Ssu-Yuan
Ssu-Yuan Weng, Taipei Hsien TW
Patent application number | Description | Published |
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20100301374 | LED PACKAGE STRUCTURE - An LED package structure includes a lead frame, an LED chip disposed on the lead frame, a fuse disposed on the lead frame and electrically connected to the lead frame, and an encapsulation. The fuse is electrically connected to the LED chip in series. | 12-02-2010 |
Ssu-Yuan Weng, Tucheng City TW
Patent application number | Description | Published |
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20100193802 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method for manufacturing a semiconductor device is provided. The method includes steps of forming a semiconductor element layer on a first substrate; bonding a second substrate to the semiconductor element layer; and replacing the first substrate with a combining substrate, wherein the combining substrate has a thermal conductivity larger than that of the first substrate. | 08-05-2010 |
Ssu-Yuan Weng, Tu Chen City TW
Patent application number | Description | Published |
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20080283856 | Light-emitting diode module and the manufacturing thereof - A method for manufacturing a light-emitting diode (LED) module is provided. Plural LED package structures are formed on a substrate first. A space is located between two adjacent LED package structures. A Lens laminated plate is subsequently bonded to the LED package structures. The lens laminated plate includes plural lenses, and each lens is located right above a LED of each LED package structure. Finally, plural LED modules are formed by cutting the substrate along the space. A LED module structure is also disclosed. | 11-20-2008 |