along a direction of beam propagation. The waveguide includes a slab having a support surface and a second surface opposing the support surface and a rib protruding from the second surface of the slab in a direction substantially normal to the surface of the substrate and extending along the direction of beam propagation. The rib includes a first portion extending to a first height above the second surface of the slab and a second portion adjacent to the first portion and extending to a second height above the second surface of the slab. The second height is less than the first height. | 06-06-2013 |
20130142476 | SYSTEMS AND METHODS FOR PHOTONIC POLARIZATION-SEPARATING APPARATUSES FOR OPTICAL NETWORK APPLICATIONS - An integrated photonic polarization-separating apparatus includes a first waveguide polarization beam splitter (PBS) having a first port, a second port, a third port, and a fourth port and a first polarization rotator optically coupled to the first port of the first waveguide PBS. The apparatus also includes a first Faraday rotator optically coupled to the first polarization rotator and a second polarization rotator optically coupled to the second port of the first waveguide PBS. The apparatus further includes a second Faraday rotator optically coupled to the second polarization rotator and a second waveguide PBS having a first port, a second port, a third port, and a fourth port. The third port is optically coupled to the first Faraday rotator and the fourth port is optically coupled to the second Faraday rotator. | 06-06-2013 |
20130210214 | VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES - A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure. | 08-15-2013 |
20130235890 | TUNABLE HYBRID LASER WITH CARRIER-INDUCED PHASE CONTROL - A tunable laser includes a substrate comprising a silicon material, a gain medium coupled to the substrate, wherein the gain medium includes a compound semiconductor material, and a waveguide disposed in the substrate and optically coupled to the gain medium. The tunable laser also includes a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate and a carrier-based phase modulator optically coupled to the first wavelength selective element. The tunable laser further includes a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate, an optical coupler disposed in the substrate and optically coupled to the first wavelength selective element, the second wavelength selective element, and the waveguide, and an output mirror. | 09-12-2013 |
20130243362 | TUNABLE REFLECTORS BASED ON MULTI-CAVITY INTERFERENCE - A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structures further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors. | 09-19-2013 |
20130301975 | HYBRID OPTICAL MODULATOR - An optical modulator includes an input port, a first waveguide region comprising silicon and optically coupled to the input port, and a waveguide splitter optically coupled to the first waveguide region and having a first output and a second output. The optical modulator also includes a first phase adjustment section optically coupled to the first output and comprising a first III-V diode and a second phase adjustment section optically coupled to the second output and comprising a second III-V diode. The optical modulator further includes a waveguide coupler optically coupled to the first phase adjustment section and the second phase adjustment section, a second waveguide region comprising silicon and optically coupled to the waveguide coupler, and an output port optically coupled to the second waveguide region. | 11-14-2013 |
20140037286 | METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS - A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power. | 02-06-2014 |
20140043050 | METHOD AND SYSTEM FOR PERFORMING TESTING OF PHOTONIC DEVICES - A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide. | 02-13-2014 |
20140112669 | INTEGRATED OPTICAL NETWORK UNIT - An optical network unit includes a transmit/receive port and a silicon waveguide optically coupled to the transmit/receive port. The optical network unit also includes a tunable filter coupled to the silicon waveguide and providing a first output for a first frequency band and a second output for a second frequency band. The optical network unit further includes a polarization diverse receiver coupled to the tunable filter and a laser coupled to the tunable filter. | 04-24-2014 |
20140179036 | METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION - A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector. | 06-26-2014 |
20140319656 | METHOD AND SYSTEM FOR HEIGHT REGISTRATION DURING CHIP BONDING - A method of fabricating a composite semiconductor structure is provided. Pedestals are formed in a recess of a first substrate. A second substrate is then placed within the recess in contact with the pedestals. The pedestals have a predetermined height so that a device layer within the second substrate aligns with a waveguide of the first substrate, where the waveguide extends from an inner wall of the recess. | 10-30-2014 |
20140342500 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING - A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure. | 11-20-2014 |
20150097210 | COPLANAR INTEGRATION OF A DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE - A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed. | 04-09-2015 |
20150097211 | STRUCTURES FOR BONDING A DIRECT-BANDGAP CHIP TO A SILICON PHOTONIC DEVICE - A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path. | 04-09-2015 |
20150098676 | INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE - A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform. | 04-09-2015 |
20150099318 | PROCESSING OF A DIRECT-BANDGAP CHIP AFTER BONDING TO A SILICON PHOTONIC DEVICE - A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon. | 04-09-2015 |
20150123157 | VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES - A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure. | 05-07-2015 |
20150139256 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER - A cable television transmitter includes a substrate including a silicon material, control electronics disposed in the substrate, and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The cable television transmitter also includes an optical modulator optically coupled to the gain medium and electrically coupled to the control electronics, a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The cable television transmitter further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 05-21-2015 |
20150331184 | TUNABLE REFLECTORS BASED ON MULTI-CAVITY INTERFERENCE - A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structures further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors. | 11-19-2015 |
20150378097 | INTEGRATED WAVEGUIDE COUPLER - A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction. | 12-31-2015 |
Patent application number | Description | Published |
20080258735 | Non-Metallic Flow-Through Electrodeless Conductivity Sensor and Leak Detector - A non metallic flow through electrodeless conductivity sensor is provided with a conduit having primary and secondary process fluid flowpaths to form a fluid loop. At least one drive and one sense toroid surround the conduit on the fluid loop. Voltage supplied to the drive toroid induces a current in the sense toroid via the fluid loop to eliminate any need for metallic electrodes in contact with the process fluid. At least one additional drive and/or sense toroid is disposed on the fluid loop to enhance induction. Optionally one or more sense coils are disposed about the conduit outside of the fluid loop to cancel out stray electrical noise. An optional conductor disposed along the conduit detects any fluid leakage through changes in resistance thereof. | 10-23-2008 |
20100156427 | Non-Metallic Flow-Through Electrodeless Conductivity Sensor and Leak Detector - A non metallic flow through electrodeless conductivity sensor is provided with a conduit having primary and secondary process fluid flowpaths to form a fluid loop. At least one drive and one sense toroid surround the conduit on the fluid loop. Voltage supplied to the drive toroid induces a current in the sense toroid via the fluid loop to eliminate any need for metallic electrodes in contact with the process fluid. At least one additional drive and/or sense toroid is disposed on the fluid loop to enhance induction. Optionally one or more sense coils are disposed about the conduit outside of the fluid loop to cancel out stray electrical noise. An optional conductor disposed along the conduit detects any fluid leakage through changes in resistance thereof. | 06-24-2010 |
20110048942 | Adjustable, Retractable Probe Insertion Assembly - An adjustable insertion assembly for an electrochemical sensor includes an electrode holder to receive the sensor, having a distal aperture to permit process fluid to contact the sensor. A receptacle slidably receives the holder, for a sliding range of motion extending from fully inserted to fully retracted positions. An open distal end portion of the receptacle extends through a wall of a process fluid vessel, so that the aperture is open to the process fluid when fully inserted, and closed when fully retracted. A leverage member is releasably movable relative to the receptacle, and moves with a captured extension. An abutment of the receptacle engages the extension so that movement of the leverage member in opposite directions alternately clamps and releases the electrode holder relative to the receptacle to substantially prevent and permit movement at substantially any point within the range of movement. | 03-03-2011 |
20110048971 | ROBUST POTENTIOMETRIC SENSOR - A modular potentiometric sensor includes a housing having measuring and reference half-cells, a temperature sensor, and solution ground combination assembly. An electrical conductor of the combination assembly extends through the housing, while remaining electrically isolated from the housing and half-cells, terminating at an electrically and thermally conductive end cap. Seals at opposite ends of the housing permit portions of the half-cells and the combination assembly to extend therethrough. The seals, measuring half-cell, and the combination assembly define an electrolyte compartment for the reference half-cell. The end cap provides close thermal coupling to the test fluid while also serving as a test fluid ground that is electrically isolated from the electrolyte compartment. The housing, measuring half-cell, reference half-cell, and combination assembly are modular, with the measurement sensor configurable in a plurality of lengths by altering the length of the housing independently of the half-cells and combination assembly. | 03-03-2011 |
20140090978 | POTENTIOMETRIC SENSOR - A potentiometric sensor includes an elongate non-glass, non-metal housing having opposite first and second longitudinal ends and a length extending between the first and second longitudinal ends. The housing defines a lumen extending along the length of the housing. A measuring half-cell assembly is received in the lumen of the housing and secured to the housing. The measuring half-cell assembly includes a glass body having opposite first and second longitudinal ends and a length extending between the first and second ends of the glass body. The second longitudinal end of the glass body is adjacent the second longitudinal end of the housing and a longitudinal extent of the glass body is less than the length of the housing. | 04-03-2014 |
20150323356 | MULTIVARIABLE VORTEX FLOWMETER - A sensor assembly for a vortex flowmeter having a flowtube, a bluff body in the flowtube, and a sensor that detects vortices. The sensor assembly extends into contact with the process fluid through a process penetration opening. A sensor body seals the process penetration opening to limit flow of process fluid out of the flowmeter through the process penetration opening. A vortex sensor housing is secured to the sensor body. The vortex sensor housing has a pair of pressure-responsive diaphragms facing outwardly from opposite sides of the vortex sensor housing. A vortex sensor is positioned to detect motion of at least one of the pressure-responsive diaphragms to detect vortices formed in the process fluid. A temperature sensor senses a temperature of the process fluid. | 11-12-2015 |