Patent application number | Description | Published |
20110143279 | RADIATION-SENSITIVE RESIN COMPOSITION - A radiation-sensitive resin composition includes a sulfonate or sulfonic acid group-containing photoacid generator and a resin. The sulfonate or sulfonic acid group-containing photoacid generator includes a partial structure shown by a following formula (1), | 06-16-2011 |
20110151378 | RADIATION-SENSITIVE RESIN COMPOSITION FOR LIQUID IMMERSION LITHOGRAPHY, POLYMER, AND RESIST PATTERN-FORMING METHOD - A radiation-sensitive resin composition for liquid immersion lithography includes a resin component, a photoacid generator and a solvent. The resin component includes an acid-dissociable group-containing resin in an amount of more than 50% by mass. The acid-dissociable group-containing resin includes a repeating unit that includes a fluorine atom and an acid-dissociable group in a side chain of the repeating unit. | 06-23-2011 |
20120065291 | RADIATION-SENSITIVE RESIN COMPOSITION, POLYMER, AND COMPOUND - A radiation-sensitive resin composition includes a first polymer including a repeating unit represented by a following formula (I). X | 03-15-2012 |
20130022926 | RADIATION-SENSITIVE RESIN COMPOSITION - A radiation-sensitive resin composition includes a polymer and a photoacid generator. The polymer includes a first structural unit shown by a formula (a1), a second structural unit shown by a formula (a2), and a third structural unit having a lactone structure. A content of the first structural unit in the polymer being 50 mol % or more based on total structural units included in the polymer. The first structural unit is preferably a structural unit shown by a formula (a1-1). | 01-24-2013 |
20130143160 | RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND POLYMER AND COMPOUND - A radiation-sensitive resin composition that provides a resist coating film in a liquid immersion lithography process is provided, the radiation-sensitive resin composition being capable of exhibiting a great dynamic contact angle during exposure, whereby the surface of the resist coating film can exhibit a superior water draining property, and the radiation-sensitive resin composition being capable of leading to a significant decrease in the dynamic contact angle during development, whereby generation of development defects can be inhibited, and further shortening of a time period required for change in a dynamic contact angle is enabled. A radiation-sensitive resin composition including (A) a polymer having a structural unit (I) represented by the following formula (1), and (B) a radiation-sensitive acid generator. | 06-06-2013 |
20140004463 | RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND POLYMER AND COMPOUND | 01-02-2014 |
Patent application number | Description | Published |
20120001309 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus according to aspects of the invention can include a metal base; resin case having a bonding plane facing metal base; a coating groove formed in bonding plane and holding adhesive for bonding resin case to metal base at a predetermined position, with the top plane of the wall that forms coating groove being spaced apart from the plane which contains bonding plane such that an escape space is formed between the metal base and the resin case; the escape space receiving the excess amount of adhesive which has flowed out from the coating groove; and a receiver groove communicating to the escape space and receiving securely the excess amount of adhesive which the escape space has failed to receive. If an excess amount of adhesive too much for the receiver groove to receive is coated, the excess amount of adhesive can be received in a stopper groove. | 01-05-2012 |
20120140420 | SEMICONDUCTOR MODULE AND HEAT RADIATION MEMBER - The characteristics of a heat radiation member used in a semiconductor module are improved. | 06-07-2012 |
20120181682 | SEMICONDUCTOR DEVICE - In some aspects of the invention, an insulating substrate fixed onto a metal base plate can include an insulating plate and metal foils. A semiconductor element can be disposed on each of the metal foils. External connection terminals can be fixed to a set of ends of terminal holders, respectively. The other ends of the terminal holders can be bonded to the metal foils, respectively. External connection terminals which are main terminals through which main current flows are disposed on a lid. By preparing a plurality of lids having different layouts of the external connection terminals, in which the external connection terminals are connected to the terminal holders in the resin case, respectively, and exchanging the lids, the positions of the external connection terminals can be easily changed. | 07-19-2012 |
20130200510 | SEMICONDUCTOR DEVICE, HEAT RADIATION MEMBER, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A semiconductor device has a substrate having a front surface, and a rear surface including a fin forming region and a peripheral region surrounding the fin forming region. An insulating substrate is disposed on the front surface of the substrate. A semiconductor chip is disposed on the insulating substrate. A plurality of fins is formed in the fin forming region, and a reinforcing member is formed on the substrate through a bonding member, so as to overlap the peripheral region. | 08-08-2013 |
20140246768 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device that improves noise performance includes a circuit substrate, an enclosing case, and a metal part. A control circuit is mounted on the front surface of the circuit substrate. The enclosing case is a resin case in which semiconductor elements are installed. The metal part, included inside the enclosing case, includes a first mounting portion, a second mounting portion, and a bus bar. The first mounting portion mounts the circuit substrate on the enclosing case, and is connected to a ground pattern of the circuit substrate when mounting. The second mounting portion mounts an external instrument on the enclosing case, and is grounded when mounting. The bus bar connects the first mounting portion and second mounting portion. | 09-04-2014 |
Patent application number | Description | Published |
20090096081 | Semiconductor device - A semiconductor device includes a substrate, at least one semiconductor element mounted on the substrate, a resin housing for housing the semiconductor element, the resin housing having a cover thereon, at least one pin provided and standing in the resin housing, and at least one printed substrate disposed inside the resin housing or outside the resin housing. The printed substrate and the cover of the resin housing are positioned by the pin. | 04-16-2009 |
20090140414 | Semiconductor device - A semiconductor device includes a resin case, a plurality of external connection terminals fixedly provided on the resin case, and at least one semiconductor element provided in the resin case. At least one terminal block has at least one wiring terminal for electrically connecting the semiconductor element and the external connection terminals. | 06-04-2009 |
20130267064 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device has a step of forming a first substrate; a step of facing a first main electrode to the first metal foil, and electrically connecting the first main electrode and the first metal foil; a step of facing a second main electrode to the second metal foil, and electrically connecting the second main electrode and the second metal foil; a step of forming a second substrate; and steps of facing a surface side of the second substrate to a surface side of the first substrate; electrically connecting the third metal foil and a third main electrode provided on a main surface of the first semiconductor element; and electrically connecting the fourth metal foil and a fourth main electrode provided on a main surface of the second semiconductor element. | 10-10-2013 |
20140084438 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - A semiconductor device has a plurality of electronic components mounted on an insulating substrate formed with a metal layer, and electrically connected to each other or to the metal layer; a positioning wire member having a predetermined diameter and a predetermined length, and bonded to each of the plurality of electronic components or to the metal layer; a lead frame disposed to bridge and electrically connect the plurality of electronic components to each other or between the metal layer and the electronic components; and an opening having a size capable of inserting the wire member therethrough formed to penetrate through the lead frame, to join the lead frame to each of the electronic components or the metal layer at a predetermined position therein. The lead frame is positioned on the insulating substrate by inserting the wire member into the opening. | 03-27-2014 |