Patent application number | Description | Published |
20100002543 | Micromechanical Structure for Receiving and/or Generating Acoustic Signals, Method for Producing a Micromechnical Structure, and Use of a Micromechanical Structure - A micromechanical structure and a method for producing a micromechanical structure are provided, the micromechanical structure being configured for receiving and/or generating acoustic signals in a medium at least partially surrounding the structure. The structure includes a first counterelement that has first openings and essentially forms a first side of the structure, a second counterelement that has second openings and essentially forms a second side of the structure, and an essentially closed diaphragm disposed between the first counterelement and the second counterelement. | 01-07-2010 |
20110079081 | Manufacturing method for a micromechanical component and micromechanical component - A manufacturing method for a micromechanical component having the following steps: at least partially covering a first side of a substrate using a first insulating layer, forming at least one actuator plate electrode, at least one contact terminal, and at least one spring component from at least one first conductive material, covering at least the at least one actuator plate electrode, the at least one contact terminal, and the at least one spring component using a second insulating layer, forming at least one stator plate electrode from at least one second conductive material, forming at least one first trench in the substrate for producing a displaceable mass and a frame of a mounting, etching being performed in a first direction, and removing at least one partial mass of the second insulating layer, which is between the at least one actuator plate electrode and the at least one stator plate electrode, etching being performed in a second direction. Also described is a related micromechanical component. | 04-07-2011 |
20110198713 | MICROMECHANICAL COMPONENT HAVING A REAR VOLUME - In a method for manufacturing a micromechanical component, a cavity is produced in the substrate from an opening at the rear of a monocrystalline semiconductor substrate. The etching process used for this purpose and the monocrystalline semiconductor substrate used are controlled in such a way that a largely rectangular cavity is formed. | 08-18-2011 |
20110301897 | CALIBRATION OF A TRIAXIAL MAGNETIC FIELD SENSOR - A method for calibrating a triaxial magnetic field sensor includes steps for determining an offset of recorded measured values of the magnetic field sensor using a superposed signal and for determining the sensitivity of the magnetic field sensor along the first measuring axes. The determination of the sensitivity includes steps for determining the sensitivity of the magnetic field sensor along a first measuring axis and for determining the sensitivity of the magnetic field sensor along the other measuring axes based on the sensitivity of the first measuring axis and the determined offset. | 12-08-2011 |
20120126352 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS, MOUNTING METHOD AND SEMICONDUCTOR CHIP FOR VERTICAL MOUNTING ONTO CIRCUIT SUBSTRATES - A semiconductor chip having contact surfaces on an upper side parallel to the wafer plane has terminal pads on a terminal-pad side perpendicular to the upper side, each terminal pad being conductively connected to an assigned contact surface. This allows vertical mounting of the chip on a substrate and contacting with the aid of customary bonding techniques. A manufacturing method and two mounting methods are described. | 05-24-2012 |
20120182010 | MAGNETIC FIELD SENSOR - A magnetic field sensor for measuring a magnetic field at a sensor location has a printed circuit board, including electrically insulating material; a magnetic field sensor element situated on the printed circuit board and connected via electrical contacts to first printed conductors provided on the printed circuit board; and at least one second printed conductor for generating a test magnetic field, the second printed conductor being provided on the printed circuit board and generating a predetermined test magnetic field when a calibration current is applied at the sensor location. | 07-19-2012 |
20120313638 | MAGNETIC FIELD SENSOR - A magnetic field sensor includes a magnetizable core having a curved surface at least sectionally, a magnetization device for magnetizing the core, and a determination device for determining a magnetic field in the core. | 12-13-2012 |
20130320969 | MAGNETIC FIELD SENSOR - A magnetic field sensor having a first magnetic sensor core for measuring a magnetic field in a first measuring direction, and a second magnetic sensor core for measuring a magnetic field in a second measuring direction, the first and second magnetic sensor cores having a shared magnetic anisotropy. | 12-05-2013 |
20140077796 | APPARATUS AND METHOD FOR MEASURING MAGNETIC FIELDS - An apparatus for measuring a magnetic field is described, which comprises a core and an exciter coil for remagnetizing the core material. The remagnetizable core material is embodied as a layer or as multiple layers disposed at a distance from one another, and the core has a maximum total extension G where 2.5 mm≧G≧0.2 mm, a ratio of length to width that is greater than or equal to a value of twenty, and a thickness D where 2 μm≧D≧0.2 μm. Also described is a corresponding method for measuring a magnetic field. | 03-20-2014 |