Patent application number | Description | Published |
20090071710 | Flip-Chip Component and Method for its Production - The electrical and mechanical connection between a component chip and a carrier substrate having electrical wiring is realized by means of bumps. A support frame that is adapted in its height to the height of the bumps is arranged between the carrier substrate and the component chip and has a planar or planarized surface, so that it contacts closely to the bottom side of the component chip. Different covers are proposed for the additional encapsulation. | 03-19-2009 |
20090104415 | Element with Optical Marking, Manufacturing Method, and Use - A layer combination with a marking is proposed, for example, for a miniaturized electrical component. The layer combination includes a first layer and a different release layer, which is applied on it, on which a pattern is formed by a released pattern-like area. The release area is formed from an inorganic, semiconducting, insulating material, where the pattern produced thereon is machine-readable. | 04-23-2009 |
20100127377 | Method for Producing a MEMS Package - A carrier substrate has a mounting location with a number of electrical connection pads on a top side and external contacts connected thereto on an underside. A metal frame encloses the connection pads of the mounting location. A MEMS chip has electrical contacts on an underside. The MEMS chip is placed on the mounting location of the carrier substrate in such a way that the MEMS chip is seated with an edge region of its underside on the metal frame. Using a flip-chip process, the electrical contacts of the MEMS chip are connected to the connection pads of the carrier substrate by means of bumps the metal frame is connected to the MEMS chip such that a closed cavity is formed between MEMS chip and carrier substrate. | 05-27-2010 |
20100148285 | MEMS Component and Method for Production - A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip. | 06-17-2010 |
20110114355 | HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTURING METHOD | 05-19-2011 |
20110233690 | SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING METHOD - On a carrier ( | 09-29-2011 |
20120061778 | Method and Apparatus for Producing Chip Devices, and Chip Device Produced by Means of the Method - A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method. | 03-15-2012 |
20120159778 | Method for Connecting a Plurality of Unpackaged Substrates - A plurality of unpackaged substrates connected to one another is disclosed. The stepped structures on and/or in a first main area of a first substrate include a plurality of integrated circuits. The stepped structures run between the integrated circuits. The first conductor tracks extend from at least some contact connections of the respective integrated circuits as far as the stepped structures. The first substrate is connected on the side of the first main area to a further substrate. The first substrate is severed from a second main area opposite to the first main area such that the first substrate is divided into a plurality of substrate pieces. Each substrate piece has one of the integrated circuits. The first conductor tracks are accessible in interspaces between the substrate pieces. The second conductor tracks are formed from the second main area. At least some of the second conductor tracks lead from the second main area over side walls of the substrate pieces as far as the first conductor tracks. | 06-28-2012 |
20130140656 | MEMS Microphone And Method For Producing The MEMS Microphone - The invention relates to a method for producing a microphone, in which a transducer element (WE) is mounted on a carrier (TR); a cover is arranged over the transducer element (WE) and the carrier (TR) such that the transducer element (WE) is enclosed between the cover and the carrier (TR); a first sound inlet opening (SO | 06-06-2013 |
20130214405 | Component and Method for Producing a Component - A component includes a substrate, a chip and a frame. The frame is bonded to the substrate and the chip rests on the frame. A sealing layer on parts of the frame and the chip is designed to hermetically seal a volume enclosed by the substrate, the chip and the metal frame. | 08-22-2013 |
20140111062 | Wafer-Level Package and Method for Production Thereof - A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers. | 04-24-2014 |
Patent application number | Description | Published |
20100061621 | Method and device for generating digital still pictures of wafer-shaped elements during a production process - A method and device generate digital still pictures of wafer-shaped elements, such as wafers or solar cells, which are transported in series on a conveyor belt during a production process. The device has a camera taking pictures of the wafer-shaped elements in sections step-by-step, in particular continuously taking digital pictures line-by-line (linear scanning) transverse to the transport direction, and then sampling the recorded image data. The device also includes a hardware-based image data processing unit, e.g. FPGA, for detecting edges of the wafer-shaped elements that indicate a beginning or an end of each of the wafer-shaped elements. The edge detection is for controlling the generation of the digital still pictures for visual inspection to find defective areas of the elements. | 03-11-2010 |
20120307236 | METHOD AND DEVICE FOR DETECTING CRACKS IN SEMICONDUCTOR SUBSTRATES - The invention relates to a method and an apparatus for detecting cracks in semiconductor substrates, such as silicon wafers and solar cells. The method and apparatus are based on the detection of light deflected at a crack. | 12-06-2012 |
20140347664 | APPARATUS AND METHOD FOR IDENTIFYING DEFECTS WITHIN THE VOLUME OF A TRANSPARENT SHEET AND USE OF THE APPARATUS - An apparatus for identifying defects within the volume of a transparent sheet, such as a glass sheet, is provided. The apparatus includes an illumination device that directs incident light onto at least a portion of a surface of the sheet so as to illuminate the sheet, and an image detector onto which the light backscattered from the sheet is directed to image the sheet. The apparatus generates at least two interference images under different capturing conditions in order to perform identification of defects by evaluating the at least two interference images. | 11-27-2014 |
Patent application number | Description | Published |
20100132828 | Spherical Filling Body - The invention relates to the production of a spherical, hollow filling body for filling containers for flammable and inflammable liquids or gases, as well as to methods for its particularly advantageous uses, e.g. for preventing explosion-type burning processes and explosions, for extinguishing fires, as a corrosion protection in tank containers, for separation of fuels and water, as a protection against bacteria and fungi in fuel tanks, as an anti-theft protection, for reducing carbon-hydrogen emissions, for increasing stability and crash safety of tank containers, for reducing the boil-off effect of hydrogen, for applications in chemical industry, for dissipating static electricity from fuel containers, for protecting against electromagnetic disturbances, for reducing and delaying the BLEVE effect, for increasing the filling capacity of gas containers, for heating and cooling liquids and gases, as well as for reducing the vaporization loss. Furthermore, the invention relates to methods of producing the filling bodies. FIG. | 06-03-2010 |