Patent application number | Description | Published |
20110268085 | LTE FORWARD HANDOVER - Techniques for performing forward handover in a wireless communication system are disclosed. In one aspect, a user equipment (UE) transmits a connection request to a target eNodeB. The connection request may be transmitted when the UE detects a connection failure in a communication with a source eNodeB. The UE receives a connection response from the target eNodeB in response to the target eNodeB requesting handover preparation information from the source eNodeB. In another aspect, a target eNodeB may receive a connection request from a user equipment (UE) and transmit a radio link failure (RLF) recovery request message to a source eNodeB to prompt the source eNodeB to initiate handover of the UE from the source eNodeB. | 11-03-2011 |
20120243480 | METHOD AND APPARATUS FOR BANDWIDTH REQUEST/GRANT PROTOCOLS IN A WIRELESS COMMUNICATION SYSTEM - A method and apparatus for allocating bandwidth in a broadband wireless communication system is disclosed. One embodiment uses a self-correcting bandwidth request/grant protocol. The self-correcting bandwidth request/grant protocol utilizes a combination of incremental and aggregate bandwidth requests. CPEs primarily transmit incremental bandwidth requests to their associated base stations, followed by periodic transmissions of aggregate bandwidth requests. The use of periodic aggregate bandwidth requests (that express the current state of their respective connection queues) allows the bandwidth allocation method and apparatus to be “self-correcting”. Another embodiment utilizes an abridged bandwidth request/grant protocol to allocate bandwidth. The abridged bandwidth request/grant protocol system utilizes padding packets to request a reduction in bandwidth allocation to a CPE. A base station modem alerts a base station CPU when the BS modem receives a padding packet from a CPE. After alerting the BS CPU the method can reduce the associated CPE's bandwidth allocation. | 09-27-2012 |
20130064097 | ADAPTIVE CALL ADMISSION CONTROL FOR USE IN A WIRELESS COMMUNICATION SYSTEM - The invention relates to communication systems and to systems and methods for implementing adaptive call admission control (CAC) in such systems. Adaptive call admission control can determine what CPE to base station calls (connections) are allowed at any given time. CAC, coupled with precedence, can further determine what connections are suspended if less bandwidth is available than is currently committed. Multiple techniques are disclosed to select connections for suspension. These techniques include suspending enough connections through the affected CPE until there is enough bandwidth to meet the remaining commitment, randomly (or in a round robin fashion) choosing connection to suspend from the entire set of connection, and using precedence priority levels. | 03-14-2013 |
20130258912 | METHOD AND APPARATUS FOR BANDWIDTH REQUEST/GRANT PROTOCOLS IN A WIRELESS COMMUNICATION SYSTEM - A method and apparatus for allocating bandwidth in a broadband wireless communication system is disclosed. One embodiment uses a self-correcting bandwidth request/grant protocol. The self-correcting bandwidth request/grant protocol utilizes a combination of incremental and aggregate bandwidth requests. CPEs primarily transmit incremental bandwidth requests to their associated base stations, followed by periodic transmissions of aggregate bandwidth requests. The use of periodic aggregate bandwidth requests (that express the current state of their respective connection queues) allows the bandwidth allocation method and apparatus to be “self-correcting”. Another embodiment utilizes an abridged bandwidth request/grant protocol to allocate bandwidth. The abridged bandwidth request/grant protocol system utilizes padding packets to request a reduction in bandwidth allocation to a CPE. A base station modem alerts a base station CPU when the BS modem receives a padding packet from a CPE. After alerting the BS CPU the method can reduce the associated CPE's bandwidth allocation. | 10-03-2013 |
Patent application number | Description | Published |
20100060304 | PROBE WITH PRINTED TIP - The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention. | 03-11-2010 |
20110121849 | PROBE WITH PRINTED TIP - The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention. | 05-26-2011 |
20120306522 | PROBING TIP FOR A SIGNAL ACQUISITION PROBE - A probing tip for a signal acquisition probe has a non-conductive substrate compatible with thin or thick film processing having opposing horizontal surfaces and side surfaces with two of the side surfaces converging to a point. A contoured probing tip contact is formed at the converging point on the non-conductive substrate with the probing tip contact having first and second intersecting arcuate surface. Electrically conductive material is deposited on the countered probing tip contact using thin or thick film processing for providing electrical contact to test points on a device under test. A resistive element is formed on the non-conductive substrate using thin film processing that is electrically coupled to the probing tip contact and to an input of an amplifier formed on an integrated circuit die mounted on the non-conductive substrate. The output of the amplifier is coupled to a transmission structure formed on a second non-conductive substrate. | 12-06-2012 |
20120313658 | Dual Probing Tip System - A dual probing tip system uses a slot and rail system to provide variable spacing and lateral and axial compliance of the probing tips mounted on first and second support members. A movable base member is secured on a frame with the base member having a rack of linear teeth and a pair of rails angled toward the front. First and second intermediate carriers each have a slot that engages one of the angled rails. Each of the carriers has stanchions that receive a thumb wheel pinion gear mounted on a shaft. The pinion gear mates with the teeth on the base member for movement of the carriers. Each support member has an axial slot that mated with an axial slot on each one of the carriers. Each support member has a compression spring which allows axial compliance of the support members. | 12-13-2012 |
20140053667 | Modular Probe Assembly Having Force Protection and Articulation - A modular probe assembly for a signal processing instrument has an elongate member extending from a first module of the probe assembly and a cavity recessed in a second module of the probe assembly. The cavity of the second module is structured to receive the elongate member of the first module. A module for the probe assembly may have a first articulating elongate member disposed at an end of a housing of the module. The elongate member extending from a first module of the probe assembly may be inserted into a cavity recessed in a second module, and the first module may be removably joined to the second module. | 02-27-2014 |